200827098 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種研磨拋光機台，且特別是有關於 一種玻璃面板之研磨拋光機台。 【先前技術】 一 P遺著 3C(Computer，Communications and Consumer)產 „ 業的發展，有越來越多的人會使用行動裝置（handheld ' device)作為生活中的輔助工具。舉例而言，常見的行動裝 置包含個人數位助理（personal digital assistant ; PDA)、行 動電話（mobile phone)、智慧型手機（smart phone)等，這些 行動裝置之體積輕巧，攜帶方便，因此使用的人數越來越 多，所需之功能亦越來越廣。 為了提高行動裝置攜帶時之便利性，行動裝置之面板 常需進行玻璃薄化之製程，以使行動裝置之體積更為輕 薄。傳統式的研磨拋光機台於薄化玻璃面板時，可利用研 i 磨頭上貫穿孔之真空吸力，將玻璃面板吸附於研磨頭，然 而，此種方式會使玻璃面板在貫穿孔吸附處，產生凹陷之 情形，致使玻璃面板研磨不均。且若僅以真空吸附的方式 固定玻璃面板與研磨頭，在製程中常會因真空吸力不足， 造成玻璃面板拋片而導致破片。或者，在貫穿孔破真空時， 若是某些貫穿孔的空氣先衝出形成通道，則大部分的空氣 便會經由此通道離開，造成其他貫穿孔的氣量不足，而無 法完全地破除真空。 200827098 為解決上述之問題，亦有以人工的方式進行玻璃面板 之取卸片的步驟’包含以人工拍打貼附於玻璃吸著墊之玻 璃面板，使玻璃面板吸附於研磨頭上之玻璃吸著墊。而在 將玻璃面板㈣磨頭取下日夺，須在機台㈣將加工後的玻 璃面板洗淨，再以人工使用氣槍吹氣，破壞研磨頭上之玻 璃吸著墊與玻璃面板之間的吸附狀態，最後，將玻璃面板 從玻璃吸著塾取下。由於過程中以清水清洗玻璃面板時， 清水與殘留的研磨液會流回機台，若是將其排掉，會造成 成本的提高，若不排掉，又會稀釋機台内部的研磨液濃度。 且人工取卸片時，容易因為人工操作時的碰撞，造成玻璃 面板之損傷，而影響產品之良率。 【發明内容】 因此本發明的主要目的就是在提供一種研磨拋光機 台，用以在清洗玻璃面板時，維持研磨液之濃度。 根據本發明之上述目的，提出一種研磨拋光機台，用 以薄化一玻璃面板。研磨拋光機台包含一迴轉手臂、一研 磨頭’以及一研磨墊。研磨頭係與迴轉手臂相連，且研磨 頭包含一破璃吸著墊與複數個貫穿孔。研磨墊係設置於相 對研磨碩，以藉由將玻璃面板吸附於玻璃吸著墊，使研磨 頭上之破ί离面板與研磨墊進行一拋光研磨。研磨拋光機台 更包含一卸載平台，玻璃面板係於研磨拋光機台進行一研 磨抛光步驟，並利用迴轉手臂將玻璃面板移動至卸載平台 進行一取卸片步驟。卸載平台更包含至少一吹氣管，可於 200827098 卸片時配置於玻璃面板與玻璃吸著墊之間，以注入壓縮氣 體於玻璃面板與玻璃吸著墊之間。玻璃吸著墊係由複數個 吸盤組成，玻璃面板可藉由吸盤吸附於玻璃吸著墊。其中， 貫穿孔可配置於吸盤之間。研磨拋光機台更包含一壓力控 制ίί ’壓力控制單元係與貫穿孔相連，以提供-壓力源 於貝牙孔。其中壓力源若為一負壓源，則貫穿孔會形成真 工吸附孔’壓力源若為—壓縮氣體，則貫穿孔會形成吹氣 道。迴轉手臂可更包含一升降裝置，以提供一上提力於研 磨頭’此升降裝置可為一氣壓缸。 本毛月之另怨樣係為一種研磨拋光方法，用以薄化 玻璃面板。研磨拋光方法包含_取片步驟、—預壓研磨步 驟、-本體重量研磨步驟’以及一卸片步驟。取片步驟包 含利用研磨頭之複數個真空吸附孔，貼附玻璃面板於研磨 頭。預壓研磨步驟包含於研磨時利用升降I置提供上提力 於研磨頭。本體重量研磨步驟包含解除真㈣應及上提 力，以利用研磨頭之本體重量進行研磨。卸片步驟包含注 入壓縮氣體於玻璃面板與研磨頭之間，以使玻璃面板與研 磨頭脫離。上提力之大小約為本體重量之3〇%至55%，其 中預壓研磨步驟之研磨時間為等於或少於2g秒。其中取片 步驟與卸片步驟係於㈣平台進行，預壓研磨步驟與本體 重量研磨步驟係於研磨拋光機台進行，«面板可利用與 研磨頭相連之-迴轉手臂，移動於卸載平台與研磨抛光機 台之間。卸片步驟可利用研磨頭之吹氣道，與卸載平台之 吹氣管，注人壓縮氣體於研磨頭與玻璃面板之間。其中， 200827098 口人軋道與真空吸附孔係為配置於 力控制單元控制。研磨頭包含玻璃；;；,’並由壓 由及盤所組成，以吸附玻璃面板於玻璃吸著墊，— 孔係設置於吸盤之間。 貝牙 夕藉由使用此研磨拋光機台，玻璃面板可利用迴轉手臂 之私動’而分別在卸載平台與研磨拋光機台上進行取 步驟舆拋光研磨步驟，如此—來，在清洗玻璃面板上殘存 ^研磨液時，清水與殘存之研磨液不會回流至研磨抛光機 口 ’影響研磨液的濃度。此外，研磨拋光方法可利用預壓 研磨步驟，使玻璃面板之取片得以自動化，而不會使玻璃 面板因真空凹陷致使研磨不均。此外，藉由㈣平台之吹 虱S ’可避免因貫穿孔出氣量不一致，致使却片失敗之情 形0 【實施方式】 以下將以圖式及詳細說明清楚說明本發明之精神，任 何所屬技術領域中具有通常知識者在瞭解本發明之較佳實 鈀例後，§可由本發明所教示之技術，加以改變及修飾， 其並不脫離本發明之精神與範圍。 同日守參照第1Α圖及第1Β圖，其係分別繪示本發明之 研磨拋光機台一較佳實施例之示意圖及局部放大圖。研磨 拋光機台100係用以研磨拋光一玻璃面板2〇〇，並將玻璃面 板200薄化。研磨拋光機台100包含一研磨墊110、一迴轉 手臂120，以及一研磨頭13〇。其中研磨頭13〇係與迴轉手 200827098 臂120相連，研磨墊丨丨〇係設置於相對研磨頭丨3〇。研磨頭 130包含有一玻璃吸著墊132，以及複數個貫穿孔134，其 中貫穿孔134係穿設於玻璃吸著墊132,並與一壓力控制單 元150相連通。玻璃吸著墊132可為一黑膠墊。其中迴轉 手臂120更包含一升降裝置122,以提供一上提力於研磨頭 130 〇 玻璃面板200可利用玻璃吸著塾132吸附於研磨頭 130 ’以利用研磨頭13〇與研磨墊11〇對玻璃面板2〇〇進行 一拋光研磨，以薄化玻璃面板2〇〇。由於研磨拋光機台1〇〇 更包含一卸載平台140,利用迴轉手臂12〇可將研磨頭13〇 移動至卸載平台140，進行玻璃面板2〇〇之取卸片，因此， 利用清水以清洗玻璃面板2〇〇上殘存之研磨液時，清水及 殘存之研磨液不會回流至研磨墊11〇，影響到研磨墊11〇 之研磨液濃度。 參照第2圖，其係繪示本發明之拋光研磨機台另一較 佳貫施例之示意圖。貫穿孔134係配置於玻璃吸著墊132 之中，並與壓力控制單元i 5〇相連，以藉由壓力控制單元 ki、壓力源於貫穿孔134。當壓力控制單元150所提 供之壓力為負壓源時，相連之貫穿孔Π4會形成真空吸附 孔，以提供真空吸力，進而將玻璃面板2〇〇確實地吸附於 玻璃吸著墊132上，以進行玻璃面板2〇〇之取片動作。當 壓力控制單it 150所提供之壓力源為壓、縮氣體時，研磨頭 U0之貫穿孔134會形成吹氣道，壓縮氣體則可經由貫穿孔 134之吹氣道衝出，以解除破璃面板2〇〇與玻璃吸著墊η] 200827098 之間的吸附狀態，使玻璃面板200與研磨頭丨3〇分離，進 而完成玻璃面板200之卸片動作。 卸載平台140可更包含一吹氣管142，吹氣管ι42可於 玻璃面板200卸片時，配置於玻璃面板2〇〇與玻璃吸著墊 132之間，以經由吹氣管142注入壓縮氣體於玻璃面板2〇〇 與玻璃吸著墊132之間，以辅助貫穿孔134之吹氣道，以 避免貫穿孔134之氣量分布不均勻，致使玻璃面板2〇〇卸 片失敗之情形。 