CN116460732A - Substrate polishing apparatus and control method - Google Patents
Substrate polishing apparatus and control method Download PDFInfo
- Publication number
- CN116460732A CN116460732A CN202310621088.8A CN202310621088A CN116460732A CN 116460732 A CN116460732 A CN 116460732A CN 202310621088 A CN202310621088 A CN 202310621088A CN 116460732 A CN116460732 A CN 116460732A
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- air
- substrate
- polishing head
- air passage
- negative pressure
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- 239000000758 substrate Substances 0.000 title claims abstract description 107
- 238000005498 polishing Methods 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001179 sorption measurement Methods 0.000 claims abstract description 33
- 230000009471 action Effects 0.000 claims description 7
- 230000008569 process Effects 0.000 abstract description 14
- 238000009434 installation Methods 0.000 abstract description 3
- 238000007517 polishing process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of substrate grinding, and provides a substrate grinding device and a control method. A first air passage is arranged in the polishing head; the top of sucking disc is connected in the bottom of polishing head, and the bottom of sucking disc is provided with the gas pocket that communicates with first air path passageway to and be located the contact surface around the gas pocket. The negative pressure through the gas pocket directly adsorbs the base plate and can shorten the installation time of base plate loading on the polishing head, and the adsorption force of gas pocket and the frictional force of contact surface can make the base plate firmly fix with the sucking disc bottom, just need not set up the holding ring, have reduced the grinding cost. In addition, when the substrate is unloaded, the first air passage can provide air pressure for the air holes besides not providing negative pressure for the air holes, so that the substrate can be rapidly unloaded, the whole time of the grinding process is shortened, and the efficiency of the grinding process is accelerated.
Description
Technical Field
The invention relates to the technical field of substrate grinding, in particular to a substrate grinding device and a control method.
Background
An integrated circuit is a circuit with specific functions, which integrates a certain number of electronic components and wiring between the components together by adopting a certain process. CMP, also known as chemical mechanical polishing, is a means of achieving planarization in integrated circuit fabrication by combining surface chemistry with mechanical polishing to effect removal of nanoscale dissimilar materials from a substrate surface.
In the traditional polishing process, before polishing, a substrate is loaded in the polishing head by utilizing secondary vacuum, the principle of the secondary vacuum is that an elastic film is connected to the bottom of the polishing head, the bottom of the elastic film deforms towards the direction of the polishing head, a vacuum area is formed between the bottom of the elastic film and the substrate, the substrate can be tightly attached to the elastic film under the action of negative pressure, the controllability of the mode is poor, the consumed time is long, and the loading failure condition is likely to occur. In the polishing process, the substrate is pressed on the polishing pad by the polishing head, and the substrate is polished, namely flattened, by the action of abrasive materials, chemical liquid and the like of the polishing liquid. In order to prevent the occurrence of slip sheets during polishing, a retaining ring needs to be provided on the polishing head, the substrate is positioned in the retaining ring, and the bottom end surface of the retaining ring needs to be maintained at the same height as the bottom end surface of the substrate, so that the retaining ring also contacts the polishing pad to participate in polishing together with the substrate. The retaining ring is an important, costly consumable. This is not unlike increasing the grinding cost. Because the polishing solution exists between the substrate and the polishing head, the substrate is not easy to detach after polishing is finished, and the overall time of the grinding process is increased.
Disclosure of Invention
Therefore, the invention solves the technical problems that the polishing head is not easy to load the substrate through secondary vacuum before polishing in the prior art, the substrate is not easy to detach from the polishing head after polishing, the whole time of the polishing process is increased, the retaining ring is needed to be used in the whole polishing process, and the grinding cost is increased. Thereby providing a substrate polishing apparatus and a control method.
In order to solve the above-described problems, the present invention provides a substrate polishing apparatus comprising:
the polishing device comprises a polishing head, wherein a first air passage is arranged in the polishing head; the top of the sucker is connected to the bottom of the polishing head, and the bottom of the sucker is provided with an air hole communicated with the first air path channel and a contact surface positioned around the air hole.
Optionally, a plurality of air holes are arranged at the bottom of the sucker.
Optionally, the plurality of air holes are uniformly distributed from the center position to the edge position of the bottom of the sucker.
Optionally, a second air channel communicated with the first air channel and a plurality of third air channels communicated with the second air channel are arranged in the sucker, the third air channels extend from the central position of the bottom of the sucker to the edge position respectively, and the air holes are sequentially arranged at intervals and communicated with the third air channels.
