JPS60189400A - 薄膜リング取出装置 - Google Patents

薄膜リング取出装置

Info

Publication number
JPS60189400A
JPS60189400A JP59044309A JP4430984A JPS60189400A JP S60189400 A JPS60189400 A JP S60189400A JP 59044309 A JP59044309 A JP 59044309A JP 4430984 A JP4430984 A JP 4430984A JP S60189400 A JPS60189400 A JP S60189400A
Authority
JP
Japan
Prior art keywords
thin film
ring
lower mold
suction hole
film ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59044309A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0578999B2 (enrdf_load_stackoverflow
Inventor
Kenji Wada
憲治 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59044309A priority Critical patent/JPS60189400A/ja
Publication of JPS60189400A publication Critical patent/JPS60189400A/ja
Publication of JPH0578999B2 publication Critical patent/JPH0578999B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
JP59044309A 1984-03-08 1984-03-08 薄膜リング取出装置 Granted JPS60189400A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59044309A JPS60189400A (ja) 1984-03-08 1984-03-08 薄膜リング取出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59044309A JPS60189400A (ja) 1984-03-08 1984-03-08 薄膜リング取出装置

Publications (2)

Publication Number Publication Date
JPS60189400A true JPS60189400A (ja) 1985-09-26
JPH0578999B2 JPH0578999B2 (enrdf_load_stackoverflow) 1993-10-29

Family

ID=12687888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59044309A Granted JPS60189400A (ja) 1984-03-08 1984-03-08 薄膜リング取出装置

Country Status (1)

Country Link
JP (1) JPS60189400A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007174475A (ja) * 2005-12-26 2007-07-05 Audio Technica Corp コンデンサマイクロホン用振動板およびその製造方法
JP2008147899A (ja) * 2006-12-08 2008-06-26 Audio Technica Corp エレクトレットコンデンサマイクロホンユニットの構成部材の製造方法
CN101207944B (zh) 2006-12-18 2011-05-11 深圳市豪恩声学股份有限公司 麦克风振膜的制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007174475A (ja) * 2005-12-26 2007-07-05 Audio Technica Corp コンデンサマイクロホン用振動板およびその製造方法
JP2008147899A (ja) * 2006-12-08 2008-06-26 Audio Technica Corp エレクトレットコンデンサマイクロホンユニットの構成部材の製造方法
CN101207944B (zh) 2006-12-18 2011-05-11 深圳市豪恩声学股份有限公司 麦克风振膜的制造方法

Also Published As

Publication number Publication date
JPH0578999B2 (enrdf_load_stackoverflow) 1993-10-29

Similar Documents

Publication Publication Date Title
JP2002100588A (ja) 半導体装置の製造方法
JPS60189400A (ja) 薄膜リング取出装置
JP2003229469A (ja) 半導体チップピックアップ装置
JPH0725463B2 (ja) 半導体装置の製造方法
JP2871119B2 (ja) セラミックグリーンシートの取扱方法および装置
JPH0541451A (ja) 半導体ウエハのペレタイズ方法と装置
KR102035929B1 (ko) 피어싱 금형에 의한 연성회로기판의 타발방법
JPH08243996A (ja) 打抜き屑排出装置付き打抜き装置およびその打抜き方法
JP2002353296A (ja) ウェハの保護テープ剥離装置およびウェハのマウント装置
JPS59130438A (ja) 板状物の分離法
JPH0342687Y2 (enrdf_load_stackoverflow)
JPS6233313Y2 (enrdf_load_stackoverflow)
JPH01238907A (ja) 半導体組立治具
JP2001121487A (ja) 画像記録坦体用穿孔装置
JP3120954B2 (ja) 半導体ウエハ加工用粘着ラベルシート
JP2521443B2 (ja) 板状材料より成型物の切断方法
JP4061852B2 (ja) セラミックグリーンシートの取扱方法および取扱装置
JPS6333907U (enrdf_load_stackoverflow)
JPH0348233U (enrdf_load_stackoverflow)
JPS58115833A (ja) ウエ−ハの分割方法
JP2004273529A (ja) ダイピックアップ装置
JPS6333133A (ja) 切断装置
JP3483241B2 (ja) キースイッチユニット用スイッチシートおよびその製造方法ならびにキースイッチユニット
JPS61123392A (ja) スピ−カ用振動板の製造法
JPH0715639U (ja) アルミ箔ダイヤパック分離装置