同時茶照第2圖及第3圖，第3圖係繪示第2圖中虛 線部份之局部放大圖。由第3圖中之虛線部份133的放大 圖可知’研磨頭130之玻璃吸著墊13;2係由複數個微小的 吸盤136所組成，此些微小的吸盤136可進一步地吸附玻 璃面板200於玻璃吸著墊132。其中，貫穿孔134係穿設於 吸盤136之間。玻璃吸著墊丨32之材料可為黑膠墊。 同時麥照第1A圖、第1B圖及第4圖，第4圖係繪示 本發明之研磨拋光方法一較佳實施例之流程圖。研磨拋光 方法300係用以薄化一玻璃面板2〇〇。研磨拋光方法3〇〇 包含一取片步驟310、一預壓研磨步驟32〇、一本體重量研 磨步驟330，以及一卸片步驟340。其中，取片步驟310係 在卸載平台140上進行，包含利用研磨頭之貫穿孔134 所形成之真空吸附孔，將玻璃面板2〇〇利用真空效應貼附 於研磨頭130上。接著，利用迴轉手臂12〇將玻璃面板2〇〇 移動至研磨拋光機台100,以進行玻璃面板2〇〇之拋光研 磨。 11 200827098 預壓研磨步驟320係在研磨時利用迴轉手臂120之升 降裝置122如氣壓缸，提供上提力於研磨頭130。在此預壓 研磨步驟320中，由於玻璃面板2〇〇仍係利用貫穿孔134 之真空效應與研磨頭130貼合，此時若是直接進行研磨拋 光的動作，則各易因為拋片而使得研磨失敗。預壓研磨步 驟320利用升降裝置122所提供之上提力，可緩緩地提供 預壓力於玻璃面板200與研磨頭130,使玻璃面板200藉由 此預壓力與研磨頭130上之玻璃吸著墊132的吸盤136緊 緊貼合。上提力之大小约為研磨頭130之本體重量的30% 至55%。由於此步驟之研磨時間不超過2〇秒，因此玻璃面 板200之切削量小，不至於影響研磨拋光之品質。 本體重量研磨步驟330包含解除貫穿孔134之真空效 應’此時’玻璃面板2〇〇係完全利用玻璃吸著墊132之吸 盤136固定於研磨頭ι3〇。如此一來，可避免因貫穿孔η* 之真空效應’而使玻璃面板200產生凹陷致使研磨不均之 情形。此步驟中，亦包含解除升降裝置122之上提力，使 研磨頭130利用研磨頭13()之本體重量進行研磨，以降低 研磨抛光之時間。接著，利用迴轉手臂120將研磨頭13〇 及玻璃面板200移動到卸載平台140。 卸片步驟340係於卸載平台14〇上進行，包含注入壓 縮氣體於玻璃面板2〇〇與研磨頭13〇之間，以解除玻璃面 板200與玻璃吸著墊132間之吸附狀態，使玻璃面板200 脫離研磨頭130。卸片步驟34〇之注入壓縮氣體，包含利用 研磨頭130之貫穿孔134形成之吹氣道，與配置於卸載平 12 200827098 台140之吹氣管142同時吹氣，貫穿孔134中之氣體會在 玻璃面板200與玻璃吸著墊132間產生氣道流出，吹氣管 142之氣體可經由此氣道灌入，撐開玻璃面板2〇〇與玻璃吸 著墊132,使玻璃面板200與玻璃吸著墊132脫離。此步驟 可避免因貫穿孔134之出氣置不均勻，而造成卸片失敗之 情形。 由上述本發明較佳實施例可知，應用本發明具有下列 優點。玻璃面板可利用迴轉手臂之移動，而分別在卸載平 台與研磨拋光機台上進行取卸片步驟與拋光研磨步驟，如 此一來’在清洗玻璃面板上殘存之研磨液時，清水與殘存 之研磨液不會回流至研磨拋光機台，影響研磨液的濃度。 此外’研磨拋光方法可利用預壓研磨步驟，使玻璃面板之 取片得以自動化，而不會使玻璃面板因真空凹陷致使研磨 不均。此外，藉由卸載平台之吹氣管，可避免因貫穿孔出 氣量不一致，致使卸片失敗之情形。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何所屬技術領域中具有通常知識者，在 不脫離本發明之精神和範圍内，當可作各種之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利範圍所界 定者為準。 【圖式簡單說明】 处為讓本發明之上述和其他目的、特徵、優點與實施例 把更明顯易懂，所附圖式之詳細說明如下： 13 200827098 $ 1A圖係、”曰不本發明之研磨拋光機台一較佳實 之示意圖 第1Β圖係繪示本發明之研磨拋光平 之局部放大圖。 施例 台一較佳實施例 第2圖係繪示本發明之拋光研磨機台另一較佳實施例 之示意圖。200827098 IX. Description of the Invention: [Technical Field] The present invention relates to an abrasive polishing machine, and more particularly to a polishing and polishing machine for a glass panel. [Prior Art] With the development of 3C (Computer, Communications and Consumer), more and more people use handheld devices as auxiliary tools in life. For example, common The mobile device includes a personal digital assistant (PDA), a mobile phone, a smart phone, etc. These mobile devices are light in size and easy to carry, so the number of people using them is increasing. The functions required are also becoming wider and wider. In order to improve the convenience of carrying the mobile device, the panel of the mobile device often needs to be thinned by the glass to make the mobile device thinner and lighter. The traditional polishing and polishing machine When thinning the glass panel, the glass panel can be adsorbed to the polishing head by the vacuum suction of the through hole in the grinding head. However, in this way, the glass panel is recessed at the through hole, and the glass panel is caused. Uneven grinding, and if the glass panel and the polishing head are fixed only by vacuum adsorption, vacuum suction is often used in the process. If the air is broken through the through hole, if most of the air passes through the through hole to form a passage, most of the air will leave through the passage, causing other through holes. Insufficient gas volume, and the vacuum cannot be completely broken. 200827098 In order to solve the above problems, there is also a manual step of removing and unloading the glass panel by manual means, which comprises manually tapping the glass panel attached to the glass absorbing pad to make the glass The panel is adsorbed on the glass absorbing pad on the polishing head. When the glass panel (four) grinding head is removed, the processed glass panel must be washed on the machine table (4), and then the air bubble is manually blown to destroy the glass on the polishing head. The adsorption state between the absorbing pad and the glass panel, and finally, the glass panel is sucked from the glass. Since the glass panel is cleaned with water during the process, the clean water and the residual polishing liquid will flow back to the machine, if it is If it is drained, it will increase the cost. If it is not drained, it will dilute the concentration of the slurry inside the machine. The collision at the time of the operation causes damage to the glass panel and affects the yield of the product. SUMMARY OF THE INVENTION Therefore, the main object of the present invention is to provide a polishing and polishing machine for maintaining the concentration of the polishing liquid when cleaning the glass panel. According to the above object of the present invention, an abrasive polishing machine for thinning a glass panel is provided. The polishing and polishing machine includes a rotary arm, a polishing head, and a polishing pad. The polishing head is connected to the swing arm, and The polishing head comprises a glazing absorbing pad and a plurality of through holes. The polishing pad is disposed on the opposite polishing slab to make the squeegee on the polishing head and the polishing pad by adsorbing the glass panel on the glass absorbing pad. Polished and ground. The polishing and polishing machine further comprises an unloading platform, the glass panel is attached to the polishing and polishing machine for a grinding and polishing step, and the glass panel is moved to the unloading platform by the rotary arm to perform a take-off and unloading step. The unloading platform further comprises at least one air blowing pipe, which can be disposed between the glass panel and the glass absorbing pad when unloading in 200827098 to inject compressed gas between the glass panel and the glass absorbing pad. The glass absorbing pad is composed of a plurality of suction cups, and the glass panel can be adsorbed to the glass absorbing pad by the suction cup. The through holes may be disposed between the suction cups. The grinding and polishing machine further includes a pressure control ίί ' pressure control unit connected to the through hole to provide - pressure source from the bore. If the pressure source is a negative pressure source, the through hole will form a real adsorption hole. If the pressure source is a compressed gas, the through hole will form an air blowing channel. The swing arm may further include a lifting device to provide an upper lifting force to the grinding head. The lifting device may be a pneumatic cylinder. The other complaints of this month are a grinding and polishing method for thinning glass panels. The lapping and polishing method includes a take-up step, a pre-grinding step, a - body weight grinding step, and a unloading step. The take-up step includes a plurality of vacuum suction holes using a polishing head to attach a glass panel to the polishing head. The pre-grinding step consists of providing a lifting force to the grinding head by means of lifting and lowering during grinding. The body weight grinding step includes lifting the true (four) and lifting force to grind using the body weight of the polishing head. The unloading step includes injecting a compressed gas between the glass panel and the polishing head to disengage the glass panel from the polishing head. The lifting force is about 3 to 55% of the weight of the body, and the grinding time of the pre-grinding step is equal to or less than 2 g seconds. The taking step and the unloading step are carried out on the platform. The pre-grinding step and the body weight grinding step are performed on the grinding and polishing machine. The panel can be connected to the grinding head by a rotating arm, moving on the unloading platform and grinding. Between the polishing machines. The unloading step can utilize the blowing air passage of the grinding head and the blowing pipe of the unloading platform to inject a compressed gas between the polishing head and the glass panel. Among them, 200827098 mouth rolling and vacuum adsorption holes are arranged in the force control unit control. The polishing head comprises glass;;;, and consists of a pressing plate and a disk to adsorb the glass panel to the glass absorbing pad, and the hole is disposed between the suction cups. By using this grinding and polishing machine, the glass panel can be used to perform the steps of polishing and polishing on the unloading platform and the polishing and polishing machine by using the private movement of the rotating arm, so that, on the cleaning glass panel When the polishing liquid remains, the clean water and the remaining polishing liquid do not flow back to the polishing and polishing machine port to affect the concentration of the polishing liquid. In addition, the abrasive polishing method can utilize the pre-pressure grinding step to automate the take-up of the glass panel without causing the glass panel to be unevenly ground due to vacuum depression. In addition, by the blowing of the platform (4), the inconsistency of the outflow volume of the through hole can be avoided, causing the failure of the sheet. [Embodiment] The spirit of the present invention will be clearly described in the following drawings and detailed description. It will be apparent to those skilled in the art that the present invention may be modified and modified without departing from the spirit and scope of the invention. Referring to Figures 1 and 1 in the same day, a schematic view and a partial enlarged view of a preferred embodiment of the