JPS60196998A - Method of identifying multilayer circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to a method for identifying multilayer circuit boards.

[Technical background of the invention and its problems] In general, a multilayer circuit board includes a plurality of insulating layers 2a and 2b in addition to conductor pattern layers 1a and 2b on the front and back surfaces, as shown in an enlarged cross section in FIG. ,... between each insulating layer via conductor pattern layers 1b, 1C1...
・ is provided.

These conductor pattern layers 1a, lb, . . . 1n are generally made of copper foil, and the insulating layer is made of a composite material such as glass fiber-epoxy resin, paper-epoxy resin, paper-phenol resin, etc. .

These conductor pattern layers 1a, lb, .

1c, . . . are all etched into predetermined patterns and embedded between the insulating layers 2a, 2b, .

These intermediate conductor patterns fi1b, IC,...
When the multilayer circuit board 3 is completed, it is only slightly visible from the outside, and it is impossible to see through it completely.

When using this multilayer circuit board with various electrical components installed, metal plating (through-hole plating) is applied to the inner surface of the hole drilled from the outside in the conductor pattern of a predetermined layer. can be electrically connected.

Since it is necessary to make the holes reliably at the desired conductor pattern positions, the hole that will normally serve as the reference (inner layer reference hole) must be drilled 2 times in advance.
Make at least one hole and use the position of this inner layer reference hole as a reference.
Drilling is performed at predetermined positions based on C drawing dimensions.

Conventionally, the following method has been adopted as a method for drilling the interior reference hole.

(b) Based on the pattern of the inner layer reference hole of the intermediate layer that slightly appears on the surface layer, first use a counterbore drill 4 to drill a counterbore hole 5 larger than the inner reference hole, as shown in Figure 2. Open accurately to the position of the conductor pattern layer.

As a result, the conductor pattern layer 1b becomes visible at the bottom of the counterbore hole 5, and the exposed conductor pattern 1i1
While visually observing the inner layer reference hole 6 of b, the inner layer reference hole is drilled at a predetermined position through the entire multilayer circuit board.

([]) As shown in FIG. 3, conductor pattern layer 1b
A small piece 7 of vinyl chloride resin film is pasted with adhesive to the inner layer reference hole part of the conductor pattern layer 1b, so that the position of the inner layer reference hole 6 of the conductor pattern layer 1b can be easily seen from the outside even after the multilayer circuit board 3 is completed. and put it in this position (
As in the case of (a), a counter-boring drill is used to drill a hole to expose the position of the inner layer reference hole of the predetermined conductor pattern layer 1b, and then the hole is visually drilled at the position of the inner layer reference hole 6 of the conductor pattern layer 1b. With this method, the position of the inner layer reference hole is easy to see from the outside, and by paying attention to the timing when the spotting drill ejects the small piece 7 of the PVC resin film when counterboring the hole, it is possible to prevent accidentally counterboring too deep. can.

However, in both methods (a) and (b), in order to drill at the position of the inner layer reference hole 6 of the predetermined conductor pattern layer 1b, a large counterbore hole is first drilled at the approximate position and the intermediate conductor is Inner layer reference hole 6 of pattern layer 1b
It requires two steps: exposing the multilayer circuit board 3, and then drilling the inner layer reference hole 6 through the entire multilayer circuit board 3, which is not easy to work with, and especially requires skill in the previous process of drilling the groin hole. The disadvantage was that it was difficult to convert into 9.

Furthermore, if the position of the counterbore hole 5 deviates significantly from the position of the inner layer reference hole 6 as shown in FIG. There was a problem that the formed ``C'' did not look like an appropriate hitting method.

On the other hand, since the conductor pattern of a multilayer circuit board is determined at the time of design, if information regarding the type, inner diameter of the internal reference hole, position, etc. is printed on the multilayer circuit board, the outline of the multilayer circuit board or The position and size of the internal reference hole can be determined based on the position of the conductor pattern exposed from the side part, and it is considered to be convenient in terms of process control.

However, this has the disadvantage that a printing process, equipment, and effort are required for this process.

[Purpose of the Invention] The present invention has been made to solve these conventional drawbacks, and it is possible to obtain information such as the inner diameter and position of the inner layer reference hole of a multilayer circuit board without requiring any special process such as a printing process. It is possible to identify the inner layer and its type, and it is possible to easily drill inner layer reference holes at predetermined positions of the conductor pattern in one process without drilling counterbored holes. Furthermore, it can be used for process control. The purpose of this invention is to provide a method for identifying circuit boards.

[Summary of the Invention] That is, the method for identifying a multilayer circuit board of the present invention consists of (A) identifying the conductor pattern of the intermediate layer on the side of the multilayer circuit board, the type of the multilayer circuit board, and other necessary information regarding the multilayer circuit board; (B) detecting the exposed length and/or spacing of the outer edge of the conductive pattern of the code area; The method is characterized by comprising a step of reading the type of the multilayer circuit board and other necessary information regarding the multilayer circuit board.

[Embodiments of the invention] An embodiment of the present invention will be described below based on the drawings.

FIG. 5 is a plan view conceptually showing a conductor pattern of a general multilayer circuit board.

In FIG. 5, 1 conductor of multilayer circuit board 3! <Turn layer 1
The outer edge of the conductor pattern where the inner layer reference hole 〇 is normally provided is exposed at the outer edge of b, but when forming the conductor pattern, the outer edge of the conductor pattern is A portion without a pattern, that is, a discontinuous portion C of the conductor pattern appears.

This discontinuous portion C was created at the design stage of the multilayer circuit board 3 (
Therefore, the relative positional relationship between the discontinuous portion C and the inner layer reference hole O is determined in advance.

In the present invention, the copper foil exposed at the outer edge has multiple notches at specific lengths/intervals corresponding to codes representing the type of multilayer circuit board, the inner diameter of the interior reference hole, position information, etc. A code area is formed by providing a section by etching or the like.

The correspondence between the code indicating the type of multilayer circuit board and the notch in the copper foil of this multilayer circuit board is as follows:
+, the notch may be set to 0'' and a binary code may be used, or a completely unique code may be used.

The displayed content may include the type of multilayer circuit board, the inner diameter of the interior reference hole, position information, and other arbitrary information.

In this embodiment, after the multilayer circuit board 3 is completed, the four sides of the multilayer circuit board 3 are ground, each side is smoothed, and the conductive pattern layer 1b of the multilayer circuit board 3 is formed. exposed code area.

Next, the positions of the discontinuous points PX and PY on each side of the conductor pattern of the multilayer circuit board 3 are detected, and the above-mentioned code is read.

As means for detecting and reading the positions of these discontinuous points PX, PY, etc., it is convenient to use electrical contacts.
Not limited to this method, for example, optical detection is also possible.

FIG. 6 is a plan view showing an example of a detection device used for such detection, and FIG. 7 is a side view of the same as seen from the v-force direction.

This detection device 8 has a positioning stopper 9 on the top surface.
9, a vacuum suction 111.11 for fixing the multilayer circuit board 3, and 3 silk discontinuities for detecting discontinuities in the conductor pattern layer exposed on the sides of the multilayer circuit board 3. It is composed of a detection device 12.

The discontinuity detection device 12 includes a fluid cylinder 13 disposed along the side of the multilayer circuit board 3 fixed to a vacuum suction cup 11.11, and a piston 14 of the fluid cylinder 13.
A roller-shaped electrical contact 15 fixed to the tip of the electrical contact 15, a scale plate 16 that measures the approximate position of the electrical contact 15, and a detection circuit (not shown) that detects whether or not the conductor pattern of the electrical contact 15 is in contact. and a drilling position control circuit and a code reading circuit that send position signals and detection codes of the electrical contacts to the drive control circuit of the drill to move the drill to the drilling position of the inner layer reference hole. Reference numeral 17 indicates an index of the scale plate, and reference numeral 18 indicates an electrode for supplying a detection voltage to the conductor pattern.

In this detection device 8, first, the multilayer circuit board 3 is positioned by abutting one side against the stopper 9.9, and then is suctioned and fixed to the vacuum suction cup 11.

Next, the electrode 18 is brought into contact with any position other than the code area of the conductive pattern of the multilayer circuit board 3, and the fluid cylinder 1
3 and move the electrical contact 15 at the tip of the piston 14 along each side of the multilayer circuit board 19 with the electric contact 15 in contact with the exposed conductor pattern 1b of the multilayer circuit board 19 as shown in FIG. let

As a result, discontinuity points Px and Py are detected from the electrical disconnection between the electrode 18 and the electrical contact 15, and the contents of the code are read from the code area.

After the position of the discontinuous point on each side is determined in this way and the contents of the code are read, the discontinuous point P in FIG.
The position moved from x and PY by the distances X and Y read from the code area is determined to be the position of the inner layer reference hole.

In addition, in FIG. 9, an 8-bit code area is provided at the outer edge of the conductor pattern, and a notch C' is formed in the copper foil within this area to code.In the example shown in FIG.
It is marked 4 AH in base numbers.

FIG. 10 shows an example in which three types are directly discriminated, and the discrimination is made by the position of the notch C'.

The electrical contact for reading is I as shown in Figure 6.
II! However, the number of contacts corresponding to the number of bits shown in FIGS. 9 and 10 may also be used. In this case, the electrical contact need not be roller-shaped.

Therefore, by positioning the drill and drilling based on this position data, it is possible to drill an inner layer reference hole at a predetermined position.

In addition, if the position of the interior reference hole set along the side is completely parallel to the side, the interior standard can be determined by simply detecting a discontinuity point between two orthogonal sides as described above. It is possible to drill holes, but if necessary, discontinuous points on other sides may also be detected and used as a reference.Also, instead of the discontinuous points mentioned above, the discontinuous points in the code area The interior reference hole may be positioned based on the position of the notch.

Furthermore, it is possible to automatically position the drill based on the position data of this discontinuous point, but if necessary, the position of the discontinuous point can be marked on the multilayer circuit board and the inner layer reference hole can be drawn by drawing. It is also possible to manually drill the inner layer reference hole at this position.

Furthermore, according to the present invention, the type of multilayer circuit board can also be identified in any process, so it is also possible to automatically process this and use it as management data for process management.

[Effects of the Invention] As explained above, according to the present invention, the inner layer M single hole of a multilayer circuit board can be easily drilled in one step, and the position detection and drilling of the inner layer reference hole can be particularly done manually. Since it can be done without relying on other people, it is possible to automate the entire system.

Furthermore, since the type of multilayer circuit board can be identified, it is also possible to automatically process this to streamline process management.

[Brief explanation of the drawing]

Figure 1 is an enlarged sectional view, not conceptually showing the multilayer circuit board;
The figure shows a cross-sectional view of a counterbore hole drilled up to the inner layer reference hole, and Figure 3 is an enlarged cross-sectional view of a multilayer circuit board in which small pieces of vinyl chloride (H resin) are embedded, which is used in other conventional methods. figure,
FIG. 4 is a plan view showing an inner layer reference hole that appears at the bottom of a counterbore in the conventional method, FIG. 5 is a plan view conceptually showing a multilayer circuit board, and FIG. 6 is a plan view used in an embodiment of the present invention. A plan view without showing the inner layer standard measuring device, and FIG. 7 is a side view.
1. FIG. 8 is a front view showing the electrical contacts and their contact positions on the multilayer circuit board, and FIGS. 9 and 10 are plan views showing the coded conductor patterns. 1a...1o...Conductor pattern layers 2a, 2b...Insulating layer 3...Multilayer circuit board 4...
・・・・・・・・・・・・Countersboring drill 5'...
・・・・・・・・・・・・Counterbore hole 6・・・・・・・・・
・・・・・・・・・Inner layer reference hole 7・・・・・・・・・・・・
...Small piece of vinyl chloride resin film 8 .....Inner layer standard detection device 9 ..... Stopper 11.・
・・・・・・・・・・・・Vacuum sucker 12・・・・・・
......Discontinuity point detection device 13...
......Fluid cylinder 14...
・・・・・・・・・Piston 15・・・・・・・・・・・・
...Electrical contacts PX, PY...Discontinuity point Patent attorney Sa Suyama - Ward 1, Figure 2, Figure 3, Figure 4, Figure 5, Figure 6, Figure 7, Figure 8

Claims (1)

[Scope of Claims] (1)<A) A conductor pattern of an intermediate layer is formed on the side portion of a multilayer circuit board in accordance with the type of the multilayer circuit board and other necessary information regarding the multilayer circuit board to improve its inherent quality and/or (8) detecting the exposed length and/or spacing of the outer edge of the conductor pattern in the code area, and detecting the type of the multilayer circuit board; A method for identifying a multilayer circuit board, comprising the step of reading necessary information regarding the circuit board.