JPS60198763A - ピン付基板およびその製造方法 - Google Patents

ピン付基板およびその製造方法

Info

Publication number
JPS60198763A
JPS60198763A JP59054912A JP5491284A JPS60198763A JP S60198763 A JPS60198763 A JP S60198763A JP 59054912 A JP59054912 A JP 59054912A JP 5491284 A JP5491284 A JP 5491284A JP S60198763 A JPS60198763 A JP S60198763A
Authority
JP
Japan
Prior art keywords
layer
metal
film
substrate
titanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59054912A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0227818B2 (enExample
Inventor
Yuzo Shimada
嶋田　勇三
Kazuaki Uchiumi
和明 内海
Hideo Takamizawa
秀男 高見沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59054912A priority Critical patent/JPS60198763A/ja
Publication of JPS60198763A publication Critical patent/JPS60198763A/ja
Publication of JPH0227818B2 publication Critical patent/JPH0227818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59054912A 1984-03-22 1984-03-22 ピン付基板およびその製造方法 Granted JPS60198763A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59054912A JPS60198763A (ja) 1984-03-22 1984-03-22 ピン付基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59054912A JPS60198763A (ja) 1984-03-22 1984-03-22 ピン付基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS60198763A true JPS60198763A (ja) 1985-10-08
JPH0227818B2 JPH0227818B2 (enExample) 1990-06-20

Family

ID=12983809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59054912A Granted JPS60198763A (ja) 1984-03-22 1984-03-22 ピン付基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS60198763A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146958U (enExample) * 1985-03-04 1986-09-10

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119663A (ja) * 1981-12-31 1983-07-16 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 接続ピンの結合方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119663A (ja) * 1981-12-31 1983-07-16 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 接続ピンの結合方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146958U (enExample) * 1985-03-04 1986-09-10

Also Published As

Publication number Publication date
JPH0227818B2 (enExample) 1990-06-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term