polishing and polishing machine of the present invention are shown. The polishing and polishing machine 100 is used to polish and polish a glass panel 2 and thin the glass panel 200. The lapping and polishing machine table 100 includes a polishing pad 110, a swivel arm 120, and a lapping head 13A. The grinding head 13 is connected to the rotating hand 200827098 arm 120, and the polishing pad is disposed on the opposite grinding head 丨3〇. The polishing head 130 includes a glass absorbing pad 132 and a plurality of through holes 134, wherein the through holes 134 are passed through the glass absorbing pad 132 and communicate with a pressure control unit 150. The glass sorbent pad 132 can be a black rubber pad. The swing arm 120 further includes a lifting device 122 to provide an lifting force on the polishing head 130. The glass panel 200 can be adsorbed to the polishing head 130' by the glass suction 塾 132 to utilize the polishing head 13 and the polishing pad 11 The glass panel 2 is subjected to a polishing process to thin the glass panel 2 . Since the polishing and polishing machine 1 further includes an unloading platform 140, the grinding head 13〇 can be moved to the unloading platform 140 by using the rotating arm 12〇, and the glass panel 2 can be taken out and unloaded. Therefore, the clear glass is used to clean the glass. When the polishing liquid remains on the panel 2, the clean water and the remaining polishing liquid do not flow back to the polishing pad 11〇, which affects the polishing liquid concentration of the polishing pad 11〇. Referring to Fig. 2, there is shown a schematic view of another preferred embodiment of the polishing and polishing machine of the present invention. The through hole 134 is disposed in the glass absorbing pad 132 and connected to the pressure control unit i 5 , to source the pressure through the through hole 134 by the pressure control unit ki. When the pressure provided by the pressure control unit 150 is a negative pressure source, the connected through-holes 4 form a vacuum adsorption hole to provide vacuum suction, thereby reliably adsorbing the glass panel 2 to the glass absorbing pad 132. The film taking operation of the glass panel 2 is performed. When the pressure source provided by the pressure control unit itself 150 is a pressure or a contraction gas, the through hole 134 of the polishing head U0 forms an air blowing passage, and the compressed gas can be punched out through the air blowing passage of the through hole 134 to release the glass panel 2 The adsorption state between the crucible and the glass absorbing pad η] 200827098 separates the glass panel 200 from the polishing head 丨3〇, thereby completing the unloading operation of the glass panel 200. The unloading platform 140 may further include a blowing pipe 142. The blowing pipe ι42 may be disposed between the glass panel 2 and the glass absorbing pad 132 when the glass panel 200 is unloaded to inject compressed gas into the glass panel via the blowing pipe 142. 