JPH05283853A - Printed-circuit board - Google Patents
Printed-circuit boardInfo
- Publication number
- JPH05283853A JPH05283853A JP10903792A JP10903792A JPH05283853A JP H05283853 A JPH05283853 A JP H05283853A JP 10903792 A JP10903792 A JP 10903792A JP 10903792 A JP10903792 A JP 10903792A JP H05283853 A JPH05283853 A JP H05283853A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pads
- pad
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント回路基板の改良
に関するものである。FIELD OF THE INVENTION The present invention relates to improvements in printed circuit boards.
【０００２】[0002]
【従来の技術】プリント回路基板に電子部品を実装する
場合には、プリント回路基板のパッドに半田をコーティ
ングし、その上に電子部品のリードを載置した後、加熱
してリードをパッドに半田付けする。この場合、パッド
にコーティングする半田の量が多すぎるとブリッジが発
生しやすくなり、少なすぎると接続信頼性が低下する。
このため通常は、適正な半田の量を予め計算で求め、そ
の量をパッド上にコーティングするようにしている。2. Description of the Related Art When mounting electronic parts on a printed circuit board, the pads of the printed circuit board are coated with solder, the leads of the electronic parts are placed on the pads, and then the leads are soldered to the pads by heating. Attach. In this case, if the amount of solder coated on the pad is too large, bridging is likely to occur, and if it is too small, the connection reliability deteriorates.
Therefore, normally, an appropriate amount of solder is calculated in advance, and the amount is coated on the pad.
【０００３】[0003]
【発明が解決しようとする課題】半田のコーティングは
一般的にはスクリーン印刷法により行われている。この
方法は、パッドの部分だけ穴のあいたスクリーンをプリ
ント回路基板に載せ、その上からクリーム半田をこすり
付けて、パッド上にのみ半田をコーティングする方法で
ある。しかしこの方法でパッド上に適正な量の半田を供
給しても、その後、電子部品のリードを載せて加熱する
と、半田がパッドの側面に回り込んで付着してしまい、
パッド上面の半田付けに寄与する半田の量が少なくなっ
てしまうという問題がある。The solder coating is generally performed by a screen printing method. This method is a method in which a screen having holes only on the pads is placed on a printed circuit board, cream solder is rubbed on the screen, and the solder is coated only on the pads. However, even if an appropriate amount of solder is supplied to the pad by this method, if the leads of the electronic component are then placed and heated, the solder will wrap around the side surface of the pad and adhere.
There is a problem that the amount of solder that contributes to soldering on the upper surface of the pad is reduced.
【０００４】また微細パターンに適する半田のコーティ
ング法としては反応析出型の半田析出組成物を用いる方
法も公知である。この方法は、プリント回路基板のパッ
ド領域に有機酸鉛塩と錫粉を主成分とするペースト状半
田析出組成物をベタ塗りし、加熱することにより、パッ
ドの部分だけに選択的に半田を析出させるというもので
ある。この場合は、パッド上に析出した半田を部品のリ
ードの半田付けに使用する。しかしこの方法の場合も、
パッドの上面だけでなく側面にも半田が析出してしまう
ため、パッド上面に半田付けに必要な量の半田を確保す
ることが困難である。As a solder coating method suitable for fine patterns, a method using a reaction deposition type solder deposition composition is also known. In this method, a paste solder deposition composition containing an organic acid lead salt and tin powder as the main components is solidly applied to the pad area of the printed circuit board and heated to selectively deposit solder only on the pad portion. It is to let. In this case, the solder deposited on the pad is used for soldering the lead of the component. But even with this method,
Since solder is deposited not only on the upper surface of the pad but also on the side surface, it is difficult to secure a sufficient amount of solder on the upper surface of the pad for soldering.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記のような
課題を解決したプリント回路基板を提供するもので、そ
の構成は、パッドの側面に半田の付着しない被膜を形成
したことを特徴とするものである。半田の付着しない被
膜としては銅パッドの場合、銅の酸化被膜などが好適で
ある。SUMMARY OF THE INVENTION The present invention provides a printed circuit board which solves the above-mentioned problems and is characterized in that a coating film to which solder does not adhere is formed on the side surface of the pad. To do. In the case of a copper pad, a copper oxide film or the like is suitable as the film to which the solder does not adhere.
