JPS60160554U - 半導体用ボンディング細線 - Google Patents

半導体用ボンディング細線

Info

Publication number
JPS60160554U
JPS60160554U JP1984047473U JP4747384U JPS60160554U JP S60160554 U JPS60160554 U JP S60160554U JP 1984047473 U JP1984047473 U JP 1984047473U JP 4747384 U JP4747384 U JP 4747384U JP S60160554 U JPS60160554 U JP S60160554U
Authority
JP
Japan
Prior art keywords
semiconductors
thin wire
bonding thin
alloy
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984047473U
Other languages
English (en)
Japanese (ja)
Other versions
JPH034030Y2 (enrdf_load_stackoverflow
Inventor
志賀　章二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP1984047473U priority Critical patent/JPS60160554U/ja
Publication of JPS60160554U publication Critical patent/JPS60160554U/ja
Application granted granted Critical
Publication of JPH034030Y2 publication Critical patent/JPH034030Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/4557—Plural coating layers
    • H01L2224/45572—Two-layer stack coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1984047473U 1984-03-31 1984-03-31 半導体用ボンディング細線 Granted JPS60160554U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984047473U JPS60160554U (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984047473U JPS60160554U (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Publications (2)

Publication Number Publication Date
JPS60160554U true JPS60160554U (ja) 1985-10-25
JPH034030Y2 JPH034030Y2 (enrdf_load_stackoverflow) 1991-02-01

Family

ID=30562833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984047473U Granted JPS60160554U (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Country Status (1)

Country Link
JP (1) JPS60160554U (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003081661A1 (fr) * 2002-03-26 2003-10-02 Sumitomo Electric Wintec, Incorporated Fil de liaison et dispositif de circuit integre faisant appel a ce fil de liaison
WO2006073206A1 (ja) * 2005-01-05 2006-07-13 Nippon Steel Materials Co., Ltd. 半導体装置用ボンディングワイヤ
JP2006190763A (ja) * 2005-01-05 2006-07-20 Nippon Steel Corp 半導体装置用ボンディングワイヤ
WO2010109693A1 (ja) * 2009-03-23 2010-09-30 田中電子工業株式会社 ボールボンディング用被覆銅ワイヤ
JP2010272884A (ja) * 2010-08-03 2010-12-02 Nippon Steel Materials Co Ltd 半導体装置用ボンディングワイヤ
JP2013080960A (ja) * 2000-09-18 2013-05-02 Nippon Steel Sumikin Materials Co Ltd 半導体用ボンディングワイヤおよびその製造方法
JP2017163169A (ja) * 2014-04-21 2017-09-14 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
US10195697B2 (en) 2015-09-02 2019-02-05 Tanaka Denshi Kogyo K.K. Palladium (Pd)-coated copper wire for ball bonding
US10236272B2 (en) 2015-05-26 2019-03-19 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216929A (ja) * 2005-01-05 2006-08-17 Nippon Steel Corp 半導体装置用ボンディングワイヤ

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013080960A (ja) * 2000-09-18 2013-05-02 Nippon Steel Sumikin Materials Co Ltd 半導体用ボンディングワイヤおよびその製造方法
CN100359657C (zh) * 2002-03-26 2008-01-02 株式会社野毛电气工业 键合线和使用该键合线的集成电路装置
WO2003081661A1 (fr) * 2002-03-26 2003-10-02 Sumitomo Electric Wintec, Incorporated Fil de liaison et dispositif de circuit integre faisant appel a ce fil de liaison
KR101016158B1 (ko) * 2005-01-05 2011-02-17 신닛테츠 마테리알즈 가부시키가이샤 반도체 장치용 본딩 와이어
JP2006190763A (ja) * 2005-01-05 2006-07-20 Nippon Steel Corp 半導体装置用ボンディングワイヤ
WO2006073206A1 (ja) * 2005-01-05 2006-07-13 Nippon Steel Materials Co., Ltd. 半導体装置用ボンディングワイヤ
WO2010109693A1 (ja) * 2009-03-23 2010-09-30 田中電子工業株式会社 ボールボンディング用被覆銅ワイヤ
JP2010272884A (ja) * 2010-08-03 2010-12-02 Nippon Steel Materials Co Ltd 半導体装置用ボンディングワイヤ
JP2017163169A (ja) * 2014-04-21 2017-09-14 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP2020031238A (ja) * 2014-04-21 2020-02-27 日鉄ケミカル＆マテリアル株式会社 半導体装置用ボンディングワイヤ
US10950570B2 (en) 2014-04-21 2021-03-16 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor device
US10236272B2 (en) 2015-05-26 2019-03-19 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device
US10497663B2 (en) 2015-05-26 2019-12-03 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device
US10672733B2 (en) 2015-05-26 2020-06-02 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device
US10195697B2 (en) 2015-09-02 2019-02-05 Tanaka Denshi Kogyo K.K. Palladium (Pd)-coated copper wire for ball bonding

Also Published As

Publication number Publication date
JPH034030Y2 (enrdf_load_stackoverflow) 1991-02-01

Similar Documents

Publication Publication Date Title
JPS60160554U (ja) 半導体用ボンディング細線
JPS60133108U (ja) 断熱エンジン
JPS602848U (ja) 半導体装置
JPS6117751U (ja) テ−プキヤリア半導体装置
JPS6043097U (ja) スピ−カ−
JPS6083258U (ja) 樹脂封止型半導体装置
JPS602841U (ja) 半導体取付基板
JPS6085841U (ja) サブマウント
JPS59129294U (ja) 複合型スピ−カ
JPS6033439U (ja) 半導体装置
JPS5889109U (ja) ダイス
JPS5963916U (ja) フレキシブルケ−ブル
JPS616213U (ja) 絶縁電線
JPS5955814U (ja) 耐ワニス性絶縁電線
JPS6049663U (ja) 配線基板
JPS61119355U (enrdf_load_stackoverflow)
JPS59105710U (ja) 超電導線
JPS59193894U (ja) ワイヤロ−プ
JPS6127256U (ja) ワイヤボンデイングパツド
JPS6020159U (ja) 集積回路半導体装置
JPS602858U (ja) ヒ−トシンクの電極
JPS6174911U (enrdf_load_stackoverflow)
JPS58140645U (ja) Ｉｃリ−ドフレ−ム
JPS59112955U (ja) 半導体素子
JPS6094836U (ja) 半導体装置