2〇〇 and the glass absorbing pad 132 are used to assist the air blowing passage of the through hole 134 to avoid uneven distribution of the air volume of the through hole 134, so that the glass panel 2 fails to unload the sheet. At the same time, the tea photos are shown in Fig. 2 and Fig. 3, and Fig. 3 is a partial enlarged view of the dotted line in Fig. 2. As can be seen from the enlarged view of the broken line portion 133 in FIG. 3, the glass absorbing pad 13 of the polishing head 130 is composed of a plurality of minute suction cups 136 which can further adsorb the glass panel 200. The pad is immersed in the glass 132. The through holes 134 are bored between the suction cups 136. The material of the glass absorbing pad 32 may be a black rubber pad. At the same time, the first embodiment of the present invention is a flow chart of a preferred embodiment of the polishing and polishing method of the present invention. The abrasive polishing method 300 is used to thin a glass panel 2 . The polishing method 3A includes a take-up step 310, a pre-grinding step 32, a body weight grinding step 330, and a unloading step 340. The taking step 310 is performed on the unloading platform 140, and includes a vacuum suction hole formed by the through hole 134 of the polishing head to attach the glass panel 2 to the polishing head 130 by a vacuum effect. Next, the glass panel 2〇〇 is moved to the polishing and polishing machine table 100 by the swing arm 12〇 to perform polishing polishing of the glass panel 2〇〇. 11 200827098 The pre-grinding step 320 provides an upper lifting force to the abrading head 130 by means of a lifting device 122 such as a pneumatic cylinder of the swivel arm 120 during grinding. In the pre-pressure grinding step 320, since the glass panel 2 is still attached to the polishing head 130 by the vacuum effect of the through hole 134, if the polishing and polishing operation is directly performed, the polishing is easy due to the polishing. failure. The pre-grinding step 320 utilizes the lifting force provided by the lifting device 122 to slowly provide pre-pressure to the glass panel 200 and the polishing head 130, so that the glass panel 200 is sorbed by the pre-pressure and the glass on the polishing head 130. The suction cup 136 of the pad 132 is tightly fitted. The amount of lifting force is about 30% to 55% of the weight of the body of the polishing head 130. Since the grinding time of this step does not exceed 2 sec seconds, the cutting amount of the glass panel 200 is small, and the quality of the polishing is not affected. The body weight grinding step 330 includes releasing the vacuum effect of the through hole 134. At this time, the glass panel 2 is completely fixed to the polishing head ι3 by the suction pad 136 of the glass absorbing pad 132. As a result, it is possible to avoid the occurrence of unevenness in the polishing of the glass panel 200 due to the vacuum effect of the through hole η*. In this step, the lifting force on the lifting device 122 is also removed, so that the polishing head 130 is ground by the weight of the polishing head 13 () to reduce the polishing and polishing time. Next, the polishing head 13A and the glass panel 200 are moved to the unloading stage 140 by the swing arm 120. The unloading