JPS60157231A - ウエ−ハロ−ダ - Google Patents

ウエ−ハロ−ダ

Info

Publication number
JPS60157231A
JPS60157231A JP59011044A JP1104484A JPS60157231A JP S60157231 A JPS60157231 A JP S60157231A JP 59011044 A JP59011044 A JP 59011044A JP 1104484 A JP1104484 A JP 1104484A JP S60157231 A JPS60157231 A JP S60157231A
Authority
JP
Japan
Prior art keywords
wafer
vacuum
arrow
sheet
urethane sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59011044A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129063B2 (enrdf_load_stackoverflow
Inventor
Takayuki Minamiyama
南山　隆幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59011044A priority Critical patent/JPS60157231A/ja
Publication of JPS60157231A publication Critical patent/JPS60157231A/ja
Publication of JPH0129063B2 publication Critical patent/JPH0129063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
JP59011044A 1984-01-26 1984-01-26 ウエ−ハロ−ダ Granted JPS60157231A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59011044A JPS60157231A (ja) 1984-01-26 1984-01-26 ウエ−ハロ−ダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59011044A JPS60157231A (ja) 1984-01-26 1984-01-26 ウエ−ハロ−ダ

Publications (2)

Publication Number Publication Date
JPS60157231A true JPS60157231A (ja) 1985-08-17
JPH0129063B2 JPH0129063B2 (enrdf_load_stackoverflow) 1989-06-07

Family

ID=11767041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59011044A Granted JPS60157231A (ja) 1984-01-26 1984-01-26 ウエ−ハロ−ダ

Country Status (1)

Country Link
JP (1) JPS60157231A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445567A (en) * 1987-08-10 1989-02-20 Sumitomo Electric Industries Semiconductor wafer applying method and device
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
KR100967222B1 (ko) 2008-06-16 2010-07-05 정진황 이송챔버 및 기판이송방법
WO2011033724A1 (ja) * 2009-09-18 2011-03-24 株式会社Sumco 研磨方法及びその装置
CN104690641A (zh) * 2013-12-04 2015-06-10 台湾积体电路制造股份有限公司 用于弯曲晶圆的传送模块
CN106826510A (zh) * 2016-12-30 2017-06-13 郑州晶润光电技术有限公司 一种晶片扫光工艺

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445567A (en) * 1987-08-10 1989-02-20 Sumitomo Electric Industries Semiconductor wafer applying method and device
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5527209A (en) * 1993-09-09 1996-06-18 Cybeq Systems, Inc. Wafer polisher head adapted for easy removal of wafers
KR100967222B1 (ko) 2008-06-16 2010-07-05 정진황 이송챔버 및 기판이송방법
WO2011033724A1 (ja) * 2009-09-18 2011-03-24 株式会社Sumco 研磨方法及びその装置
JP2011062789A (ja) * 2009-09-18 2011-03-31 Sumco Corp 研磨方法及びその装置
US8870627B2 (en) 2009-09-18 2014-10-28 Sumco Corporation Polishing method and polishing apparatus
CN104690641A (zh) * 2013-12-04 2015-06-10 台湾积体电路制造股份有限公司 用于弯曲晶圆的传送模块
CN106826510A (zh) * 2016-12-30 2017-06-13 郑州晶润光电技术有限公司 一种晶片扫光工艺

Also Published As

Publication number Publication date
JPH0129063B2 (enrdf_load_stackoverflow) 1989-06-07

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