JPS60200870A - Ceramics-metal bonded body - Google Patents
Ceramics-metal bonded bodyInfo
- Publication number
- JPS60200870A JPS60200870A JP5590184A JP5590184A JPS60200870A JP S60200870 A JPS60200870 A JP S60200870A JP 5590184 A JP5590184 A JP 5590184A JP 5590184 A JP5590184 A JP 5590184A JP S60200870 A JPS60200870 A JP S60200870A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic sintered
- sintered body
- ceramic
- bonded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
本発明はひび割れや剥離等の欠陥のないセラミックス−
金属接合体に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides ceramics free of defects such as cracks and peeling.
Regarding metal joints.
［発明の技術的背景とその問題点］
セラミックス焼結体と金属部材との接合技術は電子管を
中心に発展し、現在では各種の電子部品に適用されてい
る。[Technical background of the invention and its problems] The joining technology of ceramic sintered bodies and metal members has been developed mainly for electron tubes, and is currently applied to various electronic components.
このような機能部品においては、気密性が重要な問題と
なっているが、この問題は金属部材として熱膨張係数が
セラミックス焼結体のそれと近似しているものを使用す
ることによりほぼ解決されている。Airtightness is an important issue in such functional parts, but this problem has been largely solved by using metal members whose coefficient of thermal expansion is similar to that of ceramic sintered bodies. There is.
しかしながら、構造用部品にこの接合技１４・ｊを適用
させることは使用する金属部材がほとんどｔｌｉｌ ＋
Ｊ等に限定されていることから困難であり、従来は接着
剤や機械的に嵌合させることによりセラミックス焼結体
と金属部材とを接合させることか行なわれていた。However, when applying this joining technique 14.j to structural parts, most of the metal members used are tlil +
This is difficult because it is limited to J, etc., and conventionally the ceramic sintered body and the metal member have been joined by adhesive or mechanical fitting.
しかしながら、このような方法では接合強度の小さいも
のしか得られず、また熱膨張係数の差によりひび割れや
剥離等の欠陥が発生し易いという問題があった。However, this method has the problem that only low bonding strength can be obtained, and defects such as cracking and peeling are likely to occur due to differences in thermal expansion coefficients.
［発明の目的］
本発明はこのような問題を解決づるためなされたもので
、接合時の集中応力を緩和しでひび割れや剥離等の欠陥
の発生し難いセラミックス−金属接合体を提供すること
を目的とする。[Purpose of the Invention] The present invention was made to solve these problems, and its object is to provide a ceramic-metal bonded body that reduces the concentrated stress during bonding and is less prone to defects such as cracking and peeling. purpose.
［発明の概要］
すなわち本発明のセラミックス−金属接合体は、金属部
材のセラミックス焼結体に接合づる面に不連続部が形成
されていることを特徴としている。[Summary of the Invention] That is, the ceramic-metal bonded body of the present invention is characterized in that a discontinuous portion is formed on the surface of the metal member that is bonded to the ceramic sintered body.
本発明におけるセラミックス焼結体としＣは、例えばア
ルミナ等の酸化物系セラミックス焼結体、窒化ケイ素、
炭化ケイ素等の非酸化物系セラミックス焼結体等があげ
られる。In the present invention, the ceramic sintered body C is, for example, an oxide ceramic sintered body such as alumina, silicon nitride,
Examples include non-oxide ceramic sintered bodies such as silicon carbide.
本発明における金属部材としては、例えば調料があげら
れるが、これに限定されるものではない。Examples of the metal member in the present invention include, but are not limited to, preparations.
本発明においては、接合に際しＣ金属部材側のセラミッ
クス焼結体に接合する面に多数のスリット等の切欠を入
れて接合面に不連続部を形成さ已でおく。In the present invention, when joining, a large number of notches such as slits are made in the surface of the C metal member side to be joined to the ceramic sintered body to form a discontinuous portion on the joining surface.
これらのスリットは、金属部材の大きさにもにるが、幅
０．１〜３旺、ピッチ０．５〜２０川和、深さ０．３〜
５．Ｏｎが打法しい。These slits vary depending on the size of the metal member, but have a width of 0.1 to 3 mm, a pitch of 0.5 to 20 mm, and a depth of 0.3 to 3 mm.
5. On is the best way to bat.
セラミックス焼結体を金属部材、特に鋼材に接合させる
には、例えば次のように行なう。To join a ceramic sintered body to a metal member, particularly a steel material, the following procedure is performed, for example.
