JPS6021598A - 多層配線基板の製造方法 - Google Patents

多層配線基板の製造方法

Info

Publication number
JPS6021598A
JPS6021598A JP12980883A JP12980883A JPS6021598A JP S6021598 A JPS6021598 A JP S6021598A JP 12980883 A JP12980883 A JP 12980883A JP 12980883 A JP12980883 A JP 12980883A JP S6021598 A JPS6021598 A JP S6021598A
Authority
JP
Japan
Prior art keywords
metal foil
electrically insulating
substrate
insulating layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12980883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0359595B2 (zh
Inventor
徹 樋口
村上　久男
武司 加納
慧 森本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12980883A priority Critical patent/JPS6021598A/ja
Publication of JPS6021598A publication Critical patent/JPS6021598A/ja
Publication of JPH0359595B2 publication Critical patent/JPH0359595B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12980883A 1983-07-15 1983-07-15 多層配線基板の製造方法 Granted JPS6021598A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12980883A JPS6021598A (ja) 1983-07-15 1983-07-15 多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12980883A JPS6021598A (ja) 1983-07-15 1983-07-15 多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6021598A true JPS6021598A (ja) 1985-02-02
JPH0359595B2 JPH0359595B2 (zh) 1991-09-11

Family

ID=15018729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12980883A Granted JPS6021598A (ja) 1983-07-15 1983-07-15 多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6021598A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009113602A1 (ja) * 2008-03-13 2009-09-17 株式会社村田製作所 樹脂基板の製造方法および樹脂基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159664A (en) * 1978-06-07 1979-12-17 Shin Kobe Electric Machinery Method of producing printed circuit board
JPS5797970U (zh) * 1980-12-08 1982-06-16

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159664A (en) * 1978-06-07 1979-12-17 Shin Kobe Electric Machinery Method of producing printed circuit board
JPS5797970U (zh) * 1980-12-08 1982-06-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009113602A1 (ja) * 2008-03-13 2009-09-17 株式会社村田製作所 樹脂基板の製造方法および樹脂基板

Also Published As

Publication number Publication date
JPH0359595B2 (zh) 1991-09-11

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