JPS60220317A - Liquid crystal display element - Google Patents
Liquid crystal display elementInfo
- Publication number
- JPS60220317A JPS60220317A JP7648084A JP7648084A JPS60220317A JP S60220317 A JPS60220317 A JP S60220317A JP 7648084 A JP7648084 A JP 7648084A JP 7648084 A JP7648084 A JP 7648084A JP S60220317 A JPS60220317 A JP S60220317A
- Authority
- JP
- Japan
- Prior art keywords
- film
- liquid crystal
- wiring
- solder
- electrode substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は液晶表示素子に係り、特に液晶表示素子を構成
する一方の基板に金属膜配線をパターン形成し、この金
属配線上に液晶駆動用半導体チップを直接接続したチッ
プオン液晶表示素子蚤こ関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a liquid crystal display element, and in particular, metal film wiring is patterned on one substrate constituting the liquid crystal display element, and a liquid crystal driving semiconductor is formed on the metal wiring. This relates to chip-on liquid crystal display devices that have chips directly connected to them.
従来のチップオン液晶表示素子は第1図に示すような構
造よりなる。半田とぬれ性のよい金属を含む多層金属、
薄膜配線1を形成した下電極基板2上lこはシール剤3
を介して上電極基板4を固定し、下電極基板2と上電極
基板4間に液晶を封入して液晶セルを構成している。ま
た前記金属薄膜配線1上Iこは半田5を介して液晶駆動
用半導体チップ6を半田接続し、液晶駆動用半導体チッ
プ6及び金属薄膜配線1を外部環境から保護するため樹
脂コート7.8を形成している。A conventional chip-on liquid crystal display element has a structure as shown in FIG. Multilayer metals, including metals with good solder wettability,
A sealant 3 is applied on the lower electrode substrate 2 on which the thin film wiring 1 is formed.
The upper electrode substrate 4 is fixed through the upper electrode substrate 4, and a liquid crystal is sealed between the lower electrode substrate 2 and the upper electrode substrate 4 to form a liquid crystal cell. Further, a liquid crystal driving semiconductor chip 6 is soldered onto the metal thin film wiring 1 via solder 5, and a resin coat 7.8 is applied to protect the liquid crystal driving semiconductor chip 6 and metal thin film wiring 1 from the external environment. is forming.
しかしながら、かかる構造では、高温度環境下において
樹脂コート?、EHこよる吸湿及び下電極基板2と樹脂
コート7.8との界面剥れにより、異なる金属薄膜配線
1間に水膜が発生し、金属薄膜配線2の腐蝕及び通電時
の電気化学反応lこよる断線、金属析出物による線間タ
ッチが起り、表示不能となることがある。However, with such a structure, is it possible to coat the resin in a high temperature environment? Due to moisture absorption caused by EH and peeling of the interface between the lower electrode substrate 2 and the resin coat 7.8, a water film is generated between the different metal thin film wirings 1, resulting in corrosion of the metal thin film wiring 2 and electrochemical reaction during energization. This may cause disconnection or touch between lines due to metal deposits, making it impossible to display.
本発明の目的は、高温度環境下において耐湿信頼性に優
れた液晶表示素子を提供することにある。An object of the present invention is to provide a liquid crystal display element with excellent moisture resistance and reliability in a high temperature environment.
本発明は上記目的を達成するため1こ、液晶表示素子を
構成する一方の基板fこ金属薄膜配線をパターン形成し
、この金属薄膜配線上に液晶駆動用半導体チップを直接
接続してなる液晶表示素子において、前記金属薄膜配線
上に、保護膜として無機膜を形成したことを特徴とする
。In order to achieve the above objects, the present invention has the following features: (1) A liquid crystal display is produced by patterning metal thin film wiring on one substrate f constituting a liquid crystal display element, and directly connecting a semiconductor chip for driving a liquid crystal onto the metal thin film wiring. The element is characterized in that an inorganic film is formed as a protective film on the metal thin film wiring.
以下、本発明の一実施例を第2図及び第3図により説明
する。透明導電膜10により点灯図形をパターン形成し
た下電極基板11に、この基板11の材質であるガラス
と密着性の良いNiCr膜12を一部が透明導電膜10
に接続するように形成し、その上lこ半田とぬれ性の良
いCu膜13を形成し、ホトエツチングにより配線パタ
ーン形成グを行なって2層膜配線14を形成する。次に
2層膜配線14の表面及び側面全体をカバーするよりに
5102、S iN 、 k120.などの無機膜15
を蒸着などの方法により形成し、その後半田16が接続
される部分tこスルホールを設ける。次にシール剤17
を介して上電極基板18を下電極基板11十tこ固定し
、下電極基板11と上電極基板18間−と液晶を封入し
て液晶セルを組立る。その後半田16を介して液晶駆動
用半導体チップ19を前記2層膜配線14に半田接続す
る。前記無機膜15は半田16がCu膜13中をぬれ広
がるのを防ぐ半田ダムとしての機能も有し、半田接続形
状を一定にする。次fこ半田接続された液晶駆動用半導
体チップ19を保護するために、通常半導体累子のパ゛
ソヶージとして用いられている樹脂コー)20を形成す
る。An embodiment of the present invention will be described below with reference to FIGS. 2 and 3. A portion of the transparent conductive film 10 is coated with a NiCr film 12 that has good adhesion to glass, which is the material of this substrate 11, on a lower electrode substrate 11 on which a lighting pattern is patterned using a transparent conductive film 10.
A Cu film 13 having good wettability with solder is formed thereon, and a wiring pattern is formed by photo-etching to form a two-layer film wiring 14. Next, to cover the entire surface and side surfaces of the two-layer film wiring 14, 5102, SiN, k120. Inorganic membranes such as 15
is formed by a method such as vapor deposition, and a through hole is provided in the portion t to which the solder 16 is connected. Next, sealant 17
The upper electrode substrate 18 is fixed to the lower electrode substrate 11 via the upper electrode substrate 11, and a liquid crystal is sealed between the lower electrode substrate 11 and the upper electrode substrate 18 to assemble a liquid crystal cell. After that, the liquid crystal driving semiconductor chip 19 is soldered to the two-layer film wiring 14 via the solder 16 . The inorganic film 15 also functions as a solder dam that prevents the solder 16 from spreading through the Cu film 13, and makes the solder connection shape constant. Next, in order to protect the liquid crystal driving semiconductor chip 19 connected by soldering, a resin coat 20, which is usually used as a resin cage for semiconductor components, is formed.
このよう]こ、下電極基板ll上に形成された金属薄膜
配線(2層膜配線)14の保護膜として、耐湿性fこ優
れた無機膜15を形成してなるので、高湿度環境下lこ
おいて耐湿信頼性lこ優れたチップオン液晶表示素子が
得られる。In this way, since the inorganic film 15 with excellent moisture resistance is formed as a protective film for the metal thin film wiring (two-layer film wiring) 14 formed on the lower electrode substrate 11, it can be used in a high humidity environment. In this way, a chip-on liquid crystal display element having excellent moisture resistance and reliability can be obtained.
なお、耐湿性をさら1こ強化するには、2層膜配線14
を構成するCu膜13の代りに電気化学的に責な金属で
あるAu膜としてもよい。In addition, in order to further strengthen the moisture resistance, the two-layer film wiring 14
Instead of the Cu film 13 constituting the structure, an Au film, which is an electrochemically sensitive metal, may be used.
以上の説明から明らかな如く、本発明fとよれば、液晶
表示素子を構成する一方の基板lと金属薄膜配線をパタ
ーン形成し、この金属薄膜配線上に液晶駆動用半導体チ
ップを直接接続してなるチップオン液晶表示素子fこお
いて、前記金属薄膜配線上に保穫膜として無機膜を形成
してなるので、高湿度環境下において耐湿信頼性に優れ
たチップオン液晶表示素子が得られる。As is clear from the above description, according to the present invention f, one substrate l constituting a liquid crystal display element and metal thin film wiring are patterned, and a liquid crystal driving semiconductor chip is directly connected to the metal thin film wiring. In this chip-on liquid crystal display element f, since an inorganic film is formed as a protection film on the metal thin film wiring, a chip-on liquid crystal display element having excellent moisture resistance reliability in a high humidity environment can be obtained.
第1図は従来のチップオン液晶表示素子の概略断面図、
第2図は本発明になるチップオン液晶表示素子の一実施
例を示す概略断面図、第3図は第2図の液晶駆動用半導
体チップ接続部の拡大断面図である。
11・・・下電極基板、 14・・・2層膜配線、15
・・・無機膜、 19・・・液晶駆動用半導体チップ。
第1図
第2図
第3図
1) 11Figure 1 is a schematic cross-sectional view of a conventional chip-on liquid crystal display element.
