JPS60177010A - ポリアクリルアミドの製造法 - Google Patents

ポリアクリルアミドの製造法

Info

Publication number
JPS60177010A
JPS60177010A JP59030931A JP3093184A JPS60177010A JP S60177010 A JPS60177010 A JP S60177010A JP 59030931 A JP59030931 A JP 59030931A JP 3093184 A JP3093184 A JP 3093184A JP S60177010 A JPS60177010 A JP S60177010A
Authority
JP
Japan
Prior art keywords
polymerization
copper salt
acrylamide
sodium sulfite
azo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59030931A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546366B2 (cs
Inventor
Kazuo Tan
丹　一夫
Takashi Hironaka
弘中　孝
Saburo Takenouchi
三郎 竹之内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Industries Ltd filed Critical Mitsubishi Chemical Industries Ltd
Priority to JP59030931A priority Critical patent/JPS60177010A/ja
Publication of JPS60177010A publication Critical patent/JPS60177010A/ja
Publication of JPH0546366B2 publication Critical patent/JPH0546366B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Polymerization Catalysts (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP59030931A 1984-02-21 1984-02-21 ポリアクリルアミドの製造法 Granted JPS60177010A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59030931A JPS60177010A (ja) 1984-02-21 1984-02-21 ポリアクリルアミドの製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59030931A JPS60177010A (ja) 1984-02-21 1984-02-21 ポリアクリルアミドの製造法

Publications (2)

Publication Number Publication Date
JPS60177010A true JPS60177010A (ja) 1985-09-11
JPH0546366B2 JPH0546366B2 (cs) 1993-07-13

Family

ID=12317422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59030931A Granted JPS60177010A (ja) 1984-02-21 1984-02-21 ポリアクリルアミドの製造法

Country Status (1)

Country Link
JP (1) JPS60177010A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100318327B1 (ko) * 1995-12-16 2002-04-22 구광시 에멀젼형 고분자응집제의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52111987A (en) * 1976-03-18 1977-09-20 Mitsui Toatsu Chem Inc Preparation of acrylamide-type water-soluble polymer
JPS56103210A (en) * 1980-01-21 1981-08-18 Mitsubishi Gas Chem Co Inc Preparation of water-soluble cationic polymer
JPS57121007U (cs) * 1981-01-20 1982-07-27

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52111987A (en) * 1976-03-18 1977-09-20 Mitsui Toatsu Chem Inc Preparation of acrylamide-type water-soluble polymer
JPS56103210A (en) * 1980-01-21 1981-08-18 Mitsubishi Gas Chem Co Inc Preparation of water-soluble cationic polymer
JPS57121007U (cs) * 1981-01-20 1982-07-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100318327B1 (ko) * 1995-12-16 2002-04-22 구광시 에멀젼형 고분자응집제의 제조방법

Also Published As

Publication number Publication date
JPH0546366B2 (cs) 1993-07-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term