JPWO2012077427A1 - Polishing tool - Google Patents

Abstract

The present invention relates to a polishing tool in which a plurality of polishing pad pieces are spread on a polishing surface plate, and a polishing tool in which an inclined surface is applied to a boundary side portion between a surface and an end face of the polishing pad piece.

Description

  The present invention relates to a polishing tool.

  A glass plate (plate-like body) used for liquid crystal displays causes minute irregularities and undulations on the surface to cause distortion and uneven color in the image. It has been removed. The polishing apparatus disclosed in Patent Document 1 presses a glass plate held by a carrier against a polishing pad (polishing tool) attached to a polishing surface plate, and relatively moves the polishing surface plate and the carrier. , Removing minute irregularities and undulations on the glass plate.

  Further, the polishing pad disclosed in Patent Document 1 is for polishing a large-sized glass plate having a side exceeding 2000 mm, and is configured as an integrated product (one polishing pad) due to problems in manufacturing. In addition, a plurality of small-sized polishing pad pieces are spread on a polishing surface plate.

  Patent Document 2 discloses a truing grindstone that favorably trues the surface of a polishing pad constituted by a plurality of polishing pad pieces.

International Publication No. 2007/020859 International Publication No. 2007/043263

  By the way, in the polishing pad of Patent Document 1 configured by laying a plurality of polishing pad pieces on a polishing surface plate, the end of the glass plate may be damaged during polishing of the glass plate.

  The present invention has been made in view of such circumstances, and in a polishing tool configured by laying a plurality of polishing pad pieces on a polishing surface plate, a polishing tool capable of preventing the plate-like body from being damaged. The purpose is to provide.

  In order to achieve the above object, the present invention provides a polishing tool configured by laying a plurality of polishing pad pieces on a polishing surface plate, and a slope is applied to a boundary side portion between a surface and an end face of the polishing pad piece. Provide an abrasive tool.

  The inventor of the present application, in a polishing tool configured by laying a plurality of polishing pad pieces on a polishing surface plate, as a result of earnestly examining the cause of breakage of the plate-like body that occurs when using the polishing tool, the following, Obtained knowledge.

  That is, the plate-like body is polished by the polishing pressure applied between the polishing tool and the plate-like body. At this time, the polishing pad piece in contact with the plate-like body is elastically deformed by the polishing pressure. And sink to the polishing platen side. As a result, a stepped portion is formed between the sinking polishing pad piece and the polishing pad piece adjacent to the polishing pad piece and not in contact with the plate-like body (not sinking). Then, the end of the plate-like body is damaged by the collision of the end of the plate-like body moving during polishing with the stepped portion, that is, the side surface of the polishing pad piece that is not submerged. I found it.

  Therefore, in order to prevent such a problem, in the present invention, a slope is applied to the boundary side portion between the surface and the end surface of the polishing pad piece. That is, at the joint portion of the plurality of polishing pad pieces, the slopes were formed on the land portions of the polishing pad pieces by chamfering.

  As a result, the end of the plate-like body that is moving during polishing smoothly runs on the next polishing pad piece from the polishing pad piece that is currently in contact along the inclined surface of the polishing pad piece that is in contact next. . Thereby, according to this invention, since the conventional problem that the edge part of a plate-shaped object collides with a level | step-difference part, or it catches can be eliminated, damage to a plate-shaped object can be prevented.

  The polishing pad piece of the present invention is preferably held by vacuum suction and holding on the polishing surface plate through an elastic sealing material.

  When a vacuum suction holding means is adopted as means for holding the polishing pad piece on the polishing surface plate, a number of suction holes are opened in the polishing surface plate, and these suction holes are connected to a suction pump. In addition, the polishing pad piece is not directly held by vacuum suction on the polishing platen, but the polishing pad is held on the polishing platen via a soft and elastic sealing material. Thereby, the vacuum adsorbability of the polishing pad piece with respect to the polishing surface plate is improved.

  By the way, when the sealing material is used, there is a concern that the amount of sinking of the polishing pad piece increases because the sealing material is soft. However, according to the present invention, the plate-like body can be prevented from being damaged by the action of the end of the plate-like body riding on the slope, even if a sealing material is used.

