JPH0240631B2 - - Google Patents
Info
- Publication number
- JPH0240631B2 JPH0240631B2 JP57207694A JP20769482A JPH0240631B2 JP H0240631 B2 JPH0240631 B2 JP H0240631B2 JP 57207694 A JP57207694 A JP 57207694A JP 20769482 A JP20769482 A JP 20769482A JP H0240631 B2 JPH0240631 B2 JP H0240631B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- silicon nitride
- ceramics
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 20
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 15
- 239000011224 oxide ceramic Substances 0.000 claims description 15
- 229910052575 non-oxide ceramic Inorganic materials 0.000 claims description 14
- 239000011225 non-oxide ceramic Substances 0.000 claims description 14
- 238000005219 brazing Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 21
- 229910052581 Si3N4 Inorganic materials 0.000 description 18
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 18
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- -1 heat resistance Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、窒化珪素など非酸化物セラミツク
スと金属とをろう付けにより接合する方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of joining non-oxide ceramics such as silicon nitride and metal by brazing.
セラミツクスは、金属に比べて、耐熱性、耐食
性、硬質性、伝熱性、高温強度、低比重などすぐ
れた特性をそなえるため、その特性を生かす応用
技術の開発が進められている。窒化珪素セラミツ
クスを自動車用エンジンおよびそのターボチヤー
ジヤなどに使用しようとする開発はその一例であ
るが、このようにセラミツクスを構造材料として
利用する例は、機能材料として使用する例に比べ
てまだ少い。ところで、このようにセラミツクス
を構造材料として使用する場合には、しばしば鋼
材など金属部材との接合が必要になる。
Ceramics have superior properties compared to metals, such as heat resistance, corrosion resistance, hardness, heat conductivity, high-temperature strength, and low specific gravity, and the development of application technologies that take advantage of these properties is underway. One example is the development of silicon nitride ceramics for use in automobile engines and their turbochargers, but examples of using ceramics as structural materials in this way are still rare compared to examples of using them as functional materials. By the way, when ceramics are used as a structural material in this way, it is often necessary to bond them to metal members such as steel materials.
ところで、従来より、セラミツクス部材と金属
部材との結合については、ボルト、ナツトによる
機械的結合がよく用いられているが、この結合手
段は、硬脆性であるセラミツクス部材を破損しや
すい。また、アルミナなどの酸化物セラミツクス
については、ろう材による接合もおこなわれてい
るが、上記酸化物セラミツクスと分子構造が大き
く異なる非酸化物セラミツクスについては、酸化
物セラミツクスと同程度に強固にろう接すること
ができない。また、一般に非酸化物セラミツクス
は、酸化物セラミツクスに比べて熱膨張係数が小
さいため、これを金属部材と直接接合すると、加
熱冷却の熱サイクルが加わつた場合、接合部に熱
応力が蓄積し、熱疲労破壊を起す危険があるの
で、構造材料として信頼性に欠けるという問題点
がある。 Incidentally, conventionally, mechanical connection using bolts and nuts has been often used to connect ceramic members and metal members, but this joining means tends to damage the hard and brittle ceramic members. In addition, oxide ceramics such as alumina are joined using brazing metal, but non-oxide ceramics, which have a significantly different molecular structure from the oxide ceramics mentioned above, can be joined with the same strength as oxide ceramics. I can't. In addition, non-oxide ceramics generally have a smaller coefficient of thermal expansion than oxide ceramics, so if they are directly bonded to a metal member, thermal stress will accumulate in the bonded area when thermal cycles of heating and cooling are applied. Since there is a risk of thermal fatigue failure, there is a problem that it lacks reliability as a structural material.
この発明は、非酸化物セラミツクス部材と金属
部材とをろう付けにより強固に接合し、たとえ接
合部に熱サイクルが加わつても熱疲労破壊を起さ
ないようにすることにある。
The present invention aims to firmly join a non-oxide ceramic member and a metal member by brazing so that thermal fatigue failure does not occur even if a thermal cycle is applied to the joint.
