CN212696266U - Pad structure of printed circuit board - Google Patents

Abstract

The utility model relates to a printed circuit board's pad structure, including circuit board body and an at least pad, an at least pad all sets up in the one side of circuit board body, be provided with the silk screen printing layer on each pad, carry out the silk screen printing layer on the pad of circuit board body, mark the position that needs drilling on the pad through the silk screen printing layer, make the position of drilling can be confirmed accurately, thereby avoided the pad drilling to bore askew phenomenon and taken place, need not to adopt the mode of pen or other pictures to carry out the mark of drilling position, the efficiency of the mark to the drilling position has been improved.

Description

Pad structure of printed circuit board

Technical Field

The utility model relates to a printed circuit board makes technical field, especially relates to a printed circuit board's pad structure.

Background

With the rapid development of modern electronic technology, printed circuit boards are also used more and more widely in the electronic field.

In a printed circuit board, a pad is an interface where electronic components and the printed circuit board are connected by soldering, and a single-sided, double-sided, or multilayer printed circuit board is used. After the bonding pad has been made on the circuit board, need drill the bonding pad, in order to the position of the drilling on the accurate positioning bonding pad, need make the mark on the bonding pad, can draw the position of drilling on the bonding pad through the pen, but because the bonding pad is made for the metal material, lead to the pen can't clearly draw the mark of drilling on the bonding pad.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a printed circuit board's pad structure to solve the problem of mentioning in the above-mentioned background art.

The technical scheme of the utility model a printed circuit board's pad structure, including circuit board body and an at least pad, at least one the pad all set up in the one side of circuit board body, each be provided with the silk screen printing layer on the pad.

In one embodiment, the silk-screen layer is in a cross shape.

In one embodiment, the silk screen printing layer comprises a first silk screen printing mark and a second silk screen printing mark, the first silk screen printing mark is located in the middle of the bonding pad, the second silk screen printing mark is located at the position, close to the outer side, of the bonding pad, and the second silk screen printing mark is located on the outer side of the first silk screen printing mark.

In one embodiment, the first silk-screen mark is cross-shaped.

In one embodiment, the second silk-screen mark is circular in shape.

In one embodiment, the first silk-screen mark is cross-shaped, the second silk-screen mark is circular, and the geometric center of the first silk-screen mark coincides with the center of the second silk-screen mark.

In one embodiment, the thickness of the silk-screen layer is smaller than that of the bonding pad.

In one embodiment, the cross-sectional areas of the first silk-screen mark and the second silk-screen mark are smaller than the cross-sectional area of the bonding pad.

In one embodiment, the silk-screen layer further includes a third silk-screen mark, the third silk-screen mark is located at a position of the pad close to the outer side, the third silk-screen mark is located at the outer side of the second silk-screen mark, and the third silk-screen mark is used for marking the diameter of the second silk-screen mark.

Compared with the prior art, the beneficial effects of the utility model are that, a printed circuit board's pad structure is provided carry out the silk screen printing layer on the pad of circuit board body, mark the position that needs drilling on the pad through the silk screen printing layer for the position of drilling can be confirmed accurately, thereby has avoided pad drilling bores askew phenomenon and takes place, need not to adopt the mode of pen or other pictures to carry out the mark of drilling position, has improved the efficiency to the mark of drilling position.

Drawings

FIG. 1 is a schematic diagram illustrating a partial structure of a printed circuit board according to an embodiment;

FIG. 2 is a schematic diagram of a partial side cross-sectional structure of a printed circuit board according to an embodiment.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The following will combine the drawings of the embodiments of the present invention to further describe the technical solution of the present invention, and the present invention is not limited to the following specific embodiments.

It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar parts. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings, the description is merely for convenience of description and simplicity of description, but does not indicate or imply that the equipment or components referred to must have specific orientations, be constructed in specific orientations, and be operated, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art will understand the specific meanings of the terms according to specific situations.

In one embodiment, as shown in fig. 1, a pad structure of a printed circuit board includes a circuit board body 100 and at least one pad 200, where the at least one pad 200 is disposed on one side of the circuit board body 100, and a silk-screen layer 300 is disposed on each pad 200.

Specifically, set up silk screen printing layer 300 on circuit board body 100's the pad 200, mark through silk screen printing layer 300 drilling position on to pad 200 for the position of drilling can be confirmed accurately, thereby has avoided pad 200 drilling bores askew phenomenon and takes place, forms silk screen printing layer 300 on the pad through the mode of silk screen printing, need not to adopt the mode of pen or other pictures to carry out the mark of drilling position, has improved the efficiency to the mark of drilling position.

In order to mark the center position of the drilling hole of the pad 200 more accurately, in one embodiment, the silk-screen layer 300 is in a cross shape, the cross shape is formed by two line segments which are vertically crossed, and the intersection point of the two line segments is the center point of the drilling hole, so that the drilling hole of the pad 200 cannot be askew.

Through first silk screen printing mark 310 with the drilling precision has further been improved to second silk screen printing mark 320, in an embodiment, silk screen printing layer 300 includes first silk screen printing mark 310 and second silk screen printing mark 320, first silk screen printing mark 310 is located the intermediate position of pad 200, second silk screen printing mark 320 is located the position that is close to the outside of pad 200, just second silk screen printing mark 320 is located the outside of first silk screen printing mark 310. First silk screen printing mark 310 is used for the central point of mark drilling to be put, second silk screen printing mark 320 is used for the size of mark drilling, perhaps says so, second silk screen printing mark 320 is used for the scope of mark drilling, like this, through the central point of drilling is confirmed respectively to first silk screen printing mark 310 and second silk screen printing mark 320 to and the size of drilling, can further improve the drilling precision.

In order to accurately mark the center position of the drilled hole of the pad 200, in an embodiment, the first silk-screen mark 310 is cross-shaped. The cross shape is composed of two straight lines which are mutually perpendicular and crossed, the intersection point of the two lines is the center of the drilling point of the bonding pad 200, namely the center of the cross shape is the center of the drilling point of the bonding pad 200, and the through hole can be accurately drilled by aligning a drill bit to the center of the cross shape for drilling.

In order to accurately mark the size of the through hole of the pad 200, in an embodiment, the second silk-screen mark 320 is circular, the circular second silk-screen mark 320 surrounds the outer side of the cross-shaped first silk-screen mark 310, and the diameter of the circle is the diameter of the through hole to be drilled in the pad 200. The size and range of the drilled hole can be clearly and accurately marked through the second silk-screen mark 320, so that the drilling precision is further improved.

In order to enable the through hole of the pad 200 to be formed in the center of the pad 200, in an embodiment, the first silk-screen mark 310 is cross-shaped, the second silk-screen mark 320 is circular, and the geometric center of the first silk-screen mark 310 coincides with the center of the second silk-screen mark 320. This is arranged so that the through hole is opened at the very center of the pad 200.

In order to accelerate the drilling speed, in an embodiment, the thickness of the screen printing layer 300 is smaller than the thickness of the pad 200, the screen printing layer 300 is used for marking information, and a part of the screen printing layer 300 is drilled into through holes during drilling, so that the thickness of the screen printing layer 300 is set to be smaller than the thickness of the pad 200, and the drilling speed and efficiency can be improved.

In order to make the diameter of the hole drilled in the pad 200 smaller than that of the pad 200, in an embodiment, the cross-sectional areas of the first silk-screen mark 310 and the second silk-screen mark 320 are smaller than that of the pad 200, and by setting the area of the mark to be drilled to be smaller than that of the pad 200, the pad 200 is not drilled into the hole completely during drilling.

In order to facilitate an operator to distinguish the size of the aperture, in an embodiment, the silk-screen layer 300 further includes a third silk-screen mark 330, the third silk-screen mark 330 is located at a position close to the outer side of the pad 200, the third silk-screen mark 330 is located at the outer side of the second silk-screen mark 320, and the third silk-screen mark 330 is used for marking the diameter of the second silk-screen mark 320. The diameter of the second silk-screen mark 320 can be clearly distinguished by using the third silk-screen mark 330 to mark the diameter of the second silk-screen mark 320, so that an operator can conveniently distinguish the diameter of the second silk-screen mark 320, and further, the operator can conveniently distinguish the aperture size of the through hole on the bonding pad 200.

In order to improve the soldering performance, in an embodiment, the soldering flux is provided on the soldering pad 200, the soldering flux is an auxiliary material used in soldering, and the main function of the soldering flux is to remove oxides on the surfaces of solder and a soldered base material, so that the metal surface can reach the necessary cleanliness. It prevents re-oxidation of the surface during soldering, reduces the surface tension of the solder, and thus improves soldering performance.

In order to prevent the circuit board around the bonding pad 200 from being damaged, in one embodiment, a solder resist is disposed on the circuit board around the bonding pad 200, the solder resist covers the film on which the copper wires are disposed, the solder resist is used for insulation, and the solder resist is prevented from being attached to some copper wires which do not need to be soldered. The wiring layer is also protected to some extent.

In one embodiment, a transparent ink layer is disposed on a surface of the screen printing layer, and in this embodiment, the transparent ink layer covers the surface of the screen printing layer. Specifically, through set up transparent ink layer on the surface on silk screen printing layer, can effectively protect the silk screen printing layer by wearing and tearing for the silk screen printing layer can keep clear before drilling, and because the printing ink layer is transparent, can make the silk screen printing layer can be discerned.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (9)

1. The pad structure of the printed circuit board is characterized by comprising a circuit board body and at least one pad, wherein the at least one pad is arranged on one surface of the circuit board body, and a silk-screen printing layer is arranged on each pad.

2. The land structure of claim 1, wherein said screen printed layer is cross-shaped.

3. The pad structure of claim 1, wherein the silk-screen layer comprises a first silk-screen mark and a second silk-screen mark, the first silk-screen mark is located in the middle of the pad, the second silk-screen mark is located near the outer side of the pad, and the second silk-screen mark is located on the outer side of the first silk-screen mark.

4. A land structure of a printed circuit board as claimed in claim 3, wherein said first silk-screen mark is cross-shaped.

5. A land structure of a printed circuit board according to claim 3, wherein said second silk-screen mark is circular in shape.

6. The land structure of claim 3, wherein said first silk-screen mark is cross-shaped, said second silk-screen mark is circular, and the geometric center of said first silk-screen mark coincides with the center of said second silk-screen mark.

7. The land structure of claim 1, wherein said screen printed layer has a thickness less than a thickness of said land.

8. The land structure of claim 3, wherein said first silk-screened indicia and said second silk-screened indicia have a cross-sectional area less than a cross-sectional area of said land.

9. The pad structure of claim 3, wherein the silk-screen layer further comprises a third silk-screen mark, the third silk-screen mark is located at a position close to the outer side of the pad, the third silk-screen mark is located at the outer side of the second silk-screen mark, and the third silk-screen mark is used for marking the diameter of the second silk-screen mark.

Images