FIG. 2 is a schematic cross-sectional view showing an embodiment of the chip-on liquid crystal display element according to the present invention, and FIG. 3 is an enlarged cross-sectional view of the connecting portion of the semiconductor chip for driving the liquid crystal shown in FIG. 11... Lower electrode substrate, 14... Two-layer film wiring, 15
...Inorganic film, 19...Semiconductor chip for liquid crystal drive. Figure 1 Figure 2 Figure 3 Figure 1) 11
Claims (1)
パターン形成し、この金属薄膜配線上に液晶駆動用半導
体チップを直接接続してなるチップオン液晶表示素子に
おいて、前記金属薄膜配線上に保護膜として無機膜を形
成したことを特徴とする液晶表示素子。In a chip-on liquid crystal display element in which a metal thin film wiring is patterned on one substrate constituting the liquid crystal display element and a liquid crystal driving semiconductor chip is directly connected to the metal thin film wiring, a protective layer is provided on the metal thin film wiring. A liquid crystal display element characterized by forming an inorganic film as a film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7648084A JPS60220317A (en) | 1984-04-18 | 1984-04-18 | Liquid crystal display element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7648084A JPS60220317A (en) | 1984-04-18 | 1984-04-18 | Liquid crystal display element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60220317A true JPS60220317A (en) | 1985-11-05 |
Family
ID=13606354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7648084A Pending JPS60220317A (en) | 1984-04-18 | 1984-04-18 | Liquid crystal display element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60220317A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62187325A (en) * | 1986-02-14 | 1987-08-15 | Hitachi Ltd | Liquid crystal display element |
JPS63125826U (en) * | 1987-02-10 | 1988-08-17 | ||
JPS63229431A (en) * | 1987-03-18 | 1988-09-26 | Hitachi Ltd | Liquid crystal display panel and its production |
US4826297A (en) * | 1985-12-25 | 1989-05-02 | Hitachi, Ltd. | Liquid crystal display device having an extention metal film wiring which is covered by polyimide layer having low viscosity under 1.0 poise before curing |
JPH01130411A (en) * | 1987-11-16 | 1989-05-23 | Mitsubishi Metal Corp | Protective film for transparent conductive film |
US4906071A (en) * | 1987-03-31 | 1990-03-06 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal display device and video projector incorporating same with particular driving circuit connection scheme |
EP0543635A2 (en) * | 1991-11-18 | 1993-05-26 | Sharp Kabushiki Kaisha | A method for mounting a wiring board on a liquid crystal display substrate |
EP1077389A1 (en) * | 1999-03-08 | 2001-02-21 | Seiko Epson Corporation | Liquid crystal device and its production method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5870212A (en) * | 1981-09-26 | 1983-04-26 | フアオ・デ−・オ−・ア−ドルフ・シントリング・アクチエンゲゼルシヤフト | Optoelectronic display element and manufacture thereof |
-
1984
- 1984-04-18 JP JP7648084A patent/JPS60220317A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5870212A (en) * | 1981-09-26 | 1983-04-26 | フアオ・デ−・オ−・ア−ドルフ・シントリング・アクチエンゲゼルシヤフト | Optoelectronic display element and manufacture thereof |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4826297A (en) * | 1985-12-25 | 1989-05-02 | Hitachi, Ltd. | Liquid crystal display device having an extention metal film wiring which is covered by polyimide layer having low viscosity under 1.0 poise before curing |
JPS62187325A (en) * | 1986-02-14 | 1987-08-15 | Hitachi Ltd | Liquid crystal display element |
JPS63125826U (en) * | 1987-02-10 | 1988-08-17 | ||
JPS63229431A (en) * | 1987-03-18 | 1988-09-26 | Hitachi Ltd | Liquid crystal display panel and its production |
JPH0827461B2 (en) * | 1987-03-18 | 1996-03-21 | 株式会社日立製作所 | Liquid crystal display panel and manufacturing method thereof |
US4906071A (en) * | 1987-03-31 | 1990-03-06 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal display device and video projector incorporating same with particular driving circuit connection scheme |
JPH01130411A (en) * | 1987-11-16 | 1989-05-23 | Mitsubishi Metal Corp | Protective film for transparent conductive film |
EP0543635A2 (en) * | 1991-11-18 | 1993-05-26 | Sharp Kabushiki Kaisha | A method for mounting a wiring board on a liquid crystal display substrate |
US5290197A (en) * | 1991-11-18 | 1994-03-01 | Sharp Kabushiki Kaisha | Method for mounting a wiring board on a liquid crystal display substrate |
EP1077389A1 (en) * | 1999-03-08 | 2001-02-21 | Seiko Epson Corporation | Liquid crystal device and its production method |
EP1077389A4 (en) * | 1999-03-08 | 2004-11-10 | Seiko Epson Corp | Liquid crystal device and its production method |
US6894758B1 (en) | 1999-03-08 | 2005-05-17 | Seiko Epson Corporation | Liquid crystal device and manufacturing method thereof |
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