According to the present invention, the compression rate of the sealing material (according to Appendix 1 of JIS L1021-6, where the initial load is 100 gf / cm ² and the final load is 1120 gf / cm ² ) is 10 to 40. % Is preferred.

  When the compression ratio exceeds 40%, the adsorbing retention property (sealability) of the polishing pad piece with respect to the polishing surface plate is improved, but the durability of the sealing material is lowered because the sealing material is excessively soft. On the other hand, if the compression rate of the sealing material is less than 10%, the sealing material is too hard, and the sealing performance is lowered, which is not preferable.

  The polishing pad piece of the present invention is preferably attached to the sealing material via a polishing pad support member.

  According to the present invention, since the polishing pad piece can be reinforced by the polishing pad support member, the service life of the polishing pad piece can be extended.

  According to the present invention, the polishing surface of the plate-like body that is moved relative to the polishing tool is pressed against the surface of the polishing tool, and at the joint of the polishing pad pieces of the polishing tool, It is preferable that the inclined surface is provided only on the boundary side portion where the side portion enters.

  The polishing surface of the plate-like body is polished by a polishing pressure applied between the polishing tool and the plate-like body, and a relative movement operation by rotation, revolution, and oscillation.

  As a result of intensive studies, the inventor of the present application has found that the edge of the plate-like body is damaged when the side portion of the plate-like body that is relatively moving is about to run over the seam of the polishing pad piece. Found out that it would be expensive. Therefore, in the present invention, at the joint of the polishing pad pieces, the slope is applied only to the boundary side portion where the side portion of the plate-like body enters. Thereby, it is possible to prevent the plate-like body from being damaged without applying slopes to all the boundary side portions of the polishing pad piece.

  According to the present invention, it is preferable that the height of the inclined surface in the thickness direction of the polishing pad composed of the plurality of polishing pad pieces is 0.5 to 1.5 mm.

  Since the amount of the polishing pad piece that is in contact with the plate-like body is elastically deformed by the polishing pressure and sinks to the polishing surface plate side is approximately 0.3 to 0.8 mm, the height of the slope in the thickness direction of the polishing pad is By setting the thickness to 0.5 to 1.5 mm, it is possible to solve the conventional problem that the end portion of the plate-like body collides with or is caught by the stepped portion. Further, if the height of the slope exceeds 1.5 mm, the width of the slope in the surface direction of the polishing pad increases, and defects in the plate-like body due to the slope are likely to occur. Is preferably 1.5 mm or less.

  According to the polishing tool of the present invention, since the slope is provided at the boundary side portion between the surface and the end face of the polishing pad piece, it is possible to prevent the plate-like body that is the object of polishing from being damaged.

FIG. 1 is a plan view showing an overall structure of a polishing apparatus to which a polishing tool of an embodiment is applied. FIG. 2 is an assembled perspective view of the carrier and the canvas. FIG. 3 is a side view showing the configuration of the polishing stage. FIG. 4 is an enlarged cross-sectional view of a main part showing a polished state of the glass plate. FIG. 5 is a perspective view showing the configuration of the polishing surface plate with a part broken away. FIG. 6 is a cross-sectional view showing the configuration of the polishing pad and the polishing surface plate. FIG. 7 is a plan view showing the polishing operation of the glass plate with respect to the polishing pad. FIG. 8 is a perspective view of the polishing pad. FIG. 9 is an explanatory diagram in which the end portion of the glass plate collides with the step portion of the polishing pad piece. FIG. 10 is an explanatory diagram in which the end of the glass plate rides on the slope of the polishing pad piece.

  Hereinafter, preferred embodiments of a polishing tool according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a plan view showing an overall configuration of a polishing apparatus to which a polishing tool of an embodiment is applied. For example, the polishing apparatus 10 uses a polishing tool according to an embodiment for a polishing surface of a large glass plate (plate body) G having a side exceeding 2000 mm and a thickness of 0.2 mm to 0.7 mm. This is a polishing apparatus for polishing to a flatness necessary for a glass plate.

