JPS60200870A - セラミツクス−金属接合体 - Google Patents
セラミツクス−金属接合体Info
- Publication number
- JPS60200870A JPS60200870A JP5590184A JP5590184A JPS60200870A JP S60200870 A JPS60200870 A JP S60200870A JP 5590184 A JP5590184 A JP 5590184A JP 5590184 A JP5590184 A JP 5590184A JP S60200870 A JPS60200870 A JP S60200870A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic sintered
- sintered body
- ceramic
- bonded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 36
- 239000002184 metal Substances 0.000 title claims description 36
- 239000000919 ceramic Substances 0.000 claims description 25
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- NMHMDUCCVHOJQI-UHFFFAOYSA-N lithium molybdate Chemical compound [Li+].[Li+].[O-][Mo]([O-])(=O)=O NMHMDUCCVHOJQI-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5590184A JPS60200870A (ja) | 1984-03-23 | 1984-03-23 | セラミツクス−金属接合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5590184A JPS60200870A (ja) | 1984-03-23 | 1984-03-23 | セラミツクス−金属接合体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60200870A true JPS60200870A (ja) | 1985-10-11 |
| JPH0328392B2 JPH0328392B2 (enrdf_load_stackoverflow) | 1991-04-18 |
Family
ID=13012014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5590184A Granted JPS60200870A (ja) | 1984-03-23 | 1984-03-23 | セラミツクス−金属接合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60200870A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4981761A (en) * | 1988-06-03 | 1991-01-01 | Hitachi, Ltd. | Ceramic and metal bonded composite |
| US20090123696A1 (en) * | 2007-11-09 | 2009-05-14 | Ibiden Co., Ltd. | Carbon-based composite material and producing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59137378A (ja) * | 1983-01-24 | 1984-08-07 | 三菱重工業株式会社 | セラミツク又はサ−メツトと金属の接合方法 |
-
1984
- 1984-03-23 JP JP5590184A patent/JPS60200870A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59137378A (ja) * | 1983-01-24 | 1984-08-07 | 三菱重工業株式会社 | セラミツク又はサ−メツトと金属の接合方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4981761A (en) * | 1988-06-03 | 1991-01-01 | Hitachi, Ltd. | Ceramic and metal bonded composite |
| US20090123696A1 (en) * | 2007-11-09 | 2009-05-14 | Ibiden Co., Ltd. | Carbon-based composite material and producing method thereof |
| US8329283B2 (en) * | 2007-11-09 | 2012-12-11 | Ibiden Co., Ltd. | Carbon-based composite material and producing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328392B2 (enrdf_load_stackoverflow) | 1991-04-18 |
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