非酸化物セラミツクス部材を成形する第１の方
法と、金属部材との接合面に酸化物セラミツクス
層を形成する第２の方法と、この酸化物セラミツ
クス層上に金属層を形成する第３の方法と、上記
非酸化物セラミツクス部材と金属部材を接合する
第４の方法とからなり、第１乃至第３の方法のう
ち、第１及び第２の方法を同時に行うようにした
ものである。特に、酸化物セラミツクス層および
金属層は、結合する非酸化物セラミツクス部材と
金属部材との中間の熱膨張係数を有する材料で形
成するとよい。
A first method of forming a non-oxide ceramic member, a second method of forming an oxide ceramic layer on the joint surface with a metal member, and a third method of forming a metal layer on the oxide ceramic layer. and a fourth method for joining the non-oxide ceramic member and the metal member, and among the first to third methods, the first and second methods are performed simultaneously. In particular, the oxide ceramic layer and the metal layer are preferably formed of a material having a coefficient of thermal expansion intermediate between that of the non-oxide ceramic member and the metal member to be bonded.
以下、非酸化物セラミツクスの一例として窒化
珪素について説明する。
Silicon nitride will be described below as an example of non-oxide ceramics.
第１図は、ブロツク状の窒化珪素部材１とブロ
ツク状の鋼部材２との接合部構造を示す図であ
り、窒化珪素部材１は、その接合面に形成されて
一体化した任意厚さのアルミナ層３およびこのア
ルミナ層３上に形成された金属層４を介し、鋼部
材２にろう付けされている。５は、そのろう材層
である。上記両部材の接合は、まず第２Ａ図に示
すように、窒化珪素部材１上にアルミナ層３を形
成する。このアルミナ層３は、窒化珪素部材１を
成形するとき同時に成形し、焼結して一体化した
ものである。このアルミナ層３は、メタライズを
おこなうためのもので、このアルミナ層３上に
は、たとえばモリブデン粉末にマンガンを加えた
モリブデンペーストを数10μｍの厚さに塗布し、
水素雰囲気中で1300〜1600℃に加熱して、第２Ｂ
図に示す金属層４とする。この金属層４は、ろう
接性をよくするために、さらにその上にニニツケ
ルめつきを施すとよい。つぎに、第２Ｃ図に示す
ように、上記アルミナ層３および金属層４を形成
した窒化珪素部材１を、たとえば銀ろうの如きろ
う材５を介して鋼部材２上に対置し、水素炉中で
加熱（銀ろうの場合約900℃に加熱）してろう付
けする。 FIG. 1 is a diagram showing the joint structure of a block-shaped silicon nitride member 1 and a block-shaped steel member 2. It is brazed to the steel member 2 via an alumina layer 3 and a metal layer 4 formed on the alumina layer 3. 5 is the brazing material layer. To join the two members, first, as shown in FIG. 2A, an alumina layer 3 is formed on the silicon nitride member 1. This alumina layer 3 is molded at the same time as the silicon nitride member 1 is molded, and is sintered and integrated. This alumina layer 3 is for metallizing, and on this alumina layer 3, for example, molybdenum paste made by adding manganese to molybdenum powder is applied to a thickness of several tens of μm.
Heating to 1300-1600℃ in hydrogen atmosphere, No. 2B
The metal layer 4 shown in the figure is assumed. In order to improve the solderability of this metal layer 4, it is preferable to further apply nickel plating thereon. Next, as shown in FIG. 2C, the silicon nitride member 1 on which the alumina layer 3 and metal layer 4 have been formed is placed on a steel member 2 via a brazing filler metal 5 such as silver solder, and placed in a hydrogen furnace. Heat (approximately 900℃ for silver solder) and braze.
