JPS60227428A - チツプボンデイング装置 - Google Patents

チツプボンデイング装置

Info

Publication number
JPS60227428A
JPS60227428A JP8430084A JP8430084A JPS60227428A JP S60227428 A JPS60227428 A JP S60227428A JP 8430084 A JP8430084 A JP 8430084A JP 8430084 A JP8430084 A JP 8430084A JP S60227428 A JPS60227428 A JP S60227428A
Authority
JP
Japan
Prior art keywords
chip
dispenser
arm
bonding
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8430084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0548618B2 (enExample
Inventor
Yasuo Shimoda
下田　靖雄
Motohiko Kato
元彦 加藤
Takeshi Kimoto
木本　武
Eiji Sato
英治 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP8430084A priority Critical patent/JPS60227428A/ja
Publication of JPS60227428A publication Critical patent/JPS60227428A/ja
Publication of JPH0548618B2 publication Critical patent/JPH0548618B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP8430084A 1984-04-26 1984-04-26 チツプボンデイング装置 Granted JPS60227428A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8430084A JPS60227428A (ja) 1984-04-26 1984-04-26 チツプボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8430084A JPS60227428A (ja) 1984-04-26 1984-04-26 チツプボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60227428A true JPS60227428A (ja) 1985-11-12
JPH0548618B2 JPH0548618B2 (enExample) 1993-07-22

Family

ID=13826623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8430084A Granted JPS60227428A (ja) 1984-04-26 1984-04-26 チツプボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60227428A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100289257B1 (ko) * 1997-07-17 2001-06-01 후지야마 겐지 기판 이송 장치
US7278203B2 (en) 2003-02-07 2007-10-09 Hallys Corporation Random-period chip transfer apparatus
WO2011081093A1 (ja) * 2009-12-28 2011-07-07 東京エレクトロン株式会社 実装方法及び実装装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763835A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus
JPS57124446A (en) * 1981-01-26 1982-08-03 Mitsubishi Electric Corp Die bond apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763835A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus
JPS57124446A (en) * 1981-01-26 1982-08-03 Mitsubishi Electric Corp Die bond apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100289257B1 (ko) * 1997-07-17 2001-06-01 후지야마 겐지 기판 이송 장치
US7278203B2 (en) 2003-02-07 2007-10-09 Hallys Corporation Random-period chip transfer apparatus
WO2011081093A1 (ja) * 2009-12-28 2011-07-07 東京エレクトロン株式会社 実装方法及び実装装置
JP2011138901A (ja) * 2009-12-28 2011-07-14 Tokyo Electron Ltd 実装方法及び実装装置
CN102696098A (zh) * 2009-12-28 2012-09-26 东京毅力科创株式会社 安装方法和安装装置
KR101402378B1 (ko) * 2009-12-28 2014-06-03 도쿄엘렉트론가부시키가이샤 실장 방법 및 실장 장치
US8749068B2 (en) 2009-12-28 2014-06-10 Tokyo Electron Limited Mounting method and mounting device

Also Published As

Publication number Publication date
JPH0548618B2 (enExample) 1993-07-22

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