【０００６】[0006]
【作用】上記構成によると、パッドの側面に半田が回り
込んで付着したり、析出したりすることがなくなり、パ
ッド上面に半田付けのために適正な量の半田を確保する
ことが可能となる。According to the above structure, the solder does not wrap around the side surface of the pad to be attached or deposited, and it is possible to secure an appropriate amount of solder on the upper surface of the pad for soldering. .
【０００７】[0007]
【実施例】以下、本発明の実施例を図面を参照して詳細
に説明する。図１は本発明の一実施例を示す。符号１は
絶縁基板、２はその上に張り付けられた銅箔をパターン
エッチングすることにより形成されたパッドである。こ
のプリント回路基板の特徴は、パッド２の側面に銅の酸
化被膜３が形成されていることである。Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows an embodiment of the present invention. Reference numeral 1 is an insulating substrate, and 2 is a pad formed by pattern etching a copper foil attached thereon. The feature of this printed circuit board is that the copper oxide film 3 is formed on the side surface of the pad 2.
【０００８】このプリント回路基板のパッド２上に例え
ば図２に示すようにクリーム半田４をコーティングした
後、図３に示すように部品のリード５を載せ、加熱する
と、クリーム半田４が溶融してパッド２とリード５が半
田付けされる。このとき、パッド２の側面には半田の付
着しない（溶融半田に濡れない）酸化被膜３が形成され
ているため、溶融半田がパッド２の側面に回り込むこと
がなく、パッド２上面の半田がほぼすべて半田付けに寄
与することになる。After the cream solder 4 is coated on the pad 2 of the printed circuit board as shown in FIG. 2, for example, the leads 5 of the component are placed as shown in FIG. 3 and heated to melt the cream solder 4. The pad 2 and the lead 5 are soldered. At this time, since the oxide film 3 that does not adhere to the solder (does not wet with the molten solder) is formed on the side surface of the pad 2, the molten solder does not go around to the side surface of the pad 2 and the solder on the upper surface of the pad 2 is almost All will contribute to soldering.
【０００９】図１に示したプリント回路基板は図４
（イ）〜（ハ）のようにして製造することができる。ま
ず（イ）に示すように絶縁基板１に張り付けた銅箔２ａ
の表面にパッドパターンに対応するエッチングレジスト
６を形成する。次に銅箔２ａの露出部分をエッチングし
て（ロ）に示すようにパッド２を形成する。次にエッチ
ングレジスト６を残したまま、このプリント回路基板を
高温高湿（85℃、85％RH）の槽に約50時間入れ、（ハ）
に示すようにパッド２の側面に銅の酸化被膜３を形成す
る。その後、エッチングレジスト６を除去すれば図１の
ようなプリント回路基板が得られる。The printed circuit board shown in FIG. 1 is shown in FIG.
It can be manufactured as in (a) to (c). First, as shown in (a), the copper foil 2a attached to the insulating substrate 1
An etching resist 6 corresponding to the pad pattern is formed on the surface of the. Next, the exposed portion of the copper foil 2a is etched to form the pad 2 as shown in (b). Next, with the etching resist 6 left, place this printed circuit board in a high-temperature, high-humidity (85 ° C, 85% RH) tank for about 50 hours.
A copper oxide film 3 is formed on the side surface of the pad 2 as shown in FIG. Then, if the etching resist 6 is removed, a printed circuit board as shown in FIG. 1 is obtained.