step 340 is performed on the unloading platform 14 , and includes injecting compressed gas between the glass panel 2 and the polishing head 13 , to release the adsorption state between the glass panel 200 and the glass absorbing pad 132 to make the glass panel 200 is detached from the grinding head 130. In the unloading step 34, the compressed gas is injected, and the air blowing channel formed by the through hole 134 of the polishing head 130 is blown at the same time as the air blowing pipe 142 disposed on the unloading flat 12 200827098, and the gas in the through hole 134 is in the glass. An air passage is generated between the panel 200 and the glass absorbing pad 132. The gas of the air blowing tube 142 can be poured through the air passage, and the glass panel 2 and the glass absorbing pad 132 are opened to disengage the glass panel 200 from the glass absorbing pad 132. . This step can avoid the failure of the unloading due to the uneven discharge of the through holes 134. It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. The glass panel can utilize the movement of the swivel arm to perform the take-up and unloading steps and the polishing and grinding steps on the unloading platform and the polishing and polishing machine table respectively, so that when the polishing liquid remaining on the glass panel is cleaned, the water and the residual grinding are cleaned. The liquid does not flow back to the polishing and polishing machine, affecting the concentration of the slurry. In addition, the 'abrasive polishing method can utilize the pre-pressure grinding step to automate the picking of the glass panel without causing the glass panel to be unevenly ground due to vacuum depression. In addition, by unloading the air blowing pipe of the platform, it is possible to avoid the situation in which the unloading of the through holes is inconsistent, resulting in failure of unloading. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the scope of the present invention, and it is possible to make various changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial enlarged view of a polishing and polishing flat of the present invention. A preferred embodiment of the present invention is a second embodiment of the polishing and polishing machine of the present invention. A schematic diagram of a preferred embodiment.
圖 第3圖係繪示第2圖中虛線部份之局部放大 第4圖係繪示本發明之研磨拋光方法一較佳實施例之 流程圖。 【主要元件符號說明】 100 : 研磨拋光機台 110 研磨墊 120 : 迴轉手臂 122 升降裝置 130 : 研磨頭 132 玻璃吸著墊 133 ： 虛線部份 140 卸載平台 134 ： 貫穿孔 150 壓力控制單元 136 ： 吸盤 300 方法 142 ： 吹氣管 320 步驟 200 : 玻璃面板 340 步驟 310 : 步驟 330 : 步驟 14Figure 3 is a partial enlarged view of a broken line portion in Fig. 2. Fig. 4 is a flow chart showing a preferred embodiment of the polishing and polishing method of the present invention. [Main component symbol description] 100 : Grinding and polishing machine table 110 Grinding pad 120 : Swing arm 122 Lifting device 130 : Grinding head 132 Glass absorbing pad 133 : Dotted line part 140 Unloading platform 134 : Through hole 150 Pressure control unit 136 : Suction cup 300 Method 142: Blowing Tube 320 Step 200: Glass Panel 340 Step 310: Step 330: Step 14