  The polishing apparatus 10 includes a conveyor 12 that conveys the glass plate G before polishing, a glass plate attaching stage 16 that attaches the glass plate G to the canvas 14, a first polishing stage 18, a second polishing stage 20, and polishing completion. A glass plate removal stage 22 for removing the glass plate G from the canvas 14, a glass plate carry-out conveyor 24, a canvas cleaning stage 26, a canvas drying stage 28, and a canvas return conveyor 30 are mainly provided. Hereinafter, in order to simplify the description, the glass plate attaching stage 16, the first polishing stage 18, the second polishing stage 20, the glass plate removing stage 22, the canvas cleaning stage 26, and the canvas drying stage 28 are simply described. It is described as stages 16, 18, 20, 22, 26, 28.

  The polishing apparatus 10 includes a transport device 150 that transports the canvas 14 from the stage 16 to the stage 18, a transport device 152 that transports the canvas 14 from the stage 18 to the stage 20, and a transport device that transports the canvas 14 from the stage 20 to the stage 22. 154 is provided. These transfer devices 150, 152, and 154 have the same configuration, and their operations are controlled by a control unit 200 that controls the polishing apparatus 10 in an integrated manner, and are reciprocated synchronously in the left-right direction in FIG.

  The unpolished glass plate G conveyed by the conveyor 12 is sucked and held by a suction pad 34 provided on the arm 33 of the robot 32. Then, it is transferred from the conveyor 12 to the conveyor 36 by the rotation operation of the arm 33, and is conveyed to the stage 16 by the conveyor 36.

  In the stage 16, the glass plate G before polishing is attached to the canvas 14. The sticking method will be described. The canvas 14 is held by a lifting device (not shown) on the stage 16, and when the glass plate G is positioned below the canvas 14, the canvas 14 is moved downward by the lifting device. 2 is pressed against the non-polished surface of the glass plate G. The adsorption sheet 39 made of polyurethane foam attached to the back plate 38 of the canvas 14 shown in FIG. With this pressing force, the non-polished surface of the glass plate G is detachably attached to the back plate 38 via the suction sheet 39. Thereafter, the canvas 14 is held by the transfer device 150 of FIG. 1 and transferred to the stage 18 of FIG. 3 where it is held by the carrier 52 of the polishing head 50.

  As shown in FIG. 2, the canvas 14 has a rectangular back plate 38 stretched between a rectangular upper frame 40 and a lower frame 42, and then the upper frame 40 and the lower frame 42 are not shown. It is configured by fastening with bolts. The back plate 38, the upper frame 40, and the lower frame 42 are made of a material that can sufficiently withstand the polishing pressure during polishing and the polishing resistance of the glass plate G, for example, a metal such as aluminum. The thickness of the back plate 38 is preferably about 2 to 4 mm.

  Next, the polishing head 50 shown in FIG. 3 will be described. Since the polishing head 50 of the stage 18 and the polishing head 50 of the stage 20 have the same structure, the same reference numerals are used for explanation.

  The polishing head 50 includes a main body casing 51. The main body casing 51 includes a rotation / revolution drive mechanism (not shown). The rotation / revolution drive mechanism is composed of a planetary gear mechanism and a motor, and the output shaft of the planetary gear mechanism driven by the motor is connected to a spindle 56 suspended in the vertical direction. . A carrier 52 is connected to the spindle 56. Therefore, when the planetary gear mechanism is driven, the carrier 52 and the canvas 14 are rotated around the spindle 56 and revolved around a predetermined center of revolution.

  Further, the main casing 51 is connected to the slider 158 via the lifting mechanism 156. The main body casing 51 is moved up and down with respect to the slider 158 by the lifting mechanism 156, whereby the carrier 52 is moved to the circular polishing pad (polishing tool) 58 of the stage 18 and the circular polishing pad (polishing tool) 60 of the stage 20. While moving forward and backward, the polishing surface of the glass plate G attached to the suction sheet 39 of the back plate 38 is pressed against the polishing pad 58 (60) with a predetermined polishing pressure as shown in FIG.

  Although details of the polishing pad 58 will be described later, a lightweight and highly rigid metal (for example, aluminum) polishing plate (polishing pad support member) 110 and a soft resin (for example, polyurethane) that enhances adsorption retention. It is affixed on the upper surface of the polishing surface plate 62 as shown in FIG.

