JPH0462244B2 - - Google Patents

Info

Publication number
JPH0462244B2
JPH0462244B2 JP7506484A JP7506484A JPH0462244B2 JP H0462244 B2 JPH0462244 B2 JP H0462244B2 JP 7506484 A JP7506484 A JP 7506484A JP 7506484 A JP7506484 A JP 7506484A JP H0462244 B2 JPH0462244 B2 JP H0462244B2
Authority
JP
Japan
Prior art keywords
grinding wheel
cutting
wafer
wheel
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7506484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60220711A (ja
Inventor
Riichi Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Machinery Co Ltd
Original Assignee
Micron Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Machinery Co Ltd filed Critical Micron Machinery Co Ltd
Priority to JP7506484A priority Critical patent/JPS60220711A/ja
Publication of JPS60220711A publication Critical patent/JPS60220711A/ja
Publication of JPH0462244B2 publication Critical patent/JPH0462244B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP7506484A 1984-04-16 1984-04-16 半導体ウエハのスライス装置 Granted JPS60220711A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7506484A JPS60220711A (ja) 1984-04-16 1984-04-16 半導体ウエハのスライス装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7506484A JPS60220711A (ja) 1984-04-16 1984-04-16 半導体ウエハのスライス装置

Publications (2)

Publication Number Publication Date
JPS60220711A JPS60220711A (ja) 1985-11-05
JPH0462244B2 true JPH0462244B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-05

Family

ID=13565397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7506484A Granted JPS60220711A (ja) 1984-04-16 1984-04-16 半導体ウエハのスライス装置

Country Status (1)

Country Link
JP (1) JPS60220711A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007118581A (ja) * 2005-09-28 2007-05-17 Hiroshi Ishizuka 硬脆性材料の薄板及びその製造方法

Also Published As

Publication number Publication date
JPS60220711A (ja) 1985-11-05

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