JPS53102310A - Heat conducting base plates - Google Patents

Heat conducting base plates

Info

Publication number
JPS53102310A
JPS53102310A JP1603477A JP1603477A JPS53102310A JP S53102310 A JPS53102310 A JP S53102310A JP 1603477 A JP1603477 A JP 1603477A JP 1603477 A JP1603477 A JP 1603477A JP S53102310 A JPS53102310 A JP S53102310A
Authority
JP
Japan
Prior art keywords
heat conducting
base plates
conducting base
plates
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1603477A
Other languages
Japanese (ja)
Other versions
JPS5811390B2 (en
Inventor
Katsutoshi Yoneya
Takao Oota
Haruo Kudou
Yasuyuki Sugiura
Hachirou Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP1603477A priority Critical patent/JPS5811390B2/en
Publication of JPS53102310A publication Critical patent/JPS53102310A/en
Publication of JPS5811390B2 publication Critical patent/JPS5811390B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Powder Metallurgy (AREA)
JP1603477A 1977-02-18 1977-02-18 Method of manufacturing thermally conductive substrate Expired JPS5811390B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1603477A JPS5811390B2 (en) 1977-02-18 1977-02-18 Method of manufacturing thermally conductive substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1603477A JPS5811390B2 (en) 1977-02-18 1977-02-18 Method of manufacturing thermally conductive substrate

Publications (2)

Publication Number Publication Date
JPS53102310A true JPS53102310A (en) 1978-09-06
JPS5811390B2 JPS5811390B2 (en) 1983-03-02

Family

ID=11905280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1603477A Expired JPS5811390B2 (en) 1977-02-18 1977-02-18 Method of manufacturing thermally conductive substrate

Country Status (1)

Country Link
JP (1) JPS5811390B2 (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848926A (en) * 1981-09-18 1983-03-23 Hitachi Ltd Insulated type semiconductor device
JPS58183244A (en) * 1982-04-22 1983-10-26 工業技術院長 Heat-resistant composite material
JPS5946036A (en) * 1982-09-09 1984-03-15 Hitachi Ltd Insulating type semiconductor device
JPS59102876A (en) * 1982-11-29 1984-06-14 株式会社東芝 Ceramics metal bonding method
JPS59121175A (en) * 1982-12-28 1984-07-13 株式会社東芝 Manufacture of heat radiator
JPS6032343A (en) * 1983-08-02 1985-02-19 Toshiba Corp Power semiconductor module substrate
JPS60178647A (en) * 1984-02-27 1985-09-12 Toshiba Corp Semiconductor device
JPS617647A (en) * 1984-06-21 1986-01-14 Toshiba Corp Circuit substrate
JPS6135528A (en) * 1984-07-27 1986-02-20 Nec Corp Semiconductor device
JPS6138941U (en) * 1984-08-10 1986-03-11 イビデン株式会社 ceramic substrate
JPS6184089A (en) * 1984-10-01 1986-04-28 株式会社東芝 High heat conductive circuit board
JPS6184036A (en) * 1984-09-30 1986-04-28 Toshiba Corp Heat-conductive aln ceramics substrate
JPS61119051A (en) * 1984-11-15 1986-06-06 Nec Corp Semiconductor device
EP0235682A2 (en) * 1986-02-20 1987-09-09 Kabushiki Kaisha Toshiba Aluminium nitride sintered body having conductive metallized layer
JPS62232149A (en) * 1986-03-31 1987-10-12 Ibiden Co Ltd Interconnection substrate comprising sintered body of aluminum nitride and manufacture thereof
JPS6351662A (en) * 1986-08-21 1988-03-04 Toshiba Corp Aluminum nitride substrate and manufacture thereof
JPS63313842A (en) * 1988-04-28 1988-12-21 Hitachi Ltd Substrate for mounting semiconductor device and semiconductor device
JPH02199075A (en) * 1989-12-15 1990-08-07 Toshiba Corp Joined product of ceramic and metal
WO1993007306A1 (en) * 1991-10-03 1993-04-15 Motorola, Inc. Adherent metal coating for aluminum nitride surfaces
US5529852A (en) * 1987-01-26 1996-06-25 Sumitomo Electric Industries, Ltd. Aluminum nitride sintered body having a metallized coating layer on its surface
JP2004162147A (en) * 2002-11-15 2004-06-10 Plasma Giken Kogyo Kk Aluminum nitride sintered body having thermal-sprayed coating
JP2018090488A (en) * 2013-03-07 2018-06-14 国立研究開発法人産業技術総合研究所 Method for joining ceramic member and aluminum member, and joined body

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06387B2 (en) * 1986-05-29 1994-01-05 富士通株式会社 Glass / ceramic substrate

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848926A (en) * 1981-09-18 1983-03-23 Hitachi Ltd Insulated type semiconductor device
JPS6155863B2 (en) * 1982-04-22 1986-11-29 Kogyo Gijutsuin
JPS58183244A (en) * 1982-04-22 1983-10-26 工業技術院長 Heat-resistant composite material
JPS5946036A (en) * 1982-09-09 1984-03-15 Hitachi Ltd Insulating type semiconductor device
JPS59102876A (en) * 1982-11-29 1984-06-14 株式会社東芝 Ceramics metal bonding method
JPH0240631B2 (en) * 1982-11-29 1990-09-12 Tokyo Shibaura Electric Co
JPS59121175A (en) * 1982-12-28 1984-07-13 株式会社東芝 Manufacture of heat radiator
JPH0359036B2 (en) * 1982-12-28 1991-09-09 Tokyo Shibaura Electric Co
JPS6032343A (en) * 1983-08-02 1985-02-19 Toshiba Corp Power semiconductor module substrate
JPH0586662B2 (en) * 1983-08-02 1993-12-13 Tokyo Shibaura Electric Co
JPS60178647A (en) * 1984-02-27 1985-09-12 Toshiba Corp Semiconductor device
JPS617647A (en) * 1984-06-21 1986-01-14 Toshiba Corp Circuit substrate
JPS6135528A (en) * 1984-07-27 1986-02-20 Nec Corp Semiconductor device
JPH0315828B2 (en) * 1984-07-27 1991-03-04 Nippon Electric Co
JPS6138941U (en) * 1984-08-10 1986-03-11 イビデン株式会社 ceramic substrate
JPS6184036A (en) * 1984-09-30 1986-04-28 Toshiba Corp Heat-conductive aln ceramics substrate
JPS6184089A (en) * 1984-10-01 1986-04-28 株式会社東芝 High heat conductive circuit board
JPS61119051A (en) * 1984-11-15 1986-06-06 Nec Corp Semiconductor device
EP0235682A2 (en) * 1986-02-20 1987-09-09 Kabushiki Kaisha Toshiba Aluminium nitride sintered body having conductive metallized layer
JPH0680747B2 (en) * 1986-03-31 1994-10-12 イビデン株式会社 Wiring board made of aluminum nitride sintered material and method for manufacturing the same
JPS62232149A (en) * 1986-03-31 1987-10-12 Ibiden Co Ltd Interconnection substrate comprising sintered body of aluminum nitride and manufacture thereof
JPS6351662A (en) * 1986-08-21 1988-03-04 Toshiba Corp Aluminum nitride substrate and manufacture thereof
JPH0459779B2 (en) * 1986-08-21 1992-09-24 Tokyo Shibaura Electric Co
US5529852A (en) * 1987-01-26 1996-06-25 Sumitomo Electric Industries, Ltd. Aluminum nitride sintered body having a metallized coating layer on its surface
JPH0470776B2 (en) * 1988-04-28 1992-11-11 Hitachi Ltd
JPS63313842A (en) * 1988-04-28 1988-12-21 Hitachi Ltd Substrate for mounting semiconductor device and semiconductor device
JPH0460946B2 (en) * 1989-12-15 1992-09-29 Tokyo Shibaura Electric Co
JPH02199075A (en) * 1989-12-15 1990-08-07 Toshiba Corp Joined product of ceramic and metal
WO1993007306A1 (en) * 1991-10-03 1993-04-15 Motorola, Inc. Adherent metal coating for aluminum nitride surfaces
US5217589A (en) * 1991-10-03 1993-06-08 Motorola, Inc. Method of adherent metal coating for aluminum nitride surfaces
JP2004162147A (en) * 2002-11-15 2004-06-10 Plasma Giken Kogyo Kk Aluminum nitride sintered body having thermal-sprayed coating
JP2018090488A (en) * 2013-03-07 2018-06-14 国立研究開発法人産業技術総合研究所 Method for joining ceramic member and aluminum member, and joined body

Also Published As

Publication number Publication date
JPS5811390B2 (en) 1983-03-02

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