JPS60163436A - 半導体材料の洗浄乾燥方法 - Google Patents

半導体材料の洗浄乾燥方法

Info

Publication number
JPS60163436A
JPS60163436A JP1824984A JP1824984A JPS60163436A JP S60163436 A JPS60163436 A JP S60163436A JP 1824984 A JP1824984 A JP 1824984A JP 1824984 A JP1824984 A JP 1824984A JP S60163436 A JPS60163436 A JP S60163436A
Authority
JP
Japan
Prior art keywords
water
wafer
washing
semiconductor material
rinsing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1824984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0463539B2 (enrdf_load_stackoverflow
Inventor
Seiichiro Sogo
相合　征一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP1824984A priority Critical patent/JPS60163436A/ja
Publication of JPS60163436A publication Critical patent/JPS60163436A/ja
Publication of JPH0463539B2 publication Critical patent/JPH0463539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1824984A 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法 Granted JPS60163436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1824984A JPS60163436A (ja) 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1824984A JPS60163436A (ja) 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法

Publications (2)

Publication Number Publication Date
JPS60163436A true JPS60163436A (ja) 1985-08-26
JPH0463539B2 JPH0463539B2 (enrdf_load_stackoverflow) 1992-10-12

Family

ID=11966402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1824984A Granted JPS60163436A (ja) 1984-02-06 1984-02-06 半導体材料の洗浄乾燥方法

Country Status (1)

Country Link
JP (1) JPS60163436A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260027U (enrdf_load_stackoverflow) * 1985-09-04 1987-04-14
JPH02144333A (ja) * 1988-07-01 1990-06-04 Tokyo Electron Ltd 基板処理装置および基板搬送装置
JPH02127033U (enrdf_load_stackoverflow) * 1989-03-28 1990-10-19
JPH0332428U (enrdf_load_stackoverflow) * 1989-08-04 1991-03-29
US5930549A (en) * 1996-11-21 1999-07-27 Samsung Electronics Co., Ltd. Developing device for semiconductor device fabrication and its controlling method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4862772U (enrdf_load_stackoverflow) * 1971-11-16 1973-08-09
JPS5180161A (enrdf_load_stackoverflow) * 1975-01-09 1976-07-13 Suwa Seikosha Kk
JPS5544780A (en) * 1978-09-27 1980-03-29 Toshiba Corp Cleaning device for semiconductor wafer
JPS5594043U (enrdf_load_stackoverflow) * 1978-12-21 1980-06-30
JPS5652197U (enrdf_load_stackoverflow) * 1979-09-27 1981-05-08
JPS57160131A (en) * 1981-03-30 1982-10-02 Hitachi Ltd Washing cell
JPS5994425A (ja) * 1982-11-19 1984-05-31 Nec Kyushu Ltd 半導体製造装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4862772U (enrdf_load_stackoverflow) * 1971-11-16 1973-08-09
JPS5180161A (enrdf_load_stackoverflow) * 1975-01-09 1976-07-13 Suwa Seikosha Kk
JPS5544780A (en) * 1978-09-27 1980-03-29 Toshiba Corp Cleaning device for semiconductor wafer
JPS5594043U (enrdf_load_stackoverflow) * 1978-12-21 1980-06-30
JPS5652197U (enrdf_load_stackoverflow) * 1979-09-27 1981-05-08
JPS57160131A (en) * 1981-03-30 1982-10-02 Hitachi Ltd Washing cell
JPS5994425A (ja) * 1982-11-19 1984-05-31 Nec Kyushu Ltd 半導体製造装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260027U (enrdf_load_stackoverflow) * 1985-09-04 1987-04-14
JPH02144333A (ja) * 1988-07-01 1990-06-04 Tokyo Electron Ltd 基板処理装置および基板搬送装置
JPH02127033U (enrdf_load_stackoverflow) * 1989-03-28 1990-10-19
JPH0332428U (enrdf_load_stackoverflow) * 1989-08-04 1991-03-29
US5930549A (en) * 1996-11-21 1999-07-27 Samsung Electronics Co., Ltd. Developing device for semiconductor device fabrication and its controlling method

Also Published As

Publication number Publication date
JPH0463539B2 (enrdf_load_stackoverflow) 1992-10-12

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