JPS60198825A - 極微細パタン形成法 - Google Patents
極微細パタン形成法Info
- Publication number
- JPS60198825A JPS60198825A JP5450484A JP5450484A JPS60198825A JP S60198825 A JPS60198825 A JP S60198825A JP 5450484 A JP5450484 A JP 5450484A JP 5450484 A JP5450484 A JP 5450484A JP S60198825 A JPS60198825 A JP S60198825A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- etching
- film
- substrate
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
- Element Separation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5450484A JPS60198825A (ja) | 1984-03-23 | 1984-03-23 | 極微細パタン形成法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5450484A JPS60198825A (ja) | 1984-03-23 | 1984-03-23 | 極微細パタン形成法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60198825A true JPS60198825A (ja) | 1985-10-08 |
| JPH0438133B2 JPH0438133B2 (cg-RX-API-DMAC7.html) | 1992-06-23 |
Family
ID=12972457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5450484A Granted JPS60198825A (ja) | 1984-03-23 | 1984-03-23 | 極微細パタン形成法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60198825A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994016854A1 (fr) * | 1993-01-19 | 1994-08-04 | Ingenerny Tsentr 'plazmodinamika' | Procede de traitement de la surface d'un article et installation pour ce faire |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57118640A (en) * | 1981-01-16 | 1982-07-23 | Matsushita Electronics Corp | Formation of masking pattern |
-
1984
- 1984-03-23 JP JP5450484A patent/JPS60198825A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57118640A (en) * | 1981-01-16 | 1982-07-23 | Matsushita Electronics Corp | Formation of masking pattern |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994016854A1 (fr) * | 1993-01-19 | 1994-08-04 | Ingenerny Tsentr 'plazmodinamika' | Procede de traitement de la surface d'un article et installation pour ce faire |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438133B2 (cg-RX-API-DMAC7.html) | 1992-06-23 |
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