上述のように、窒化珪素部材１上に酸化物セラ
ミツクスであるアルミナ層３を形成し、このアル
ミナ層３上に金属層４を形成すると、窒化珪素部
材１を、鋼部材２に強固にろう付けすることがで
きる。すなわち、これは金属と非酸化物セラミツ
クスとは一般に強く接合することはできないが、
酸化物セラミツクスとは強く接合することを利用
している。したがつて、窒化珪素部材１とアルミ
ナ層３は、成形後の焼成により強固に一体化し、
このアルミナ層３が金属層４を介して鋼部材２に
強く接合できることにより、窒化珪素部材１と鋼
部材２を強固に接合したものである。また、上記
のようにアルミナ層３およびモリブデンからなる
金属層４を介して両部材１，２を接合すると、窒
化珪素の熱膨張係数が３×10-6／℃、鋼の熱膨張
係数が10×10-6／℃であるのに対し、中間に介挿
したアルミナ層３および金属層４はそれぞれ熱膨
張係数が８×10-6／℃、５×10-6／℃であつて、
両部材１，２の中間の熱膨張係数であることか
ら、加熱冷却の熱サイクルを受けても、発生する
熱応力を緩和し、熱疲労破壊を起しにくいものと
することができる。さらに、この実施例において
は、窒化珪素部材１とアルミナ層３とを焼結によ
り一体成形するようにしているので、生産性が向
上する。 As described above, when the alumina layer 3 of oxide ceramics is formed on the silicon nitride member 1 and the metal layer 4 is formed on this alumina layer 3, the silicon nitride member 1 is firmly brazed to the steel member 2. can do. In other words, although metals and non-oxide ceramics generally cannot be strongly bonded,
It takes advantage of the strong bond with oxide ceramics. Therefore, the silicon nitride member 1 and the alumina layer 3 are strongly integrated by firing after molding,
Since this alumina layer 3 can be strongly bonded to the steel member 2 via the metal layer 4, the silicon nitride member 1 and the steel member 2 are firmly bonded. Furthermore, when both members 1 and 2 are joined through the alumina layer 3 and the metal layer 4 made of molybdenum as described above, the coefficient of thermal expansion of silicon nitride is 3 × 10 -6 /°C, and the coefficient of thermal expansion of steel is 10. ×10 -6 /°C, whereas the alumina layer 3 and metal layer 4 inserted in the middle have thermal expansion coefficients of 8 × 10 -6 /°C and 5 × 10 -6 /°C, respectively.
Since the coefficient of thermal expansion is intermediate between the two members 1 and 2, even if subjected to thermal cycles of heating and cooling, the generated thermal stress can be alleviated and thermal fatigue failure can be made less likely to occur. Furthermore, in this embodiment, since the silicon nitride member 1 and the alumina layer 3 are integrally formed by sintering, productivity is improved.
なお上記実施例では、窒化珪素部材１とアルミ
ナ層３を焼結して一体化したのちに、メタライズ
により金属層４を形成する方法について述べた
が、この金属層４は、アルミナ層３を焼結する前
にたとえばモリブデンペーストを塗布して、アル
ミナ層３の焼結または窒化珪素部材１とアルミナ
層３を焼結するとき同時に形成してもよい。こう
することにより、生産性が一層向上する。また、
窒化珪素部材１上のアルミナ層３の代りにベリリ
ヤなど他の酸化物セラミツクスで形成してもよ
い。さらに、上記実施例は、窒化珪素部材１と鋼
部材２との接合について述べたが、これら接合部
材は他の非酸化物セラミツクスおよび金属でもよ
い。 In the above embodiment, a method was described in which the silicon nitride member 1 and the alumina layer 3 were sintered and integrated, and then the metal layer 4 was formed by metallization. For example, a molybdenum paste may be applied before sintering, and the alumina layer 3 may be formed simultaneously when the alumina layer 3 is sintered or when the silicon nitride member 1 and the alumina layer 3 are sintered. This further improves productivity. Also,
Instead of the alumina layer 3 on the silicon nitride member 1, other oxide ceramics such as beryllia may be used. Furthermore, although the above embodiment describes the joining of the silicon nitride member 1 and the steel member 2, these joining members may be made of other non-oxide ceramics or metals.