Optionally, the sucking disc includes connecting portion and adsorption part, connecting portion is located polishing head with between the adsorption part, the second gas circuit passageway sets up in the connecting portion, the third gas circuit passageway sets up in the adsorption part, a plurality of the gas pocket is seted up the bottom of adsorption part.
Optionally, the connecting portion and the adsorbing portion are integrally formed.
Optionally, the first air passage extends to extend out of the top of the polishing head and is connected to an external negative pressure device.
Optionally, an air pressure sensor is disposed on the first air path channel.
The invention provides a use method of a substrate grinding device, which comprises the following steps:
placing the substrate at the bottom of the sucker and contacting with the air hole;
providing negative pressure to the air hole through a first air passage;
the air hole adsorbs the substrate under the action of negative pressure and controls the polishing head to start rotating.
Optionally, the method further comprises:
controlling the polishing head to stop rotating;
the first air passage stops providing negative pressure to the air hole, or the first air passage provides air pressure to the air hole.
The invention has the following advantages:
1. the invention provides a substrate grinding device which comprises a polishing head and a sucker. A first air passage is arranged in the polishing head; the top of sucking disc is connected in the bottom of polishing head, and the bottom of sucking disc is provided with the gas pocket that communicates with first air path passageway to and be located the contact surface around the gas pocket.
When the polishing head is used, the substrate can be placed at the bottom of the sucker, the end face of the bottom of the sucker is contacted with the substrate, the first air passage in the polishing head provides negative pressure for the air holes, the air holes adsorb the substrate through the negative pressure, and the substrate can be pressed on the contact surface around the air holes. After the polishing head rotates, the sucker and the polishing head synchronously rotate, and the substrate cannot relatively displace with the sucker under the action of the adsorption force of the air hole and the friction force of the contact surface. After the polishing is completed, the negative pressure may be stopped to be supplied to the air holes through the first air path passage, or the air pressure may be supplied to the air holes through the first air path passage, so that the substrate may be easily unloaded.
Therefore, the substrate grinding device provided by the invention can directly adsorb the substrate through the negative pressure of the air hole, shorten the mounting time of the substrate on the polishing head, and firmly fix the substrate with the bottom of the sucker by the adsorption force of the air hole and the friction force of the contact surface, so that a retaining ring is not required to be arranged, and the grinding cost is reduced. In addition, when the substrate is unloaded, the first air passage can provide air pressure for the air holes besides not providing negative pressure for the air holes, so that the substrate can be rapidly unloaded, the whole time of the grinding process is shortened, and the efficiency of the grinding process is accelerated.
2. According to the substrate grinding device provided by the invention, a plurality of air holes are formed in the bottom of the sucker. The air holes are communicated with the first air passage, and can provide negative pressure to improve the stability of the substrate adsorption.
3. According to the substrate grinding device provided by the invention, the plurality of air holes are uniformly distributed from the center position to the edge position of the bottom of the sucker. The plurality of air holes are uniformly distributed from the center position to the edge position of the bottom of the sucker, namely uniform adsorption force to the substrate is formed, the stress balance of each position of the substrate in the rotating process is ensured, and the substrate and the sucker are prevented from being separated.
4. The substrate grinding device provided by the invention is characterized in that a second air passage communicated with a first air passage and a plurality of third air passages communicated with the second air passage are arranged in a sucker, the third air passages respectively extend from the central position to the edge position of the bottom of the sucker, and a plurality of air holes are sequentially arranged at intervals and communicated with the third air passages.
The negative pressure provided by the first air passage channel can enter each third air passage channel through the second air passage channel, and the plurality of air holes are communicated with the third air passage channels, so that the negative pressure of each air hole can be ensured to be the same, and the adsorption force born by each position of the substrate is ensured to be the same.
5. The invention provides a substrate grinding device, wherein a sucker comprises a connecting part and an adsorption part, the connecting part is arranged between a polishing head and the adsorption part, a second air passage is arranged in the connecting part, a third air passage is arranged in the adsorption part, and a plurality of air holes are formed in the bottom of the adsorption part. The top of connecting portion can be connected with the top of polishing head, and first gas circuit passageway and second gas circuit passageway communicate, and the third gas circuit passageway is located adsorption part and communicates with the second gas circuit passageway. The connecting portion is only provided with the second air passage, so that stability of the structure of the connecting portion is guaranteed, and synchronous rotation of the connecting portion along with the polishing head is guaranteed.