  The polishing surface plate 62 is rotatably supported on the polishing table 64 via a bearing 65, and the center of rotation is set coaxially with the central axis of the polishing pad 58. A gear portion 66 is provided on the side surface of the polishing surface plate 62, and a gear 67 rotated by a motor 68 is engaged with the gear portion 66. Further, the gear portion 66 is formed in an arc shape centering on the central axis of the polishing pad 58. Therefore, by driving the motor 68, the polishing pad 58 is rotated about its central axis.

  The polishing table 64 is slidably supported by a pair of guide rails 69 and 69 arranged in parallel. By providing a drive unit (not shown) for reciprocating the polishing table 64 along the guide rails 69, 69, the polishing pad 58 is swung horizontally when necessary. The swinging direction of the polishing pad 58 may be a direction orthogonal to the conveying direction by the conveying device 150 of FIG. 1 or may be a direction along this conveying direction. That is, any direction that swings the polishing pad 58 in the horizontal direction may be used.

  Note that a number of hoses (not shown) for supplying slurry to the back side of the polishing pad 58 are connected to the polishing surface plate 62 of FIG. In order to prevent the hoses from being entangled, the rotation of the polishing pad 58 is regulated so as to turn within a predetermined angle range from a predetermined reference position. Slurry supplied from the hose to the back side of the polishing pad 58 passes through the polishing pad 58 and oozes out from the surface of the polishing pad 58.

  Further, as shown in the sectional view of FIG. 6, the polishing surface plate 62 is provided with suction holes 114, 114... For holding the polishing pads 58, 60 by vacuum suction, and these suction holes 114, 114. Is connected to a suction pump 118 via a three-way valve 116. Therefore, the polishing pad 58 is held by vacuum suction on the polishing surface plate 62 by connecting the suction pump 118 and the suction holes 114, 114... By the three-way valve 116. Further, by releasing the three-way valve 116 to the atmosphere, the adsorption holding of the glass plate G by the polishing surface plate 62 is released.

  The swing operation of the polishing pad 58 such as the swing speed, swing range, and swing speed, and the revolution operation of the polishing head 50 such as the rotation speed, revolution diameter, revolution speed, and the like are independently controlled by the control unit 200 of FIG. ing.

  Since the configuration of each part of the polishing pad 60 is the same as the configuration of the polishing pad 58 described above, description thereof is omitted here.

  On the other hand, linear motion guides 70 are attached to the slider 158 of the stage 18 as shown in FIG. The linear motion guides 70, 70 are fitted to the guide rails 72, 72. As shown in FIG. 1, the guide rails 72 and 72 are arranged toward a maintenance stage 74 that maintains the spindle 56 and the carrier 52 of the stage 18.

  Further, as shown in FIG. 3, linear motion guides 70, 70 are similarly attached to the slider 158 of the stage 20, and the linear motion guides 70, 70 are fitted to the guide rails 160, 160. As shown in FIG. 1, the guide rails 160 and 160 are disposed toward a maintenance stage 76 for maintaining the spindle 56 and the carrier 52 of the stage 20.

  Next, the carrier 52 shown in FIG. 2 will be described.

  A plurality of holding portions 80, 80... For holding the canvas 14 on the carrier 52 are provided on the four sides of the carrier 52. As shown in FIG. 4, the holding unit 80 includes a disc 82 that presses the end portions 52 </ b> A of the four sides of the carrier 52, a disc 84 that presses the end portions 40 </ b> A of the four sides of the upper frame 40 of the canvas 14, The pin 86 is connected to the disk 84. The pressing means for pressing the disk 82 and the disk 84 as described above is provided in the carrier 52. For example, the piston of the cylinder is connected to the pin 86 and the piston is contracted to draw the disk 82 and the disk 84 together. The disc 82 is pressed against the end 52A, and the disc 84 is pressed against the end 40A. The pressing means is not limited to the cylinder, and the shape of the holding portion 80 is not limited to this example. That is, any configuration may be used as long as the canvas 14 can be detachably held on the carrier 52.

  On the other hand, a mount 88 is formed along the periphery of the lower surface of the carrier 52, and a seal member 90 is attached to the lower surface of the mount 88. When the canvas 14 is held by the holding portion 80 and the glass plate G is pressed against the polishing pads 58 and 60 by the carrier 52, the upper surface of the back plate 38 is pressed against the seal member 90. Thereby, an air chamber 54 with good airtightness is formed between the carrier 52 and the canvas 14.