セラミックス焼結体が酸化物系の場合はそのまま、非酸
化物系の場合はできれば酸化して表面に酸化層を形成さ
せた後、この酸化層上にタフピッチ電界銅等の含酸素鋼
を接触させた状態で不活性雰囲気中において１０６５〜
１０８３℃に加熱して銅層を形成し、ろう材を介しＣ金
属部材の不連続な面に接合させる。ま７ｊ他の方法とし
て酸素鋼の代りに活性金属の化合物を添加したモリブデ
ン酸リチウム溶液をセラミックス焼結体の接合面上に塗
布し、加熱して導電層を形成した後、この導電層上にニ
ッケルめっきを施し、ろう材を介して金属部材と接合さ
ぜｌζす、活性金属粉末または箔を介してセラミックス
焼結体と金属部材とを接合ざぜるようにしてもよい。こ
の場合、銅あるいは銅合金のような延性金属の薄板を接
合面に挾み、中間緩衝層を設けた方がより高い強度が得
られる。If the ceramic sintered body is an oxide type, oxidize it as it is, or if it is a non-oxide type, oxidize it to form an oxide layer on the surface, and then contact oxygen-containing steel such as tough pitch electrolytic copper on the oxide layer. 1065~ in an inert atmosphere under
A copper layer is formed by heating to 1083° C., and is bonded to the discontinuous surface of the C metal member via a brazing material. Alternatively, instead of oxygen steel, a lithium molybdate solution to which an active metal compound has been added is applied onto the joint surface of the ceramic sintered body, heated to form a conductive layer, and then coated on this conductive layer. The ceramic sintered body may be plated with nickel and bonded to the metal member via a brazing filler metal, or the ceramic sintered body and the metal member may be bonded via active metal powder or foil. In this case, higher strength can be obtained by sandwiching thin plates of ductile metal such as copper or copper alloy between the bonding surfaces and providing an intermediate buffer layer.
［発明の実施例］ 次に本発明の実施例について説明Ｊ−る。[Embodiments of the invention] Next, embodiments of the present invention will be explained.
実施例１
常圧焼結法により第１図に示すような、白り棒状の窒化
ケイ素系セラミックス焼結体１をｍ ）ａＬ／Ｉ〔。こ
のセラミックス焼結体１の金属部材２に接合する面に二
酸化チタンを添加したモリブデン酸溶液を塗布焼付けし
て導電層を形成した後、この上にニッケルめっきを施し
た。Example 1 A white rod-shaped silicon nitride ceramic sintered body 1 as shown in FIG. A molybdic acid solution containing titanium dioxide was applied and baked on the surface of the ceramic sintered body 1 to be bonded to the metal member 2 to form a conductive layer, and then nickel plating was applied thereon.
次に鋼製の直方体状の金属部材２のけラミックス焼結体
に接合する面に幅０．５＋ｎ＋ｉ、ピッチ１゜０ｍｍ、
深さ２．０ｍｍの平行する多数のスリブ１〜３を入れ、
これを銀−銅ろう祠４を介しＣセラミックス焼結体１の
ニッケルめっきの面に接触さけて加熱することによりセ
ラミックス−金属接合体を製 造 し ）こ 。Next, the surface of the steel rectangular parallelepiped metal member 2 to be joined to the ceramic ceramic sintered body has a width of 0.5+n+i and a pitch of 1°0mm.
Insert a large number of parallel ribs 1 to 3 with a depth of 2.0 mm,
A ceramic-metal bonded body is manufactured by heating this through a silver-copper braze 4 while avoiding contact with the nickel-plated surface of the C ceramic sintered body 1.
このようにして得られた１０個の接合体にはひび割れや
剥離等の欠陥は発見されなかった。No defects such as cracks or peeling were found in the 10 bonded bodies thus obtained.
一方、金属部材としてスリットを入れないものを使用し
て同様にセラミックス焼結体に接合させたものはすべて
にひび割れが発生した。On the other hand, all metal members without slits that were similarly bonded to ceramic sintered bodies developed cracks.
実施例２
常圧焼結法により第２図に示すような形状の窒化ケイ素
性セラミックス焼結体５．５′を製造した。Example 2 A silicon nitride ceramic sintered body 5.5' having the shape shown in FIG. 2 was manufactured by pressureless sintering.
このセラミックス焼結体５．５′の金属部材６に接合す
る面にチタンおよび銅の混合粉末を介して厚さ０．０３
ｍｍの銅板を載せ、窯化雰囲気中で加熱して銅層６を形
成した。A mixed powder of titanium and copper is applied to the surface of the ceramic sintered body 5.5' to be bonded to the metal member 6 to a thickness of 0.03 mm.
A copper plate 6 mm thick was placed on the plate and heated in a kiln atmosphere to form a copper layer 6.
