JPH045652U - - Google Patents
Info
- Publication number
- JPH045652U JPH045652U JP4650690U JP4650690U JPH045652U JP H045652 U JPH045652 U JP H045652U JP 4650690 U JP4650690 U JP 4650690U JP 4650690 U JP4650690 U JP 4650690U JP H045652 U JPH045652 U JP H045652U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor element
- semiconductor device
- resin
- mounting lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Wire Bonding (AREA)
Description
第1図は本考案第一実施例を示す半導体装置の
横断平面図、第2図は同じくその縦断側面図、第
3図は同じくその斜視図、第4図は本考案第二実
施例を示す半導体装置の横断平面図、第5図は同
じくその縦断側面図、第6図は従来の半導体装置
の横断平面図、第7図は同じくその縦断側面図、
第8図は同じくその斜視図、第9図は同じくその
要部拡大図である。 11……半導体素子、12……搭載用リードフ
レーム、13……ボンデイングワイヤ、14……
結線用リードフレーム、15……封止樹脂。
横断平面図、第2図は同じくその縦断側面図、第
3図は同じくその斜視図、第4図は本考案第二実
施例を示す半導体装置の横断平面図、第5図は同
じくその縦断側面図、第6図は従来の半導体装置
の横断平面図、第7図は同じくその縦断側面図、
第8図は同じくその斜視図、第9図は同じくその
要部拡大図である。 11……半導体素子、12……搭載用リードフ
レーム、13……ボンデイングワイヤ、14……
結線用リードフレーム、15……封止樹脂。
Claims (1)
- 半導体素子と、該半導体素子が搭載される搭載
用リードフレームと、ボンデイングワイヤを介し
て前記半導体素子と内部結線される結線用リード
フレームとを備え、これらが封止樹脂にて樹脂封
止されて成る半導体装置において、前記搭載用リ
ードフレームおよび結線用リードフレームは互い
に平行に並置され、前記半導体素子は、前記搭載
用リードフレームの樹脂封止領域の中央部に搭載
され、前記ボンデイングワイヤは、前記半導体素
子と前記結線用リードフレームとの間で該リード
フレームの長手方向に対して直交する方向に張設
されたことを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4650690U JPH045652U (ja) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4650690U JPH045652U (ja) | 1990-04-26 | 1990-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH045652U true JPH045652U (ja) | 1992-01-20 |
Family
ID=31561645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4650690U Pending JPH045652U (ja) | 1990-04-26 | 1990-04-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH045652U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002374005A (ja) * | 2001-04-10 | 2002-12-26 | Toshiba Corp | 光半導体装置 |
-
1990
- 1990-04-26 JP JP4650690U patent/JPH045652U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002374005A (ja) * | 2001-04-10 | 2002-12-26 | Toshiba Corp | 光半導体装置 |