  The carrier 52 is opened with jets 98, 98... For jetting compressed air into the air chamber. These injection ports 98, 98... Communicate with an air supply path 102 indicated by a broken line in FIG. 3 through an air chamber 100 provided on the upper surface of the carrier 52. The air supply path 102 extends to the outside of the polishing head 50 via a rotary joint (not shown) attached to the polishing head 50, and is connected to an air pump 106 via a valve 104. Therefore, when the valve 104 is opened, the compressed air from the air pump 106 is supplied to the air chamber 54 via the air supply path 102, the air chamber 100 of FIG. Thus, the pressure of the compressed air is transmitted to the glass plate G through the back plate 38, and the polishing surface of the glass plate G is pressed against the polishing pads 58 and 60 of FIG. Further, since the compressed air supplied to the air chamber 54 is sealed by the seal member 90, leakage from the air chamber 54 is suppressed. Thereby, the pressure of compressed air is efficiently transmitted to the glass plate G.

  When the polishing of the glass plate G is completed at the stage 20 shown in FIG. 1, the canvas 14 is removed from the carrier 52 and conveyed to the stage 22 by the conveying device 154. At the stage 22, the glass plate G that has been polished is peeled off from the canvas 14. The peeled glass plate G is conveyed by the conveyor 138, and is sucked by the suction head 144 attached to the arm 142 of the robot 140, and is transferred to the glass plate carry-out conveyor 24 by the operation of the robot 140 and polished. It is carried out of the apparatus 10.

  Further, the canvas 14 from which the glass plate G has been peeled off is transported to the stage 26 by the conveyor 146, where it is washed with water. The washed canvas 14 is conveyed to the stage 28 by the conveyor 148, where it is heated and dried. Then, the dried canvas 14 is transported to the stage 16 by the canvas return conveyor 30 and reused for attaching the glass plate G. The above is the overall configuration of the polishing apparatus 10.

  Next, the polishing pad 58 (60) shown in FIGS. 5 and 6 will be described.

  As shown in the plan view of FIG. 7 and the perspective view of FIG. 8, the polishing pad 58 (60) is composed of eight polishing pad pieces 120, 120... And is spread on the polishing surface plate 62 as shown in FIG. Configured. Further, each of the polishing pad pieces 120 and 120 is attached to the sealing material via the polishing plate 110 with an adhesive or a double-sided tape. Each of the polishing pad pieces 120, 120, the polishing plate 110, and the sealing material 112 are held by vacuum suction on the polishing surface plate 62. Further, a slope 122 is provided on the boundary side between the surface 120A and the end face 120B of each polishing pad piece 120, 120.

  The inventor of the present application occurs when the polishing pad 58 (60) is used in a polishing pad 58 (60) configured by laying a plurality of polishing pad pieces 120, 120. As a result of earnestly examining the cause of breakage of the glass plate G, the following knowledge was obtained.

  As shown in FIG. 9, the glass plate G is polished by the polishing pressure indicated by the arrow A provided between the polishing pad 58 (60) and the glass plate G. At this time, the polishing pad piece 120-1 in contact with the glass plate G is elastically deformed by the polishing pressure and sinks to the polishing surface plate 62 side. Although FIG. 9 shows a view in which the sealing material 112 is elastically deformed and the polishing pad piece 120-1 sinks, the polishing pad piece 120-1 itself may be elastically deformed and sink. Due to this phenomenon, between the submerged polishing pad piece 120-1 and the polishing pad piece 120-2 adjacent to the polishing pad piece 120-1 and not in contact with the glass plate G (not submerged). A stepped portion is formed on the surface. Then, the end G1 of the glass plate G moving in the direction of arrow B during polishing collides with or catches on the stepped portion, that is, the side surface 120-2A of the polishing pad piece 120-2 that is not submerged, The end G1 of the glass plate G was found to be damaged.