次にｍ製の金属部材７のセラミックス焼結体５．５′に
接合する面に幅０．５籠、ピッチ１．０ｍ＋１１、深さ
３．０ｍｍのスリット８を入れ、これを銀−銅ろう材８
を介してセラミックス焼結体５．５′の！ｉ層６に接触
させて加熱することにより、木材加工用を工具を製造し
た。Next, a slit 8 with a width of 0.5 cages, a pitch of 1.0 m + 11, and a depth of 3.0 mm is made in the surface of the metal member 7 made of m to be joined to the ceramic sintered body 5.5', and the slit 8 is connected with silver-copper solder. Material 8
Ceramic sintered body 5.5' through! By contacting the i-layer 6 and heating it, a tool for wood processing was manufactured.
この接合体を１０個製造したが、これらにはいずれもひ
び割れや剥離等の欠陥は発生しなかった。Ten pieces of this joined body were produced, and none of them had defects such as cracks or peeling.
一方、金属部材としてスリットを入れないものを使用し
た場合はすべてのセラミックス焼結体にひび割れが生じ
た。On the other hand, when metal members without slits were used, cracks occurred in all ceramic sintered bodies.
［発明の効果〕
以上説明したように本発明のセラミックス−金属接合体
は、接合時に生じる応力が予め金属部材に形成された不
連続部により緩和されるので、ひび割れや剥離等の欠陥
が１しることがない。[Effects of the Invention] As explained above, in the ceramic-metal bonded body of the present invention, the stress generated during bonding is alleviated by the discontinuous portions formed in advance in the metal members, so defects such as cracking and peeling are less likely to occur. Never.
第１図は本発明のセラミックス−金属接合体の一実施例
を模式的に示す断面図、第２図は別の実施例を示す斜視
図である。
１．５．５′・・・セラミックス焼結体２．６・・・・
・・・・・金属部材
３．７・・・・・・・・・スリット
４．８・・・・・・・・・銀−銅ろう月代理人弁理士
須 山 仏 −
第１図
第２図FIG. 1 is a sectional view schematically showing one embodiment of the ceramic-metal bonded body of the present invention, and FIG. 2 is a perspective view showing another embodiment. 1.5.5'... Ceramic sintered body 2.6...
...Metal member 3.7...Slit 4.8...Silver-copper wax Tsuki agent patent attorney
Suyama Buddha - Figure 1 Figure 2
Claims (4)
連続部が形成されていることを特徴どするセラミックス
−金属接合体。(1) A ceramic-metal bonded body, characterized in that a discontinuous portion is formed on the surface of the metal member that is bonded to the ceramic sintered body.
成されている特許請求の範囲第１項記載のヒラミックス
−金属接合体。(2) The HIRAMIX-metal bonded body according to claim 1, wherein the discontinuous portion is formed by a plurality of parallel threads 1-.
ｍｍ、ピッチが０．５〜２０龍、深さか０゜３〜５．０
■である特許請求の範囲第２項記載のセラミックス−金
属接合体。(3) Width of multiple parallel slits is 0.1 to 3.0
mm, pitch 0.5~20mm, depth 0°3~5.0
(2) A ceramic-metal bonded body according to claim 2.
し第３項のいずれか１項記載のセラミックス−金属接合
体。(4) The ceramic-metal bonded body according to any one of claims 1 to 3, wherein the metal member is a steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5590184A JPS60200870A (en) | 1984-03-23 | 1984-03-23 | Ceramics-metal bonded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5590184A JPS60200870A (en) | 1984-03-23 | 1984-03-23 | Ceramics-metal bonded body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60200870A true JPS60200870A (en) | 1985-10-11 |
| JPH0328392B2 JPH0328392B2 (en) | 1991-04-18 |
Family
ID=13012014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5590184A Granted JPS60200870A (en) | 1984-03-23 | 1984-03-23 | Ceramics-metal bonded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60200870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4981761A (en) * | 1988-06-03 | 1991-01-01 | Hitachi, Ltd. | Ceramic and metal bonded composite |
| US20090123696A1 (en) * | 2007-11-09 | 2009-05-14 | Ibiden Co., Ltd. | Carbon-based composite material and producing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59137378A (en) * | 1983-01-24 | 1984-08-07 | 三菱重工業株式会社 | Method of bonding ceramic or cermet and metal |
-
1984
- 1984-03-23 JP JP5590184A patent/JPS60200870A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59137378A (en) * | 1983-01-24 | 1984-08-07 | 三菱重工業株式会社 | Method of bonding ceramic or cermet and metal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4981761A (en) * | 1988-06-03 | 1991-01-01 | Hitachi, Ltd. | Ceramic and metal bonded composite |
| US20090123696A1 (en) * | 2007-11-09 | 2009-05-14 | Ibiden Co., Ltd. | Carbon-based composite material and producing method thereof |
| US8329283B2 (en) * | 2007-11-09 | 2012-12-11 | Ibiden Co., Ltd. | Carbon-based composite material and producing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328392B2 (en) | 1991-04-18 |
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