6. According to the substrate grinding device provided by the invention, the connecting part and the adsorption part are integrally formed, so that the integral strength of the sucker is ensured.
7. According to the substrate grinding device provided by the invention, the first air passage extends to extend out of the top of the polishing head and is connected with external negative pressure equipment. The negative pressure device supplies negative pressure to the first air passage.
8. According to the substrate grinding device provided by the invention, the first air passage is provided with the air pressure sensor. In general, in the process of grinding the substrate, the air pressure signal detected by the air pressure sensor is kept unchanged or within a specified threshold range, if the air pressure signal detected by the air pressure sensor changes beyond the threshold range, the substrate is proved to be separated from the air hole at the moment, so that whether the substrate has a slip or not can be timely found, and the polishing head can be timely controlled to stop rotating.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a substrate polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a chuck separated from a substrate according to an embodiment of the invention;
FIG. 3 is a schematic view of the structure of the bottom of the suction cup in an embodiment of the invention;
fig. 4 is a schematic view of a sliding structure of a substrate and a chuck according to an embodiment of the invention.
Reference numerals illustrate:
1. a polishing head; 11. a first air path passage; 12. a second air path channel; 13. a third air path channel; 2. a suction cup; 21. a connection part; 22. an adsorption unit; 3. air holes; 31. a contact surface; 4. a substrate.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Referring to fig. 1 and 2, in one embodiment of the present invention, a substrate polishing apparatus includes a polishing head 1 and a suction cup 2. A first air passage 11 is arranged in the polishing head 1; the top of the sucking disc 2 is connected to the bottom of the polishing head 1, and the bottom of the sucking disc 2 is provided with an air hole 3 communicated with the first air path channel and a contact surface 31 positioned around the air hole.
In detail, the top of the polishing head 1 can be connected with a rotating shaft, the rotating shaft is connected to an external driving motor, and the driving motor can drive the polishing head 1 to rotate through the rotating shaft, so that the substrate 4 can be conveniently and subsequently ground. The suction cup 2 may have elasticity, for example, the suction cup 2 may be made of a material having a certain elasticity such as rubber, silica gel, plastic, etc. The air hole 3 is opened at the bottom of the suction cup 2 and may extend to communicate with the first air passage 11, thereby facilitating the first air passage 11 to provide negative pressure to the air hole 3. The substrate 4 may be a wafer.
In use, referring to fig. 1, the substrate 4 can be placed at the bottom of the chuck 2, the end surface of the bottom of the chuck 2 is in contact with the substrate 4, the first air passage 11 in the polishing head 1 provides negative pressure to the air holes 3, the air holes 3 adsorb the substrate 4 by the negative pressure, and the substrate 4 can be pressed on the contact surface 31 around the air holes 3. Then, after the polishing head 1 rotates, the suction cup 2 rotates synchronously with the polishing head 1, and the substrate 4 does not displace relative to the suction cup 2 under the suction force of the air hole 3 and the friction force of the contact surface 31. In addition, since the suction cup 2 has elasticity, when the air hole 3 sucks the substrate 4, the pressure of the substrate 4 on the contact surface 31 can slightly deform the contact surface 31, which is more beneficial to improving the friction between the substrate 4 and the contact surface 31.
Referring to fig. 2, after the polishing is completed, the supply of negative pressure to the air holes 3 may be stopped through the first air path 11, or the air pressure may be supplied to the air holes 3 through the first air path 11, so that the substrate may be easily unloaded.
Therefore, according to the substrate grinding device provided by the invention, the negative pressure of the air holes 3 directly adsorbs the substrate 4, so that the installation time of the substrate 4 on the polishing head 1 can be shortened, and the adsorption force of the air holes 3 and the friction force of the contact surface 31 can firmly fix the substrate 4 with the bottom of the sucker 2, so that a retaining ring is not required to be arranged, and the grinding cost is reduced. In addition, when the substrate 4 is unloaded, the first air passage 11 can remove the negative pressure of the air hole 3 and provide air pressure for the air hole 3, so that the substrate 4 can be rapidly unloaded, the whole time of the grinding process is shortened, and the efficiency of the grinding process is accelerated.
Referring to fig. 1 and 3, in one embodiment of the present invention, a plurality of air holes 3 are provided at the bottom of the suction cup 2. Around the plurality of air holes 3 are contact surfaces 31. The air holes 3 are all communicated with the first air passage 11, and the air holes 3 can provide negative pressure to improve the stability of the adsorption to the substrate 4.
