JP3388617B2 - Thyristor container manufacturing method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thyristor container made of a ceramic material and a metal material. The method of the present invention can be used when the members of an optical thyristor container that performs switching by light are joined by a raw material to manufacture the above container. 2. Description of the Related Art In a conventional thyristor container which does not perform switching by light, a brazing material having the same melting point is disposed at all joints, and the entire brazing is performed by temporary heating.
However, in an optical thyristor container that performs switching by light, the accuracy of the brazing position of the light introducing member made of sapphire is very important, and the center line of the light introducing member and the fixing member that supports the light introducing member must be accurately aligned. In the conventional method of heating and joining the entire container at a time, it is difficult to perform brazing with high accuracy, and the thyristor malfunctions due to a reduction in the light transmission area due to the relative eccentricity and inclination of the two. It is likely to be. [0003] The present invention solves the above-mentioned problems, and provides a light introducing member and a member for fixing the light introducing member in an optical thyristor container with excellent positional accuracy and airtightness. An object of the present invention is to provide a method for manufacturing an optical thyristor container with less malfunction by performing bonding while realizing the properties and bonding strength. The inventors of the present invention have studied various methods for brazing an optical thyristor container to a light introducing member, which require accurate positional accuracy but is difficult to do so. As a result, first, the light-introducing member is brazed to the fixing member with a high-melting-point brazing material, and then the other joining portions of the container are brazed with a low-melting-point brazing material. The inventors have found that the above problems can be solved, and have completed the present invention. That is, according to the method for manufacturing a thyristor container of the present invention, the light introducing port is provided on the bottom surface, the flange is provided on the outer periphery on the upper end open side, and the light introducing port of the container-shaped metal fixing member is provided. In the method for manufacturing a thyristor container in which a plate-shaped sapphire light introducing member is joined with a raw material,
The fixing member and the light introducing member are joined by a high melting point low material having a melting point of 950 ° C. or less, and then a metal cylinder is provided on the inner surface side of the flange portion of the fixing member to which the light introducing member is joined. One end side of the body is inserted, the other end side of the metal cylindrical body is inserted into a through hole provided in a peripheral wall of the ceramic cylindrical body, and then the fixing member to which the light introducing member is joined. And the metal cylinder , the metal cylinder and the ceramic cylinder, one end face of the ceramic cylinder and a ring-shaped flange member, the other end face of the ceramic cylinder and a ring-shaped cushion material , and Periphery of the inner opening of the cushion material
And the metal lid member is joined by heating with a low melting point material to a temperature lower than the melting point of the high melting point material. [0006] Among the constituent members of the thyristor container obtained by the production method of the present invention, the above-mentioned "fixing member", "metal cylinder", "ring-shaped flange member", "cushion material" and "lid member". Are made of metallic materials, and are fernico-based alloys known as "Kovar", 42N
In addition to a metal material usually used as a bonding material with a ceramic material such as an i-Fe alloy and copper, stainless steel or the like can be used depending on the bonding method, but the lid member is usually made of copper.
As a material for each of the other members, a fernico alloy is often used. It is to be noted that a flange portion is provided on the metal cylinder, and the flange portion and the outer surface of the flange portion of the fixing member and the outer peripheral surface of the through hole of the ceramic cylinder can be joined with a low material. preferable. As a result, the airtightness of the most complicated structure of the optical thyristor container is more assured. [0007] As the "sapphire" serving as the "light introducing member", those commonly used as industrial materials can be used. Usually, a metallized layer and a nickel plating layer on the surface are provided on the joint surface of the light-introducing member with the fixing member, and are joined by a “high-melting-point material”. The melting point of the material is 950 ° C. or less ”. If the melting point exceeds 950 ° C., the raw material component diffuses and penetrates into the metallized layer on the sapphire surface, and the bonding strength at the interface between the sapphire and the metallized layer is undesirably reduced. Examples of the above-mentioned "high melting point brazing material having a melting point of 950 ° C. or less" include, for example, silver brazing (in the case of main silver brazing specified in Japanese Industrial Standards, the appropriate brazing temperature depends on the composition; Among the so-called hard brazing materials such as a brazing brazing brazing brazing brazing brazing brazing brazing brazing brazing brazing brazing brazing brazing brazing brazing braze brazing brazing brass brazing brass brazing brass brazing brass brazing brass brazing brass brazing brass brass brazing brass brazing brass brass brass brazing brass brass brazing brass brass brass brazing brass brazing brass , Melting point 950
It can be used by selecting ones below ℃. Further, in order to enhance the heat resistance of the obtained thyristor container, it is preferable that the melting point of the low melting point material is not too low, and in view of this point, the melting point of the high melting point material is 800 ° C. or more, especially 85 ° C.
