JPS60183460U - 単位発光ダイオ−ドの集合体 - Google Patents

単位発光ダイオ−ドの集合体

Info

Publication number
JPS60183460U
JPS60183460U JP1984072215U JP7221584U JPS60183460U JP S60183460 U JPS60183460 U JP S60183460U JP 1984072215 U JP1984072215 U JP 1984072215U JP 7221584 U JP7221584 U JP 7221584U JP S60183460 U JPS60183460 U JP S60183460U
Authority
JP
Japan
Prior art keywords
bonding part
light emitting
emitting diodes
assembly
unit light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984072215U
Other languages
English (en)
Other versions
JPH0432774Y2 (ja
Inventor
勝 神野
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP1984072215U priority Critical patent/JPS60183460U/ja
Publication of JPS60183460U publication Critical patent/JPS60183460U/ja
Application granted granted Critical
Publication of JPH0432774Y2 publication Critical patent/JPH0432774Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の単位発光ダイオードの集合体の全体斜
視図、第２図ａないしｄは、本考案の発光ダイオードの
製造過程の説明図、第３図は各単位発光ダイオードと下
タイバーとの連結部の拡大　　゛斜視図、第４図は他の
実施例を示す斜視図である。 １・・・チップボンディング部、２・・・第二リード線
、３・・・ワイヤボンディング部、４・・・第一リード
線、６・・・上タイバー、７・・・下タイバー、訃・・
フレーム、Ｄ・・・単位発光ダイオード。 ＼、！、　ｌ、、Ｊ、ＡＩＭ／、、判御（２）鳴−判拘
２４２７２７１２１２ （ａ） ｎ魚賀ｆｉ”Ｎ　Ｙａガｌ）Ｎ　ｍ”ｉｌ賀ｉｈｉマ１
■ｒ１−ｒｌ−一＋１−１１−−１−−１−一１−−１
−−１−ノ「１１−第３図 −第４図

Claims (1)

    【実用新案登録請求の範囲】
  1. 先端にチップボンディング部とワイヤボンディング部と
    をそれぞれ有する一対のリード線部分力、多数対並列し
    、かつ隣り合う各リード線部分を少なくともその上部と
    下部とをタイバーでつなげてなるフレニムにおいて、上
    記各チップボンディング部およびワイヤボンディング部
    に所定のチップボンディングおよびワイヤボンディング
    を施すとともにこのチップボンディング部ないしワイヤ
    ボンディング部を樹脂パッケージで包み込んだ後、下部
    のタイバー以外のタイバーを切除するとともに、各一対
    のリード線のうちの一方のリード線の′　　下端と上記
    下部のタイバーとの連結部を切除したことを特徴とする
    、単位発光ダイオードの集合体。
JP1984072215U 1984-05-16 1984-05-16 単位発光ダイオ−ドの集合体 Granted JPS60183460U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984072215U JPS60183460U (ja) 1984-05-16 1984-05-16 単位発光ダイオ−ドの集合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984072215U JPS60183460U (ja) 1984-05-16 1984-05-16 単位発光ダイオ−ドの集合体

Publications (2)

Publication Number Publication Date
JPS60183460U true JPS60183460U (ja) 1985-12-05
JPH0432774Y2 JPH0432774Y2 (ja) 1992-08-06

Family

ID=30610421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984072215U Granted JPS60183460U (ja) 1984-05-16 1984-05-16 単位発光ダイオ−ドの集合体

Country Status (1)

Country Link
JP (1) JPS60183460U (ja)

Also Published As

Publication number Publication date
JPH0432774Y2 (ja) 1992-08-06

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