JPS6361155U - - Google Patents
Info
- Publication number
- JPS6361155U JPS6361155U JP1986153769U JP15376986U JPS6361155U JP S6361155 U JPS6361155 U JP S6361155U JP 1986153769 U JP1986153769 U JP 1986153769U JP 15376986 U JP15376986 U JP 15376986U JP S6361155 U JPS6361155 U JP S6361155U
- Authority
- JP
- Japan
- Prior art keywords
- bonding part
- light emitting
- emitting diode
- diode element
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は本考案に係る発光ダイオード素子配列
体斜視図、第２図は同配列体に使用するリードフ
レームの側面図、第３図は第２図のリードフレー
ムを用いて形成した発光ダイオード素子の集合体
の側面図、第４図は第３図の集合体を用いて形成
した発光ダイオード素子の直列接続体の側面図、
第５図は第４図の接続体を用いて第１図の配列体
を組み立てる場合の説明図である。第１図乃至第
５図において、１……リードフレーム、２・３…
…リード線部、２ａ……ワイヤーボンデイング部
、３ａ……チツプボンデイング部、４ａ・４ｂ・
４ｃ……タイバー、７……透光性樹脂、８ａ・８
ｂ・８ｃ……発光ダイオード素子、１０……柔軟
性樹脂。
体斜視図、第２図は同配列体に使用するリードフ
レームの側面図、第３図は第２図のリードフレー
ムを用いて形成した発光ダイオード素子の集合体
の側面図、第４図は第３図の集合体を用いて形成
した発光ダイオード素子の直列接続体の側面図、
第５図は第４図の接続体を用いて第１図の配列体
を組み立てる場合の説明図である。第１図乃至第
５図において、１……リードフレーム、２・３…
…リード線部、２ａ……ワイヤーボンデイング部
、３ａ……チツプボンデイング部、４ａ・４ｂ・
４ｃ……タイバー、７……透光性樹脂、８ａ・８
ｂ・８ｃ……発光ダイオード素子、１０……柔軟
性樹脂。
Claims (1)
- 先端部にワイヤーボンデイング部２ａ又はチツ
プボンデイング部３ａを設けた一対のリード線部
２・３を薄板状の導電体で構成するとともに前記
ワイヤーボンデイング部２ａ及びチツプボンデイ
ング部３ａの部分を透光性樹脂７で封止てなる発
光ダイオード８ａ・８ｂ・８ｃ……を複数個直列
に配列したうえ、これらを前記リード線２・３と
一体的に形成してなるタイバー４ａをもつて電気
的に直列に接続するとともに、前記リード線部２
・３及びタイバー４ａ並に要すれば透光性樹脂７
の一部を柔軟性樹脂１０にて被覆したことを特徴
とする発光ダイオード素子配列体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986153769U JPS6361155U (ja) | 1986-10-08 | 1986-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986153769U JPS6361155U (ja) | 1986-10-08 | 1986-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361155U true JPS6361155U (ja) | 1988-04-22 |
Family
ID=31072949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986153769U Pending JPS6361155U (ja) | 1986-10-08 | 1986-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361155U (ja) |
-
1986
- 1986-10-08 JP JP1986153769U patent/JPS6361155U/ja active Pending