JPH0359595B2 - - Google Patents

Info

Publication number
JPH0359595B2
JPH0359595B2 JP58129808A JP12980883A JPH0359595B2 JP H0359595 B2 JPH0359595 B2 JP H0359595B2 JP 58129808 A JP58129808 A JP 58129808A JP 12980883 A JP12980883 A JP 12980883A JP H0359595 B2 JPH0359595 B2 JP H0359595B2
Authority
JP
Japan
Prior art keywords
metal foil
insulating layer
electrically insulating
circuit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58129808A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6021598A (ja
Inventor
Tooru Higuchi
Hisao Murakami
Takeshi Kano
Satoshi Morimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12980883A priority Critical patent/JPS6021598A/ja
Publication of JPS6021598A publication Critical patent/JPS6021598A/ja
Publication of JPH0359595B2 publication Critical patent/JPH0359595B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12980883A 1983-07-15 1983-07-15 多層配線基板の製造方法 Granted JPS6021598A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12980883A JPS6021598A (ja) 1983-07-15 1983-07-15 多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12980883A JPS6021598A (ja) 1983-07-15 1983-07-15 多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6021598A JPS6021598A (ja) 1985-02-02
JPH0359595B2 true JPH0359595B2 (zh) 1991-09-11

Family

ID=15018729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12980883A Granted JPS6021598A (ja) 1983-07-15 1983-07-15 多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6021598A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009113602A1 (ja) * 2008-03-13 2009-09-17 株式会社村田製作所 樹脂基板の製造方法および樹脂基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159664A (en) * 1978-06-07 1979-12-17 Shin Kobe Electric Machinery Method of producing printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797970U (zh) * 1980-12-08 1982-06-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159664A (en) * 1978-06-07 1979-12-17 Shin Kobe Electric Machinery Method of producing printed circuit board

Also Published As

Publication number Publication date
JPS6021598A (ja) 1985-02-02

Similar Documents

Publication Publication Date Title
JP3059568B2 (ja) 多層プリント回路基板の製造方法
WO2007046459A1 (ja) 多層プリント配線基板及びその製造方法
JPH0494186A (ja) 多層回路基板の製造方法
JPS6227558B2 (zh)
JPH08195561A (ja) 多層印刷配線板及びその製造方法
JP3705370B2 (ja) 多層プリント配線板の製造方法
JP3738536B2 (ja) プリント配線基板の製造方法
JPH0359595B2 (zh)
JP4684454B2 (ja) プリント配線基板の製造方法及びプリント配線基板
JPH0359597B2 (zh)
JPH1187912A (ja) 両面型配線板の製造方法
JPH0255958B2 (zh)
JP3998139B2 (ja) 多層プリント配線板とその製造方法
JP4803918B2 (ja) 多層配線基板の製造方法
JP3934826B2 (ja) 多層配線板の製造方法
JPH0360097A (ja) 多層プリント配線基板の製造方法
JP2000208946A (ja) 多層配線板およびその製造方法
JPH01130585A (ja) 補強板一体型フレキシブル配線板の製造方法
JP4058218B2 (ja) プリント配線基板の製造方法
JP4803919B2 (ja) 多層配線基板の製造方法
JPH02178995A (ja) 多層プリント基板の製造方法
JPH10303553A (ja) プリント配線板の製造方法
JP3840953B2 (ja) 回路基板およびその製造方法
JPS5917997B2 (ja) 印刷配線板
JPH0521960A (ja) 多層プリント配線板およびその製造方法