JPS60180911A - 高純度シリカおよびその製造法 - Google Patents

高純度シリカおよびその製造法

Info

Publication number
JPS60180911A
JPS60180911A JP3424984A JP3424984A JPS60180911A JP S60180911 A JPS60180911 A JP S60180911A JP 3424984 A JP3424984 A JP 3424984A JP 3424984 A JP3424984 A JP 3424984A JP S60180911 A JPS60180911 A JP S60180911A
Authority
JP
Japan
Prior art keywords
silica
gel
acid
alkali silicate
purity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3424984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0121091B2 (cg-RX-API-DMAC7.html
Inventor
Toshihiko Morishita
森下　敏彦
Hitoshi Koshimizu
仁 輿水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemical Industrial Co Ltd
Original Assignee
Nippon Chemical Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Industrial Co Ltd filed Critical Nippon Chemical Industrial Co Ltd
Priority to JP3424984A priority Critical patent/JPS60180911A/ja
Publication of JPS60180911A publication Critical patent/JPS60180911A/ja
Publication of JPH0121091B2 publication Critical patent/JPH0121091B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Silicon Compounds (AREA)
JP3424984A 1984-02-27 1984-02-27 高純度シリカおよびその製造法 Granted JPS60180911A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3424984A JPS60180911A (ja) 1984-02-27 1984-02-27 高純度シリカおよびその製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3424984A JPS60180911A (ja) 1984-02-27 1984-02-27 高純度シリカおよびその製造法

Publications (2)

Publication Number Publication Date
JPS60180911A true JPS60180911A (ja) 1985-09-14
JPH0121091B2 JPH0121091B2 (cg-RX-API-DMAC7.html) 1989-04-19

Family

ID=12408891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3424984A Granted JPS60180911A (ja) 1984-02-27 1984-02-27 高純度シリカおよびその製造法

Country Status (1)

Country Link
JP (1) JPS60180911A (cg-RX-API-DMAC7.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4683128A (en) * 1985-06-27 1987-07-28 Nitto Chemical Industry Co., Ltd. Process for manufacturing high purity silica
KR100651243B1 (ko) 2005-03-04 2006-11-30 (주) 에스오씨 구형 실리카의 제조 방법
RU2481096C2 (ru) * 2008-11-25 2013-05-10 Дзе Проктер Энд Гэмбл Компани Композиции для ухода за полостью рта с улучшенным очищающим эффектом
JPWO2014188934A1 (ja) * 2013-05-20 2017-02-23 日産化学工業株式会社 シリカゾル及びシリカ含有エポキシ樹脂組成物
JP2024519512A (ja) * 2022-04-25 2024-05-15 江蘇聯瑞新材料股▲ふん▼有限公司 超低誘電損失球状シリカ微粉末の調製方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5617919A (en) * 1979-07-09 1981-02-20 Ceskoslovenska Akademie Ved Method of making silicic acid xerogel of large pore volume
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58145613A (ja) * 1982-02-15 1983-08-30 Denki Kagaku Kogyo Kk 溶融シリカ球状体、その製造法およびその装置
JPS58151318A (ja) * 1982-02-26 1983-09-08 Shin Etsu Chem Co Ltd 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物
JPS5954632A (ja) * 1982-09-21 1984-03-29 Mitsubishi Metal Corp 石英ガラス粉末の製造法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5617919A (en) * 1979-07-09 1981-02-20 Ceskoslovenska Akademie Ved Method of making silicic acid xerogel of large pore volume
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58145613A (ja) * 1982-02-15 1983-08-30 Denki Kagaku Kogyo Kk 溶融シリカ球状体、その製造法およびその装置
JPS58151318A (ja) * 1982-02-26 1983-09-08 Shin Etsu Chem Co Ltd 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物
JPS5954632A (ja) * 1982-09-21 1984-03-29 Mitsubishi Metal Corp 石英ガラス粉末の製造法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4683128A (en) * 1985-06-27 1987-07-28 Nitto Chemical Industry Co., Ltd. Process for manufacturing high purity silica
KR100651243B1 (ko) 2005-03-04 2006-11-30 (주) 에스오씨 구형 실리카의 제조 방법
RU2481096C2 (ru) * 2008-11-25 2013-05-10 Дзе Проктер Энд Гэмбл Компани Композиции для ухода за полостью рта с улучшенным очищающим эффектом
RU2486890C2 (ru) * 2008-11-25 2013-07-10 Дзе Проктер Энд Гэмбл Компани Композиции для ухода за полостью рта, содержащие аморфный кварц
JPWO2014188934A1 (ja) * 2013-05-20 2017-02-23 日産化学工業株式会社 シリカゾル及びシリカ含有エポキシ樹脂組成物
JP2024519512A (ja) * 2022-04-25 2024-05-15 江蘇聯瑞新材料股▲ふん▼有限公司 超低誘電損失球状シリカ微粉末の調製方法

Also Published As

Publication number Publication date
JPH0121091B2 (cg-RX-API-DMAC7.html) 1989-04-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term