  Therefore, in order to prevent such a problem, in the polishing pad 58 (60) of the embodiment, the slope 122 is provided on the boundary side portion between the surface 120A and the end surface 120B of the polishing pad piece 120 as shown in FIG. That is, the slope 122 was given to the land part of the polishing pad piece 120 by the chamfering process in the joint part of the eight polishing pad pieces 120, 120. In the embodiment, the polishing pad 58 (60) including the eight polishing pad pieces 120, 120... Is illustrated, but the number of the polishing pad pieces 120 is not limited to eight, and may be a plurality. .

  As a result, as shown in FIG. 10, the glass plate G moving in the direction of arrow B during polishing is inclined from the polishing pad piece 120-1 that is currently in contact with the slope 122 of the polishing pad piece 120-2 that is next in contact. Are smoothly run on the next polishing pad piece 120-2. Thereby, according to this polishing pad 58 (60), since the edge part G1 of the glass plate G collides with a level | step-difference part as shown in FIG. Can be prevented.

The height h of the slope 122 in the thickness direction of the polishing pad 58 (60) is preferably 0.5 to 1.5 mm. The amount of the polishing pad piece 120-1 that is in contact with the glass plate G is elastically deformed by the polishing pressure and sinks to the polishing surface plate 62 side is approximately 0.3 to 0.8 mm. If h is less than 0.5 mm, the end portion G1 of the glass plate G collides with or catches on the stepped portion, so that the height h of the inclined surface 122 is preferably 0.5 mm or more. Further, if the height h of the slope 122 exceeds 1.5 mm, the width of the slope 122 in the surface direction of the polishing pad 58 (60) increases, and defects in the glass plate G due to the slope 122 are likely to occur. The height h of the slope 122 is preferably 1.5 mm or less.
The angle θ of the slope 122 with respect to the pad main surface in the thickness direction of the polishing pad 58 (60) is preferably 30 to 60 °. If the angle θ is less than 30 °, chamfering is difficult, and if the angle θ exceeds 60 °, the end portion G1 of the glass plate G is easily caught on the inclined surface 122, so the angle θ is 30 to 60 °. Is preferred.

  On the other hand, the polishing pad 58 (60) of the embodiment is held by vacuum suction on a polishing surface plate via a soft and elastic sealing material 112. That is, the polishing pad piece 120 is not directly sucked and held on the polishing platen 62 but is held on the polishing platen 62 via the soft sealing material 112. Thereby, the vacuum adsorbability of the polishing pad piece 120 with respect to the polishing surface plate 62 is improved.

  When the soft sealing material 112 is used as described above, there is a concern that the sealing material 112 is easily elastically deformed by the polishing pressure, and the sinking amount is increased. However, according to the polishing pad 58 (60) of the embodiment, even if the soft sealing material 112 is used due to the action that the end G1 of the glass plate G runs on the slope 122 as shown in FIG. Damage to the plate G can be prevented.

The compression rate of the sealing material 112 (according to Appendix 1 of JIS L1021-6-2007, where the initial load is 100 gf / cm ² and the final load is 1120 gf / cm ² ) is 10 to 40%. Is preferred.

  When the compression ratio is more than 40%, the adsorption retention (sealability) of the polishing pad piece 120 with respect to the polishing surface plate 62 is improved, but the durability of the sealing material 112 is lowered because the sealing material 112 is excessively soft. On the other hand, if the compression rate of the sealing material 112 is less than 10%, the sealing material 112 is too hard and the sealing performance is lowered.

  In the polishing pad 58 (60) of the above-described embodiment, the example in which the inclined surface 122 is provided on the entire peripheral portion of the polishing pad piece 120 has been described. However, the portion on which the inclined surface 122 is applied is not limited to the entire peripheral portion. . That is, at the four seams 124, 126, 128, 130 shown by the solid lines in FIGS. 7 and 8 of the polishing pad pieces 120, 120..., The sides of the moving glass plate G (in this case, the long sides) Part) Gradient 122 may be given only to the boundary side part where G-1 and G-2 enter. That is, in FIG. 10, the slope 122 may be provided only on the boundary side portion of the polishing pad 120-2.

  The polishing surface of the glass plate G is determined by the polishing pressure applied between the polishing pad 58 (60) and the glass plate G, the rotation of the glass plate G indicated by the arrow A around the spindle 56 in FIG. Polishing is performed by the revolution of the glass plate G shown and the relative movement operation by the horizontal swing of the polishing pad 58 (60) shown by the arrow C.

