JPS60215799A - メツキ装置 - Google Patents

メツキ装置

Info

Publication number
JPS60215799A
JPS60215799A JP7060284A JP7060284A JPS60215799A JP S60215799 A JPS60215799 A JP S60215799A JP 7060284 A JP7060284 A JP 7060284A JP 7060284 A JP7060284 A JP 7060284A JP S60215799 A JPS60215799 A JP S60215799A
Authority
JP
Japan
Prior art keywords
wafer
plating
anode
holder
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7060284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0453960B2 (enExample
Inventor
Shigeki Matsumoto
茂樹 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP7060284A priority Critical patent/JPS60215799A/ja
Publication of JPS60215799A publication Critical patent/JPS60215799A/ja
Publication of JPH0453960B2 publication Critical patent/JPH0453960B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP7060284A 1984-04-09 1984-04-09 メツキ装置 Granted JPS60215799A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7060284A JPS60215799A (ja) 1984-04-09 1984-04-09 メツキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7060284A JPS60215799A (ja) 1984-04-09 1984-04-09 メツキ装置

Publications (2)

Publication Number Publication Date
JPS60215799A true JPS60215799A (ja) 1985-10-29
JPH0453960B2 JPH0453960B2 (enExample) 1992-08-28

Family

ID=13436278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7060284A Granted JPS60215799A (ja) 1984-04-09 1984-04-09 メツキ装置

Country Status (1)

Country Link
JP (1) JPS60215799A (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57174489A (en) * 1981-04-17 1982-10-27 Fujisen Shokai:Kk Plating device for small articles
JPS58135473U (ja) * 1982-03-04 1983-09-12 コニカ株式会社 電解処理装置
JPS59205500A (ja) * 1983-05-06 1984-11-21 Sansen Kikai Kogyo Kk 表面処理装置
JPS60234975A (ja) * 1984-05-04 1985-11-21 Dainippon Screen Mfg Co Ltd 板状物の浸漬処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57174489A (en) * 1981-04-17 1982-10-27 Fujisen Shokai:Kk Plating device for small articles
JPS58135473U (ja) * 1982-03-04 1983-09-12 コニカ株式会社 電解処理装置
JPS59205500A (ja) * 1983-05-06 1984-11-21 Sansen Kikai Kogyo Kk 表面処理装置
JPS60234975A (ja) * 1984-05-04 1985-11-21 Dainippon Screen Mfg Co Ltd 板状物の浸漬処理方法

Also Published As

Publication number Publication date
JPH0453960B2 (enExample) 1992-08-28

Similar Documents

Publication Publication Date Title
US4437943A (en) Method and apparatus for bonding metal wire to a base metal substrate
TWM248792U (en) Device for forming bumps and device for metal plating
JP7304290B2 (ja) 多数のナノワイヤを提供するための装置および方法
JPH1180989A (ja) メッキ装置
JPS60215799A (ja) メツキ装置
US4800002A (en) Method of making a diamond heat sink
US3915832A (en) Electroplating apparatus for forming a nonuniform coating on workpieces
CN217895785U (zh) 夹具、引线挂镀装置、引线电镀系统、镀金引线
JP3980809B2 (ja) 電解処理装置
JPH11163015A (ja) メッキ装置
JP3343077B2 (ja) めっき用電極
JPH11209898A (ja) メッキ用アノード電極
JPH0441698A (ja) 電解めっき方法および装置並びにそれに使用される治具
JPH11135462A (ja) 半導体製造装置
JPH09137296A (ja) 電子部品のメッキ方法
JP3884150B2 (ja) 高速メッキ装置及び高速メッキ方法
JPS6342399A (ja) めつき方法およびこれに用いるめつき治具
JP2002266098A (ja) めっき装置、及び半導体装置の製造方法
JPS61226269A (ja) 砥粒固着方法
JPS6020477B2 (ja) 噴流式メツキ装置
JPH02277251A (ja) ワイヤボンディング方法および装置
US3814117A (en) Nonuniformly treating articles and supporting them therefor
JPH06326113A (ja) メッキ方法
AT222700B (de) Verfahren zur Herstellung einer Halbleiteranordnung aus Silizium
JP2005503485A (ja) アノードアセンブリ用電極部品

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees