JPS60191679A - 耐熱超合金の拡散接合方法 - Google Patents

耐熱超合金の拡散接合方法

Info

Publication number
JPS60191679A
JPS60191679A JP4657984A JP4657984A JPS60191679A JP S60191679 A JPS60191679 A JP S60191679A JP 4657984 A JP4657984 A JP 4657984A JP 4657984 A JP4657984 A JP 4657984A JP S60191679 A JPS60191679 A JP S60191679A
Authority
JP
Japan
Prior art keywords
bonding
liquid phase
phase diffusion
deposited layer
vapor deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4657984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0464795B2 (enrdf_load_stackoverflow
Inventor
Teruo Hirane
平根　輝夫
Takao Funamoto
舟本　孝雄
Shogo Morimoto
森本　庄吾
Toshimi Sasaki
佐々木　敏美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4657984A priority Critical patent/JPS60191679A/ja
Publication of JPS60191679A publication Critical patent/JPS60191679A/ja
Publication of JPH0464795B2 publication Critical patent/JPH0464795B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP4657984A 1984-03-13 1984-03-13 耐熱超合金の拡散接合方法 Granted JPS60191679A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4657984A JPS60191679A (ja) 1984-03-13 1984-03-13 耐熱超合金の拡散接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4657984A JPS60191679A (ja) 1984-03-13 1984-03-13 耐熱超合金の拡散接合方法

Publications (2)

Publication Number Publication Date
JPS60191679A true JPS60191679A (ja) 1985-09-30
JPH0464795B2 JPH0464795B2 (enrdf_load_stackoverflow) 1992-10-16

Family

ID=12751209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4657984A Granted JPS60191679A (ja) 1984-03-13 1984-03-13 耐熱超合金の拡散接合方法

Country Status (1)

Country Link
JP (1) JPS60191679A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107451A (ja) * 1988-09-01 1990-04-19 Tektronix Inc ろう付け材料の層を用いたインクジェット・ヘッドの部品のろう付け方法
JP2007130686A (ja) * 2005-10-11 2007-05-31 Nissan Motor Co Ltd 抵抗溶接による異種金属の接合方法及び接合構造
CN101983819A (zh) * 2010-11-04 2011-03-09 西安航空动力股份有限公司 一种高温合金与白铜焊接的方法及其夹具
WO2011070626A1 (ja) * 2009-12-11 2011-06-16 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
WO2011070625A1 (ja) * 2009-12-11 2011-06-16 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
WO2011070627A1 (ja) * 2009-12-11 2011-06-16 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
CN104093519A (zh) * 2011-11-02 2014-10-08 株式会社Uacj 铝合金包层材料的制造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107451A (ja) * 1988-09-01 1990-04-19 Tektronix Inc ろう付け材料の層を用いたインクジェット・ヘッドの部品のろう付け方法
JP2007130686A (ja) * 2005-10-11 2007-05-31 Nissan Motor Co Ltd 抵抗溶接による異種金属の接合方法及び接合構造
WO2011070626A1 (ja) * 2009-12-11 2011-06-16 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
WO2011070625A1 (ja) * 2009-12-11 2011-06-16 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
WO2011070627A1 (ja) * 2009-12-11 2011-06-16 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
JP5021098B2 (ja) * 2009-12-11 2012-09-05 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
US8592285B2 (en) 2009-12-11 2013-11-26 Pioneer Corporation Method of bonding semiconductor substrate and MEMS device
JP5367842B2 (ja) * 2009-12-11 2013-12-11 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
JP5367841B2 (ja) * 2009-12-11 2013-12-11 パイオニア株式会社 半導体基板の接合方法およびｍｅｍｓデバイス
CN101983819A (zh) * 2010-11-04 2011-03-09 西安航空动力股份有限公司 一种高温合金与白铜焊接的方法及其夹具
CN104093519A (zh) * 2011-11-02 2014-10-08 株式会社Uacj 铝合金包层材料的制造方法
US9802273B2 (en) 2011-11-02 2017-10-31 Uacj Corporation Method for manufacturing aluminum alloy cladding material

Also Published As

Publication number Publication date
JPH0464795B2 (enrdf_load_stackoverflow) 1992-10-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term