JPH0546366B2 - - Google Patents

Info

Publication number
JPH0546366B2
JPH0546366B2 JP59030931A JP3093184A JPH0546366B2 JP H0546366 B2 JPH0546366 B2 JP H0546366B2 JP 59030931 A JP59030931 A JP 59030931A JP 3093184 A JP3093184 A JP 3093184A JP H0546366 B2 JPH0546366 B2 JP H0546366B2
Authority
JP
Japan
Prior art keywords
polymerization
copper salt
sodium sulfite
ppm
acrylamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59030931A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60177010A (ja
Inventor
Kazuo Tan
Takashi Hironaka
Saburo Takenochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Industries Ltd filed Critical Mitsubishi Chemical Industries Ltd
Priority to JP3093184A priority Critical patent/JPS60177010A/ja
Publication of JPS60177010A publication Critical patent/JPS60177010A/ja
Publication of JPH0546366B2 publication Critical patent/JPH0546366B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Polymerization Catalysts (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP3093184A 1984-02-21 1984-02-21 ポリアクリルアミドの製造法 Granted JPS60177010A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3093184A JPS60177010A (ja) 1984-02-21 1984-02-21 ポリアクリルアミドの製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3093184A JPS60177010A (ja) 1984-02-21 1984-02-21 ポリアクリルアミドの製造法

Publications (2)

Publication Number Publication Date
JPS60177010A JPS60177010A (ja) 1985-09-11
JPH0546366B2 true JPH0546366B2 (cs) 1993-07-13

Family

ID=12317422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3093184A Granted JPS60177010A (ja) 1984-02-21 1984-02-21 ポリアクリルアミドの製造法

Country Status (1)

Country Link
JP (1) JPS60177010A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100318327B1 (ko) * 1995-12-16 2002-04-22 구광시 에멀젼형 고분자응집제의 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946247B2 (ja) * 1976-03-18 1984-11-12 三井東圧化学株式会社 アクリルアマイド系水溶性高分子重合体の製造法
JPS56103210A (en) * 1980-01-21 1981-08-18 Mitsubishi Gas Chem Co Inc Preparation of water-soluble cationic polymer
JPS57121007U (cs) * 1981-01-20 1982-07-27

Also Published As

Publication number Publication date
JPS60177010A (ja) 1985-09-11

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term