The temperature is preferably 0 ° C. or higher. Further, as the above-mentioned "low melting point raw material", a grade having a melting point lower than the melting point of the grade used as the high melting point raw material by 20 to 200 ° C, preferably about 50 to 150 ° C is selected from each of the above waxes. I just need. The difference in the melting point is preferable because the high melting point material is thermally stable during the heat joining of the low melting point material, and the resulting container also has excellent heat resistance. The ceramic material constituting the "ceramic cylindrical body" includes oxide ceramic materials such as alumina and mullite; nitride ceramic materials such as silicon nitride and sialon; and carbide ceramic materials such as silicon carbide. And a ceramic material usually used as a joint with a metal such as a single crystal such as sapphire. Among them, oxide-based ceramic materials are often used because they are inexpensive, have a relatively large coefficient of thermal expansion, have low residual stress in joining with metals, and are resistant to acids and alkalis. You. The metallizing material for forming the metallized layer includes Mo-Mn, Mo-Mn-Ti, WM
n, W-Mn-Ti, Mo-SiO 2, Mo-CaO-
SiO ₂ , Mo—MnO ₂ —TiO ₂ , W—SiO ₂ ,
_{W-CaO-SiO 2, W} -MnO 2 -TiO 2, Mo
—MnO ₂ —TiO ₂ —SiO ₂ , W—Re—MnO ₂
It can be used without any particular limitation of the sequence, such as -TiO _2. The metallizing material on sapphire includes powder of a high melting point metal such as molybdenum and tungsten, SiO ₂ powder and Mn powder, and when the total solid content of the metallizing material is 100 parts by weight,
₍₂₎ The content of the powder is 2 to 8 parts by weight, and the content of the Mn powder is 3 to 15 parts by weight, the sapphire, the metallized layer, the nickel plating layer are most excellent in the bonding strength and airtightness between the respective materials. And particularly preferred. Since sapphire containing substantially no impurities is colorless and transparent, conventionally, besides the optical thyristor container,
It is used as a semiconductor package, a window of a high vacuum chamber, and the like. In particular, in a semiconductor package that requires high-quality characteristics (high-frequency characteristics, thermal conductivity, and the like), the main body of the package itself may be made of sapphire. Then, a metallized layer and a nickel plating layer are usually formed on the surface of the sapphire, and the nickel plating layer and the metal material are joined with a brazing material interposed therebetween. In this production method, sapphire and a member for fixing the sapphire are joined in advance with a high melting point material, and then the entire container is joined with a low melting point material. Therefore, brazing can be performed while minimizing the eccentricity and inclination between sapphire and the metal material fixing the sapphire, and a sufficient and accurate light transmission amount can be secured. In addition, by limiting the melting point of the high melting point material, diffusion and intrusion of the low component into the metallized layer can be suppressed, and a container having excellent airtightness and bonding strength can be obtained. Embodiments of the present invention will be described below in detail with reference to the drawings. (1) Joining of the light introducing member and a metal member for fixing the light introducing member First, 86.5 parts by weight of Mo powder (hereinafter, referred to as "part") are provided on the periphery of one surface of the disc-shaped light introducing member 1 made of sapphire. A metallizing material layer (not shown) consisting of 5.0 parts of SiO ₂ powder, 7.3 parts of Mn powder and 1.2 parts of TiH ₂ powder is formed, and then a nickel plating layer ( (Not shown). Next, a high melting point low material (Ag-15Cu) is applied to the inner peripheral surface of the light introducing port 31.
The fixing member 3 for fixing the light introducing member 1 made of a fernico-based alloy (trade name “Kovar”) provided with the layer 2 made of an alloy) is left standing with the light introducing port 31 as a lower surface. The light introducing member 1 was placed so that the nickel plating layer and the brazing material layer 2 were in contact with each other, and were heated to 900 ° C. and brazed. FIG. 1 shows a state before the heat bonding in which the fixing member 3 and the light introducing member 1 are arranged via the brazing material layer 2. (2) Fixing member to which the light introducing member is joined in (1) above and other members and joining of other members. Following (1), fixing member 3 in which the light introducing member 1 is joined. A flange portion 41 is provided on the inner surface side of the flange portion 32 at a position close to one end portion side, and a surface of the flange portion 41 facing the flange portion 32 of the fixing member 3 has a low melting point low material (Ag-Cu). An outer peripheral insulating member made of a ceramic material mainly composed of Al ₂ O ₃ is inserted at one end of the pipe 4 made of a fernico alloy, on which a layer 5 made of eutectic is formed. 6 was fitted in a through hole 61 in which a layer 5 made of a low-melting-point material was formed on the entire inner peripheral surface. After that, a layer 5 made of a low melting point low material was provided on both end surfaces of the outer peripheral insulating member 6 of the light guide member 1, the fixing member 3, the pipe 4, and the outer peripheral insulating member 6. Next, one end surface is placed on the surface of the ring-shaped flange 7 made of a fernico alloy, and then, on the other end surface, a ring-shaped cushion material 8 made of a fernico alloy is placed. The copper block 9 was placed on the layer 5 made of the low melting point low material provided on the peripheral edge of the inner opening, and assembled as shown in FIG. This assembly was heated to 830 ° C. to join the joints to produce an optical thyristor container. When the optical thyristor container is manufactured by brazing by heating the assembly as shown in FIG. 2, the method of joining the entire container at once without joining the light introducing member to the fixing member in advance is a method of manufacturing the optical thyristor container. The light introduction member located on the side surface and located between the light introduction port of the fixing member and the end of the cylindrical body inserted on the side opposite thereto is very difficult to support at an accurate position, It is not easy to join the light introducing member and the fixing member without eccentricity. Moreover, this part is a light introduction part for thyristor switching,
A slight eccentricity or inclination of those members also causes a malfunction of the thyristor. In the above-mentioned embodiment manufactured by the method of the present invention, the above-mentioned problems are solved and the optical thyristor container having excellent performance is obtained by joining the members constituting the light introducing portion in the state shown in FIG. 1 in advance. Can be. It should be noted that the present invention is not limited to the specific embodiments described above, but can be variously modified within the scope of the present invention according to the purpose and application. According to the method of the present invention, the light introducing member, which is difficult to be supported at an accurate position at the time of joining since it becomes the inner surface of the fixing member, has a precise positional relationship with the fixing member. In addition, by setting the melting point of the high melting point material to 950 ° C. or less, the joining strength at the interface between the sapphire and the metallized layer is not impaired, and the positional accuracy, airtightness, and joining strength are all reduced. An excellent thyristor container is obtained.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a state in which a light introducing member is placed on the inner surface of a through hole of a fixing metal member via a layer made of a high melting point low material. FIG. 2 is a cross-sectional view showing a state where the light introducing member and the fixing metal member of FIG. 1 are joined and then assembled with another member via a layer made of a low melting point low material. [Description of Signs] 1; light-introducing member, 2; layer made of high-melting-point raw material, 3;
Fixing member, 31; light inlet, 32; flange, 4;
Pipe; 41; flange portion; 5; layer made of low-melting material; 6; outer peripheral insulating member; 61; through hole; 7; flange; 8; cushion material;

──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. ⁷ Identification code FI H01L 29/74 L (56) References JP-A-63-31139 (JP, A) JP-A-2-87837 (JP, A) JP-A-61-42936 (JP, A) JP-A-5-243410 (JP, A) JP-A-3-236294 (JP, A) Japanese Utility Model Application No. 59-140443 (JP, U) Japanese Utility Model Application No. 64-29838 (JP, U) Japanese Utility Model 1979-535464 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/10 C04B 37/02 G02B 26/00 H01L 23/02 H01L 29 / 74

Claims (1)

(57) [Claims 1] A light introducing port is provided on a bottom surface, a flange portion is provided on an outer periphery on an open upper end side, and the light introducing port of the container-shaped metal fixing member is provided. In the method for manufacturing a thyristor container in which a plate-like sapphire light introducing member is joined to the inner surface with a raw material, the fixing member and the light introducing member are joined with a high melting point material having a melting point of 950 ° C. or less. Then, one end of the metal cylinder is inserted into the inner surface of the flange portion of the fixing member to which the light introducing member is joined, and the other end of the metal cylinder is connected to the ceramic cylinder. The fixing member to which the light introducing member is joined and the metal cylinder , the metal cylinder and the ceramic cylinder, and the ceramic cylinder, which are fitted through through holes provided in the peripheral wall of the body one end face a ring-shaped flange member, the other of the ceramic tubular body End face and ring-shaped cushioning material , and peripheral edge of inner opening of the cushioning material
And joining the metal lid member to the metal lid member by using a low-melting-point brazing material at a temperature lower than the melting point of the high-melting-point brazing material.