本発明の方法によれば、従来強固に接合するこ
とができなかつた非酸化物セラミツクス部材と金
属部材との接合を強く接合することができ、有用
な構造材料にすることができる。また、少なくと
も非酸化物セラミツクス部材と酸化物セラミツク
ス層を一体成形するようにしていることにより、
生産性が向上し、コスト低減に寄与することがで
きる。また、非酸化物セラミツクス部材と金属部
材との間に中間の熱膨張係数を有する酸化物セラ
ミツクスと金属を介挿すると、接合部に熱サイク
ルが加わつても、発生する熱応力を緩和し破損し
にくいものとすることができる。
According to the method of the present invention, it is possible to strongly bond a non-oxide ceramic member and a metal member, which could not be firmly bonded in the past, and it is possible to make a useful structural material. Furthermore, by integrally molding at least the non-oxide ceramic member and the oxide ceramic layer,
It can improve productivity and contribute to cost reduction. In addition, inserting an oxide ceramic and a metal that have an intermediate coefficient of thermal expansion between a non-oxide ceramic member and a metal member will alleviate the thermal stress that occurs even if a thermal cycle is applied to the joint and prevent damage. It can be made difficult.
第１図はこの発明の一実施例を説明するための
側面図、第２図Ａ図〜Ｃ図はそれぞれこの発明の
接合方法を説明するための一実施例図である。
１：窒化珪素部材（第２接合部材）、２：鋼部
材（第１接合部材）、３：アルミナ層（酸化物セ
ラミツクス層）、４：金属層、５：ろう材。
FIG. 1 is a side view for explaining an embodiment of the present invention, and FIGS. 2A to 2C are views for explaining an embodiment of the joining method of the present invention. 1: silicon nitride member (second bonding member), 2: steel member (first bonding member), 3: alumina layer (oxide ceramic layer), 4: metal layer, 5: brazing filler metal.
Claims (1)
接合部材を非酸化物セラミツクスにより形成する
第１の方法と、上記第２接合部材の上記第１接合
部材との接合面に酸化物セラミツクス層を形成す
る第２の方法と、上記酸化物セラミツクス層に金
属層を形成する第３の方法と、上記第１接合部材
をろう材を介して上記金属層にろう接する第４の
方法とからなり、上記第１の方法及び上記第２の
方法及び上記第３の方法のうち、少なくとも上記
第１の方法及び第２の方法を焼結により同時に行
うことを特徴とするセラミツクスと金属との接合
方法。 ２ 酸化物セラミツクス層及び金属層は、第１接
合部材と第２の接合部材との中間の熱膨張係数を
有することを特徴とする特許請求の範囲第１項記
載のセラミツクスと金属との接合方法。[Claims] 1. A second bonding member to which a first bonding member made of metal is bonded.
A first method of forming the bonding member from non-oxide ceramics; a second method of forming an oxide ceramic layer on the bonding surface of the second bonding member with the first bonding member; and a second method of forming the bonding member with the first bonding member. a third method of forming a metal layer on the metal layer, and a fourth method of brazing the first joining member to the metal layer via a brazing material, A method for joining ceramics and metal, which comprises performing at least the first method and the second method simultaneously by sintering, of the third method. 2. The method of joining ceramics and metal according to claim 1, wherein the oxide ceramic layer and the metal layer have a coefficient of thermal expansion intermediate between that of the first joining member and the second joining member. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20769482A JPS59102876A (en) | 1982-11-29 | 1982-11-29 | Ceramics metal bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20769482A JPS59102876A (en) | 1982-11-29 | 1982-11-29 | Ceramics metal bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59102876A JPS59102876A (en) | 1984-06-14 |
| JPH0240631B2 true JPH0240631B2 (en) | 1990-09-12 |
Family
ID=16544021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20769482A Granted JPS59102876A (en) | 1982-11-29 | 1982-11-29 | Ceramics metal bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59102876A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6178205U (en) * | 1984-10-29 | 1986-05-26 | ||
| JPS61275512A (en) * | 1985-05-30 | 1986-12-05 | Nippon Kokan Kk <Nkk> | Engine component and manufacture thereof |
| JPH0829457B2 (en) * | 1993-10-15 | 1996-03-27 | 工業技術院長 | Method for manufacturing bonded body of ceramics and metal material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53102310A (en) * | 1977-02-18 | 1978-09-06 | Tokyo Shibaura Electric Co | Heat conducting base plates |
-
1982
- 1982-11-29 JP JP20769482A patent/JPS59102876A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53102310A (en) * | 1977-02-18 | 1978-09-06 | Tokyo Shibaura Electric Co | Heat conducting base plates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59102876A (en) | 1984-06-14 |
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