JPS6022348A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6022348A
JPS6022348A JP58130521A JP13052183A JPS6022348A JP S6022348 A JPS6022348 A JP S6022348A JP 58130521 A JP58130521 A JP 58130521A JP 13052183 A JP13052183 A JP 13052183A JP S6022348 A JPS6022348 A JP S6022348A
Authority
JP
Japan
Prior art keywords
insulating substrate
substrate
peripheral components
semiconductor device
connection terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58130521A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458189B2 (enExample
Inventor
Fumio Takeyama
竹山　文雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58130521A priority Critical patent/JPS6022348A/ja
Publication of JPS6022348A publication Critical patent/JPS6022348A/ja
Publication of JPH0458189B2 publication Critical patent/JPH0458189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/657—
    • H10W44/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/754—
JP58130521A 1983-07-18 1983-07-18 半導体装置 Granted JPS6022348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58130521A JPS6022348A (ja) 1983-07-18 1983-07-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58130521A JPS6022348A (ja) 1983-07-18 1983-07-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS6022348A true JPS6022348A (ja) 1985-02-04
JPH0458189B2 JPH0458189B2 (enExample) 1992-09-16

Family

ID=15036282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58130521A Granted JPS6022348A (ja) 1983-07-18 1983-07-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS6022348A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088574U (ja) * 1983-11-24 1985-06-18 日本電気株式会社 チツプキヤリア型パツケ−ジ接続構造
US5444296A (en) * 1993-11-22 1995-08-22 Sun Microsystems, Inc. Ball grid array packages for high speed applications
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5825084A (en) * 1996-08-22 1998-10-20 Express Packaging Systems, Inc. Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4814961U (enExample) * 1971-06-30 1973-02-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4814961U (enExample) * 1971-06-30 1973-02-20

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088574U (ja) * 1983-11-24 1985-06-18 日本電気株式会社 チツプキヤリア型パツケ−ジ接続構造
US5444296A (en) * 1993-11-22 1995-08-22 Sun Microsystems, Inc. Ball grid array packages for high speed applications
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5825084A (en) * 1996-08-22 1998-10-20 Express Packaging Systems, Inc. Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

Also Published As

Publication number Publication date
JPH0458189B2 (enExample) 1992-09-16

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