JPS60178688A - 高熱伝導性回路基板 - Google Patents
高熱伝導性回路基板Info
- Publication number
- JPS60178688A JPS60178688A JP3416584A JP3416584A JPS60178688A JP S60178688 A JPS60178688 A JP S60178688A JP 3416584 A JP3416584 A JP 3416584A JP 3416584 A JP3416584 A JP 3416584A JP S60178688 A JPS60178688 A JP S60178688A
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- substrate
- circuit board
- paste
- high thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 4
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 4
- 150000002910 rare earth metals Chemical class 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 36
- 239000000843 powder Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 3
- 238000001272 pressureless sintering Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- -1 alkaline earth metal carbonates Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001954 samarium oxide Inorganic materials 0.000 description 1
- 229940075630 samarium oxide Drugs 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3416584A JPS60178688A (ja) | 1984-02-27 | 1984-02-27 | 高熱伝導性回路基板 |
| US06/706,280 US4659611A (en) | 1984-02-27 | 1985-02-27 | Circuit substrate having high thermal conductivity |
| EP85102159A EP0153737B1 (en) | 1984-02-27 | 1985-02-27 | Circuit substrate having high thermal conductivity |
| DE85102159T DE3587481T2 (de) | 1984-02-27 | 1985-02-27 | Schaltungssubstrat mit hoher Wärmeleitfähigkeit. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3416584A JPS60178688A (ja) | 1984-02-27 | 1984-02-27 | 高熱伝導性回路基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5041768A Division JPH0716088B2 (ja) | 1993-02-08 | 1993-02-08 | 高熱伝導性回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60178688A true JPS60178688A (ja) | 1985-09-12 |
| JPH0576795B2 JPH0576795B2 (enrdf_load_stackoverflow) | 1993-10-25 |
Family
ID=12406594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3416584A Granted JPS60178688A (ja) | 1984-02-27 | 1984-02-27 | 高熱伝導性回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60178688A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253294A (ja) * | 1984-05-29 | 1985-12-13 | 日本電気株式会社 | 多層セラミツク基板 |
| JPS6135555A (ja) * | 1984-07-27 | 1986-02-20 | Nec Corp | 厚膜混成集積回路装置 |
| JPS6284595A (ja) * | 1985-10-08 | 1987-04-18 | 日本電気株式会社 | 多層セラミック配線基板 |
| JPS6329991A (ja) * | 1986-07-23 | 1988-02-08 | 株式会社東芝 | 回路基板の製造方法及び回路基板 |
| JPH01117093A (ja) * | 1987-10-29 | 1989-05-09 | Ibiden Co Ltd | 窒化アルミニウム質多層基板 |
| JPH01278001A (ja) * | 1988-04-28 | 1989-11-08 | Tokin Corp | サーミスタ感温構造体 |
| JPH025596A (ja) * | 1988-06-24 | 1990-01-10 | Nec Corp | 多層配線基板の製造方法 |
| JPH02197189A (ja) * | 1988-11-14 | 1990-08-03 | Shinko Electric Ind Co Ltd | 窒化アルミニウム回路基板及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075208A (enrdf_load_stackoverflow) * | 1973-11-07 | 1975-06-20 | ||
| JPS5855377A (ja) * | 1981-09-28 | 1983-04-01 | 株式会社東芝 | 窒化アルミニウム焼結体の製造方法 |
-
1984
- 1984-02-27 JP JP3416584A patent/JPS60178688A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075208A (enrdf_load_stackoverflow) * | 1973-11-07 | 1975-06-20 | ||
| JPS5855377A (ja) * | 1981-09-28 | 1983-04-01 | 株式会社東芝 | 窒化アルミニウム焼結体の製造方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253294A (ja) * | 1984-05-29 | 1985-12-13 | 日本電気株式会社 | 多層セラミツク基板 |
| JPS6135555A (ja) * | 1984-07-27 | 1986-02-20 | Nec Corp | 厚膜混成集積回路装置 |
| JPS6284595A (ja) * | 1985-10-08 | 1987-04-18 | 日本電気株式会社 | 多層セラミック配線基板 |
| JPS6329991A (ja) * | 1986-07-23 | 1988-02-08 | 株式会社東芝 | 回路基板の製造方法及び回路基板 |
| JPH01117093A (ja) * | 1987-10-29 | 1989-05-09 | Ibiden Co Ltd | 窒化アルミニウム質多層基板 |
| JPH01278001A (ja) * | 1988-04-28 | 1989-11-08 | Tokin Corp | サーミスタ感温構造体 |
| JPH025596A (ja) * | 1988-06-24 | 1990-01-10 | Nec Corp | 多層配線基板の製造方法 |
| JPH02197189A (ja) * | 1988-11-14 | 1990-08-03 | Shinko Electric Ind Co Ltd | 窒化アルミニウム回路基板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0576795B2 (enrdf_load_stackoverflow) | 1993-10-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |