JPS60220711A - 半導体ウエハのスライス装置 - Google Patents
半導体ウエハのスライス装置Info
- Publication number
- JPS60220711A JPS60220711A JP7506484A JP7506484A JPS60220711A JP S60220711 A JPS60220711 A JP S60220711A JP 7506484 A JP7506484 A JP 7506484A JP 7506484 A JP7506484 A JP 7506484A JP S60220711 A JPS60220711 A JP S60220711A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- grinding wheel
- semiconductor wafer
- wafer
- wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 238000005520 cutting process Methods 0.000 claims description 36
- 230000005489 elastic deformation Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 18
- 238000010586 diagram Methods 0.000 description 11
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 7
- 239000012530 fluid Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7506484A JPS60220711A (ja) | 1984-04-16 | 1984-04-16 | 半導体ウエハのスライス装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7506484A JPS60220711A (ja) | 1984-04-16 | 1984-04-16 | 半導体ウエハのスライス装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60220711A true JPS60220711A (ja) | 1985-11-05 |
| JPH0462244B2 JPH0462244B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-10-05 |
Family
ID=13565397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7506484A Granted JPS60220711A (ja) | 1984-04-16 | 1984-04-16 | 半導体ウエハのスライス装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60220711A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007118581A (ja) * | 2005-09-28 | 2007-05-17 | Hiroshi Ishizuka | 硬脆性材料の薄板及びその製造方法 |
-
1984
- 1984-04-16 JP JP7506484A patent/JPS60220711A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007118581A (ja) * | 2005-09-28 | 2007-05-17 | Hiroshi Ishizuka | 硬脆性材料の薄板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0462244B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-10-05 |
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