  As a result of intensive studies, the inventor of the present application tried to get the side portions G-1 and G-2 of the glass plate G in relative movement to run substantially parallel to the joints 126 and 130 of the polishing pad pieces 120, 120. When it did, it discovered that the breakage frequency of the edge part of the glass plate G became high.

  Therefore, in the polishing pad 58 (60) of the embodiment, the slopes 122 are provided only at the boundary sides where the sides G-1 and G-2 of the glass plate G enter at the joints 126 and 130, respectively. Thereby, it is possible to prevent the glass plate G from being damaged without applying the inclined surface 122 to all the boundary side portions of the polishing pad pieces 120 and 120.

  In addition, in embodiment, although the glass plate G was illustrated as a plate-shaped object, it is not limited to the glass plate G, If it is a plate-shaped object by which the grinding | polishing surface is grind | polished with an abrasive | polishing tool, it is the present invention. A polishing tool can be applied.

Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope and spirit of the invention.
This application is based on Japanese Patent Application No. 2010-272820 filed on Dec. 7, 2010, the contents of which are incorporated herein by reference.

  G ... Glass plate, 10 ... Polishing device, 12 ... Conveyor, 14 ... Canvas, 16 ... Glass plate sticking stage, 18 ... First polishing stage, 20 ... Second polishing stage, 22 ... Glass plate removal stage, 24 ... Glass plate carry-out conveyor, 26 ... Canvas cleaning stage, 28 ... Canvas drying stage, 30 ... Canvas return conveyor, 32 ... Robot, 33 ... Arm, 34 ... Suction pad, 36 ... Conveyor, 38 ... Back plate, 39 ... Suction sheet 40 ... Upper frame, 42 ... Lower frame, 50 ... Polishing head, 51 ... Main body casing, 52 ... Carrier, 54 ... Air chamber, 56 ... Spindle, 58, 60 ... Polishing pad, 62 ... Polishing surface plate, 64 ... Polishing Table, 65 ... Bearing, 66 ... Gear part, 67 ... Gear, 68 ... Motor, 69 ... Guide rail, 70 ... Linear motion guide, 72 ... Id rail, 74, 76 ... maintenance stage, 80 ... holding part, 82, 84 ... disc, 86 ... pin, 88 ... mount, 90 ... seal member, 98 ... injection port, 100 ... air chamber, 102 ... air supply path, 104 ... Valve, 106 ... Air pump, 110 ... Polishing plate, 112 ... Sealing material, 114 ... Suction hole, 116 ... Three-way valve, 118 ... Suction pump, 120 ... Polishing pad piece, 122 ... Slope, 124, 126, 128, 130 ... Seam, 138 ... conveyor, 140 ... robot, 142 ... arm, 144 ... suction head, 146 ... conveyor, 148 ... conveyor, 150, 152, 154 ... conveyor, 156 ... lift mechanism, 158 ... slider, 160 ... guide rail, 200 ... control unit

Claims (6)

In a polishing tool configured by laying a plurality of polishing pad pieces on a polishing surface plate,
A polishing tool in which an inclined surface is provided at a boundary side portion between a surface and an end surface of the polishing pad piece.   The polishing tool according to claim 1, wherein the polishing pad piece is held by vacuum suction on the polishing platen through an elastic sealant. The compression rate of the sealing material (according to JIS L1021-6 appendix 1, where the initial load is 100 gf / cm ² and the final load is 1120 gf / cm ² ) is 10 to 40%. 2. The polishing tool according to 2.   The polishing tool according to claim 2 or 3, wherein the polishing pad piece is attached to the sealing material via a polishing pad support member. The surface of the polishing tool is pressed against the polishing surface of a plate-like body that is moved relative to the polishing tool,
The polishing tool according to any one of claims 1 to 4, wherein the slope is applied only to a boundary side portion on a side where the side portion of the plate-like body enters at a joint of the polishing pad piece of the polishing tool. .   The polishing tool according to any one of claims 1 to 5, wherein a height of the inclined surface in a thickness direction of a polishing pad constituted by the plurality of polishing pad pieces is 0.5 to 1.5 mm.

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