JPH0282046U - - Google Patents

Info

Publication number
JPH0282046U
JPH0282046U JP16141488U JP16141488U JPH0282046U JP H0282046 U JPH0282046 U JP H0282046U JP 16141488 U JP16141488 U JP 16141488U JP 16141488 U JP16141488 U JP 16141488U JP H0282046 U JPH0282046 U JP H0282046U
Authority
JP
Japan
Prior art keywords
land
lead frame
bent part
view
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16141488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16141488U priority Critical patent/JPH0282046U/ja
Publication of JPH0282046U publication Critical patent/JPH0282046U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第1図a及びbは本考案の第1実施例の平面図
及びその側面図、第2図a及びbは本考案の第2
実施例の平面図及びその側面図、第3図a及びb
は従来のリードフレームの平面図及びその側面図
、第4図は従来のリードフレームを複数枚重ねた
状態の側面図である。 1……半導体素子、2……素子搭載用のランド
、3……ボンデイング用のランド、4,5……リ
ード、4a,5a……折曲部、4b,5b……切
込部、6……タイバー。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を搭載するランド或いはワイヤボン
    デイングするランドの少なくとも1つ以上を有し
    、かつこのランドにつながるリードの一部に折曲
    部を形成したリードフレームにおいて、この折曲
    部の近傍のランド側の一部に切込部を設けたこと
    を特徴とする半導体装置用リードフレーム。
JP16141488U 1988-12-13 1988-12-13 Pending JPH0282046U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16141488U JPH0282046U (ja) 1988-12-13 1988-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16141488U JPH0282046U (ja) 1988-12-13 1988-12-13

Publications (1)

Publication Number Publication Date
JPH0282046U true JPH0282046U (ja) 1990-06-25

Family

ID=31444327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16141488U Pending JPH0282046U (ja) 1988-12-13 1988-12-13

Country Status (1)

Country Link
JP (1) JPH0282046U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016004887A (ja) * 2014-06-17 2016-01-12 Shマテリアル株式会社 リードフレーム、およびリードフレームの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925256A (ja) * 1982-08-02 1984-02-09 Hitachi Ltd 半導体装置
JPS638618A (ja) * 1986-06-30 1988-01-14 Yaskawa Electric Mfg Co Ltd 合焦点検出方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925256A (ja) * 1982-08-02 1984-02-09 Hitachi Ltd 半導体装置
JPS638618A (ja) * 1986-06-30 1988-01-14 Yaskawa Electric Mfg Co Ltd 合焦点検出方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016004887A (ja) * 2014-06-17 2016-01-12 Shマテリアル株式会社 リードフレーム、およびリードフレームの製造方法

Similar Documents

Publication Publication Date Title
JPH0282046U (ja)
JPS61144650U (ja)
JPS6424852U (ja)
JPH0482862U (ja)
JPS61190146U (ja)
JPH0256457U (ja)
JPH0412663U (ja)
JPS6454342U (ja)
JPH0480060U (ja)
JPH0313754U (ja)
JPH0275747U (ja)
JPS625653U (ja)
JPH0245651U (ja)
JPS63137955U (ja)
JPS63191651U (ja)
JPS6364051U (ja)
JPH045652U (ja)
JPS62163963U (ja)
JPH0456335U (ja)
JPS636748U (ja)
JPS6273554U (ja)
JPH0472626U (ja)
JPH028150U (ja)
JPH01121947U (ja)
JPH01179451U (ja)