JPS60225461A - 半導体ｒａｍ装置の構造およびその製造方法 - Google Patents
半導体ｒａｍ装置の構造およびその製造方法Info
- Publication number
- JPS60225461A JPS60225461A JP59081170A JP8117084A JPS60225461A JP S60225461 A JPS60225461 A JP S60225461A JP 59081170 A JP59081170 A JP 59081170A JP 8117084 A JP8117084 A JP 8117084A JP S60225461 A JPS60225461 A JP S60225461A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- thickness
- groove
- capacitor
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 8
- 229920005591 polysilicon Polymers 0.000 claims description 13
- 239000003990 capacitor Substances 0.000 abstract description 23
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 230000010354 integration Effects 0.000 abstract description 5
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 5
- 229910021344 molybdenum silicide Inorganic materials 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003686 Davis oxidations reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59081170A JPS60225461A (ja) | 1984-04-24 | 1984-04-24 | 半導体ｒａｍ装置の構造およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59081170A JPS60225461A (ja) | 1984-04-24 | 1984-04-24 | 半導体ｒａｍ装置の構造およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60225461A true JPS60225461A (ja) | 1985-11-09 |
| JPH0556663B2 JPH0556663B2 (enrdf_load_stackoverflow) | 1993-08-20 |
Family
ID=13738981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59081170A Granted JPS60225461A (ja) | 1984-04-24 | 1984-04-24 | 半導体ｒａｍ装置の構造およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60225461A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63244662A (ja) * | 1987-03-30 | 1988-10-12 | Mitsubishi Electric Corp | 半導体装置 |
| US5250458A (en) * | 1987-02-25 | 1993-10-05 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing semiconductor memory device having stacked memory capacitors |
-
1984
- 1984-04-24 JP JP59081170A patent/JPS60225461A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5250458A (en) * | 1987-02-25 | 1993-10-05 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing semiconductor memory device having stacked memory capacitors |
| JPS63244662A (ja) * | 1987-03-30 | 1988-10-12 | Mitsubishi Electric Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0556663B2 (enrdf_load_stackoverflow) | 1993-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |