JPS6270274A - Method for bonding ceramics and metal member - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a method for joining ceramics and metal members.

More specifically, the present invention relates to a method for joining ceramic materials having metallized layers on their surfaces, such as copper, nickel, steel, molybdenum, tungsten, and other metal members.

(Prior technology) Traditionally, semiconductor element packages, integrated circuit boards, and structural parts (magnetron envelopes, hermetic terminals, electron tubes)
A bonded body made by bonding ceramics and metal members is used in such applications.

Conventionally, as shown in FIG. 2, a ceramic 1 having a metallized layer 2 and a metal member 3 having a larger facing area than the ceramic 1 were joined via a brazing filler metal 4. Due to the difference in expansion coefficient, cracks 6 form from the edge of the metallized layer 2 to the inside of the ceramic 1.
There were drawbacks such as the ceramics 1 being destroyed and the bonding strength being reduced.

In order to solve these drawbacks, Japanese Patent Application Laid-Open No. 59-1028
As described in Publication No. 76, a material (an oxide ceramic layer and a metal layer) having a coefficient of thermal expansion between that of the non-oxide ceramic and the metal member is interposed between the non-oxide ceramic and the metal member. How to join 1% Kasho 6
As described in Publication No. 0-90877, Si
A method has been proposed in which a thin metal plate with a low thermal expansion coefficient is brazed on the metallized surface of a C sintered body, and the metal plate is bonded to another metal member via the low thermal expansion metal plate, leaving a part of the non-bonded part. .

(Problems to be Solved by the Invention) However, in the method shown in JP-A-59-102876 and the method shown in JP-A-60-90877, bonding is performed through an intermediate layer, so There was a drawback that metal members could not be joined.

It is something.

(Means for Solving the Problem) As a result of repeated research on the above-mentioned drawbacks, the present inventors found that by creating a recess in the opposing metal member at the end of the ceramic metallized layer, the facing area of the ceramic can be increased. It has been discovered that even if a metal member with a large diameter is used, the ceramic and the metal member can be directly bonded via a brazing filler metal without any drawbacks such as destruction of the ceramic or reduction in bonding strength.

The present invention provides a method for multiple joining ceramics having a metallized layer on the surface and a metal member using a brazing material, in which a recess is formed in the metal member at a portion facing the end of the metallized layer, and the metallized layer and the metal member are bonded together. The present invention relates to a method for joining ceramics and a metal member, characterized by joining them through a brazing material.

There are no particular restrictions on the type of ceramic used in the present invention, but non-oxide ceramics, such as silicon carbide and aluminum nitride, generally have a small coefficient of thermal expansion, as well as oxide ceramics.

Silicon nitride and the like are preferred.

Also, the method for forming the metallized layer is Mo4 Nobuden.

Methods include a method of applying a paste containing a high melting point metal such as tungsten as a main component and firing, a method of directly plating copper, nickel, etc. on ceramics, a physical vapor deposition method, but there are no particular limitations in the present invention.

Furthermore, the brazing materials used in the present invention include silver-copper eutectic brazing, silver brazing, copper brazing, and gold brazing, and the metal members include copper, nickel, steel, and molybdenum.

Tungsten or the like is used.

The depth of the recess formed in the metal member shall be appropriately determined depending on the thickness of the metal member used.9For example, if the thickness of the metal member is 0.5, it is preferably approximately 30 μm thick. 50-200 μm for 1 tower, 50 μm for 2 m
A thickness of ~500 μm is preferred. Further, there is no particular restriction on the shape of the recess.

(Example) An example of the present invention will be described below with reference to FIG. 1 of the drawings.

Example 1 As a ceramic, the dimensions shown in Fig. 1 (extension) are 20 w.
Molybdenum paste was screen printed on a silicon carbide substrate (manufactured by Hitachi Yosakusho, trade name 5C-101) 7 with dimensions of 18 mm x 18 mm and 20 μm thick, and then placed in a weakly reducing atmosphere. at 1300℃
After firing for 1 hour, electroless nickel plating (product name S-680, manufactured by Nippon Kanigen) was applied to a thickness of 2 μm to form a metallized layer 2 as shown in FIG. 1(b).

On the other hand, the dimensions shown in Figure 1 (C) are 40 holes x 401 m1+
.

When the silicon carbide substrate 7 is bonded to the oxygen-free copper plate 8 using a 2-thick oxygen-free copper plate 8, the portion of the oxygen-free copper plate 8 facing the end of the metallized layer 2 is partially coated with a ferric chloride aqueous solution. The recess 5 was formed by etching. Note that the width of the recess is 2
-2-, the depth was 50 μm. Also, the dimensions of the metal member to be joined to the metallized layer 2 are 17.6m x
It was set at 17.6m.

Next, a silver-steel eutectic solder was interposed between the metal member 8 with the recess 5 formed thereon and the silicon carbide substrate 7 provided with the metallized layer 2, and heated at 850° C. for 10 minutes in an H2 atmosphere, as shown in FIG. d
), silicon carbide substrate 7 and oxygen-free copper plate 8 were bonded. For comparison, similar bonding was also performed on an unetched oxygen-free copper plate. In the case of the comparative example, the ceramic tube broke after bonding, but in the case of the bonded oxygen-free copper plate with recesses formed, no cracks were observed even when the cross section was observed. Note that 4 in (dl) in FIG. 1 is a brazing material.

Example 2 A silicon carbide substrate having a metallized layer used in Example 1 was coated with nickel plating (manufactured by Nippon Kanigen, product name S-68) on a molybdenum plate having the same shape as the oxygen-free copper plate used in Example 1.
0) to a thickness of 3 μm.

Thereafter, a silicon carbide substrate and an oxygen-free copper plate were bonded together in the same manner as in Example 1. For comparison, similar bonding was also performed on a nickel-plated molybdenum plate without any recesses. In the case of the comparative example, cracks were observed from the edges of the metallized layer when the cross section was observed, but no cracks were observed in the case where the molybdenum plates with recesses were bonded.

Example 3 A 96-chialumina substrate having the same shape as in Example 1 as a ceramic (manufactured by Hitachi Chemical Co., Ltd., trade name Halotsukusuna 552)
A molybdenum paste was screen printed on this substrate in the same manner as in Example 1, and 1,
After firing at 450° C. for 1 hour, nickel plating was applied in the same manner as in Example 1 to form a metallized layer. Also, as a metal member.

The oxygen-free copper plate used in Example 1 in which the recessed portions were formed was used.

These were joined in the same manner as in Example 1.

Note that, for comparison, similar bonding was also performed on an oxygen-free copper plate in which no recesses were formed. In either case, no cracks from the metallized edges were observed after bonding. Therefore, 100 cycles of a thermal shock test in a liquid of -65°C to +150°C were conducted.

In the case of the comparative example, cracks were observed from the metallized edges, but no cracks were observed in the bonded product in which the recesses were formed.

(Effects of the Invention) According to the joining method of the present invention, it is possible to destroy ceramics.

[Brief explanation of drawings]

1), fbl, FC+, and (dl are cross-sectional views showing the manufacturing process of a joined body of ceramic and metal members according to an embodiment of the present invention, and FIG. 2 shows a joined body joined by a conventional method. It is a cross-sectional view showing.Explanation of symbols 1... Ceramic 2... Metallized layer 3
... Metal member 4 ... Brazing material 5 ... Concave M
6 ”' Crack 7...Silicon carbide substrate 8...Oxygen-free copper plate agent Patent attorney Wakabayashi
Kunihiko. Kuzu 1 Figure 2 (21 Written amendment dated IO, 1985, 24th October 1985 2, Name of the invention, Method for joining ceramics and metal members 3, Relationship with the case of the person making the amendment Name of patent applicant (4451-day I Kasei Kogyo) Co., Ltd. 5, Detailed Description of the Invention Column 6 of the Specification Subject to Amendment, Contents of the Amendment (2) On page 7, lines 3 to 4, "oxygen-free copper plate" was replaced with "molybdenum plate" The above written amendment (voluntary), March 14, 1985, Commissioner of the Japan Patent Office, Part 1, Indication of the case, 1985 Patent Application No. 207162, 2, Name of the invention: Method for joining ceramics and metal members 3. Relationship with the case of the person making the amendment Patent applicant name (4451 Hitachi Chemical Co., Ltd. (1) In the specification of the present application, page 6, line 7, "metal member 8" is replaced with "oxygen-free copper plate 8") (2) On page 8, line 10, line 12, line 16, and line 20, the word "ceramic" will be corrected to "ceramics."

Claims (1)

[Claims] 1. In a method of joining ceramics with a metallized layer on the surface and a metal member using a brazing filler metal, a recess is formed in the metal member at a portion facing the end of the metallized layer, and a recess is formed between the metallized layer and the metal member. A method for joining ceramics and metal members, characterized by joining through a brazing filler metal.