【００１０】なお前記実施例では、パッドにクリーム半
田を印刷して半田層を形成する場合を説明したが、本発
明はこれに限らず、パッド上に反応析出型の半田析出組
成物を用いて半田を析出させる場合でも、パッド側面に
半田が析出することなくパッド上面にのみ半田が析出す
るため、パッド上面に半田付けに必要な量の半田を確保
することができる。In the above embodiment, the case where the cream solder is printed on the pad to form the solder layer has been described. However, the present invention is not limited to this, and a reaction deposition type solder deposition composition is used on the pad. Even when the solder is deposited, the solder is not deposited on the side surface of the pad but is deposited only on the upper surface of the pad, so that the amount of solder required for soldering can be secured on the upper surface of the pad.
【００１１】[0011]
【発明の効果】以上説明したように本発明によれば、パ
ッドの側面に半田が回り込んで付着したり、析出したり
することがなく、パッド上面に適正な量の半田を確保で
きるため、ブリッジが発生せずしかも接続信頼性の高い
部品実装を行うことがきる。As described above, according to the present invention, it is possible to secure an appropriate amount of solder on the upper surface of the pad without the solder flowing around the side surface of the pad and adhering or depositing. It is possible to mount components that do not generate a bridge and have high connection reliability.
【図１】 本発明の一実施例に係るプリント回路基板の
断面図。FIG. 1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.
【図２】 図１のプリント回路基板のパッドにクリーム
半田をコーティングした状態を示す断面図。2 is a cross-sectional view showing a state in which a pad of the printed circuit board of FIG. 1 is coated with cream solder.
【図３】 図１のプリント回路基板に部品のリードを半
田付けした状態を示す断面図。FIG. 3 is a cross-sectional view showing a state in which component leads are soldered to the printed circuit board of FIG.
【図４】 （イ）〜（ハ）は図１のプリント回路基板の
製造方法を示す断面図。4A to 4C are cross-sectional views showing a method for manufacturing the printed circuit board of FIG.
【符号の説明】 １：絶縁基板 ２：パッド ３：銅の酸化被膜 ４：クリーム半田 ５：部品のリード[Explanation of Codes] 1: Insulating substrate 2: Pad 3: Copper oxide film 4: Cream solder 5: Component lead
Claims (1)
成したことを特徴とするプリント回路基板。1. A printed circuit board, wherein a coating film to which solder does not adhere is formed on a side surface of the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10903792A JPH05283853A (en) | 1992-04-03 | 1992-04-03 | Printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10903792A JPH05283853A (en) | 1992-04-03 | 1992-04-03 | Printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05283853A true JPH05283853A (en) | 1993-10-29 |
Family
ID=14500011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10903792A Pending JPH05283853A (en) | 1992-04-03 | 1992-04-03 | Printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05283853A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073617A (en) * | 2005-09-05 | 2007-03-22 | Tamura Seisakusho Co Ltd | Electrode structure, substrate for packaging, projection electrode, and manufacturing method thereof |
| JP2007268613A (en) * | 2006-03-06 | 2007-10-18 | Qimonda Ag | Method for diffusion soldering |
| JP2014072468A (en) * | 2012-09-29 | 2014-04-21 | Kyocer Slc Technologies Corp | Wiring board |
| US11997788B2 (en) | 2021-11-26 | 2024-05-28 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
-
1992
- 1992-04-03 JP JP10903792A patent/JPH05283853A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073617A (en) * | 2005-09-05 | 2007-03-22 | Tamura Seisakusho Co Ltd | Electrode structure, substrate for packaging, projection electrode, and manufacturing method thereof |
| JP2007268613A (en) * | 2006-03-06 | 2007-10-18 | Qimonda Ag | Method for diffusion soldering |
| JP2014072468A (en) * | 2012-09-29 | 2014-04-21 | Kyocer Slc Technologies Corp | Wiring board |
| US11997788B2 (en) | 2021-11-26 | 2024-05-28 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
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