Referring to fig. 1 and 3, in one embodiment of the present invention, a plurality of air holes 3 are uniformly distributed at a central position to an edge position of the bottom of the suction cup 2. For example, the plurality of air holes 3 are uniformly distributed along a straight line from the center to the edge of the bottom of the suction cup 2, the plurality of air holes 3 along the straight line are marked as a group of air holes, and a plurality of groups of air holes are uniformly distributed around the center at the bottom of the suction cup 2. Therefore, a plurality of air holes 3 arranged in a matrix, a plurality of air holes 3 distributed in a ring shape, or a plurality of air holes 3 formed in a symmetrical shape may be formed at the bottom of the suction cup 2, and the distribution manner of the air holes 3 is not particularly limited in this embodiment.
When the plurality of air holes 3 are uniformly distributed from the center position to the edge position of the bottom of the sucker 2, and the first air passage 11 provides negative pressure, the adsorption forces of the plurality of air holes 3 are the same, and the attraction force applied to the positions of the substrate corresponding to the air holes 3 is the same, namely, uniform adsorption force to the substrate 4 is formed. And further, the pressure and the friction force of the contact surface 31 and the base plate 4 are the same, so that the stress at each position is balanced in the process of rotating the base plate 4, and the base plate 4 is prevented from being separated from the sucker 2.
Referring to fig. 1 and 3, in one embodiment of the present invention, a second air passage 12 communicating with the first air passage 11 and a plurality of third air passages 13 communicating with the second air passage 12 are provided in the suction cup 2, the plurality of third air passages 13 respectively extend from a central position to an edge position of a bottom of the suction cup 2, and the plurality of air holes 3 are sequentially spaced and communicate with the third air passages 13. For example, six third air channel 13 are uniformly arranged around the center of the suction cup 2, a plurality of air holes 3 are arranged at intervals at the bottom of the suction cup 2 corresponding to each third air channel 13, and the air holes 3 are respectively communicated with the third air channel 13. The second air channel 12 is arranged at the center of the sucker 2, the plurality of third air channels 13 are communicated with the second air channel 12, the second air channel 12 is communicated with the first air channel 11, and then the first air channel 11 can provide negative pressure for each air hole 3 through the second air channel 12 and the third air channel 13.
The negative pressure provided by the first air passage 11 enters each third air passage 13 through the second air passage 12, and the communication between the plurality of air holes 3 and the third air passage 13 can ensure that the negative pressure of each air hole 3 is the same, thereby ensuring that the adsorption force received by each position of the substrate 4 is the same.
Referring to fig. 1, in one embodiment of the present invention, the suction cup 2 includes a connection part 21 and an adsorption part 22, the connection part 21 is located between the polishing head 1 and the adsorption part 22, the second air path channel 12 is provided in the connection part 21, the third air path channel 13 is provided in the adsorption part 22, and the plurality of air holes 3 are opened at the bottom of the adsorption part 22.
The top of the connection portion 21 may be connected to the top of the polishing head 1, for example, by bonding with glue. The first air passage 11 is communicated with the second air passage 12, and the third air passage 13 is positioned at the adsorption part 22 and communicated with the second air passage 12. Because the connecting part 21 is directly connected to the bottom of the polishing head 1, the polishing head 1 can generate a huge rotating force in the rotating process, and the connecting part 21 is only provided with the second air passage 12, the strength of the connecting part 21 is guaranteed, the stability of the connecting structure of the polishing head 1 and the connecting part 21 is further guaranteed, the connecting part 21 is prevented from falling off from the polishing head 1, and the synchronous rotation of the connecting part 21 along with the polishing head 1 is guaranteed.
In one embodiment of the present invention, the connection portion 21 and the adsorption portion 22 are integrally formed. The suction cup 2 can be produced according to designed dimensions, for example by an integral molding process or by 3D printing, and the gas channel in the suction cup 2 is constructed, so that the overall strength of the suction cup is advantageously ensured.
In one embodiment of the present invention, the first air passage 11 extends to protrude from the top of the polishing head 1 and is connected to an external negative pressure device. The negative pressure device may provide negative pressure to the first air passage 11.
Referring to fig. 4, in one embodiment of the present invention, an air pressure sensor is provided on the first air path passage 11. In general, in the process of grinding the substrate, the air pressure signal detected by the air pressure sensor is kept unchanged or within a specified threshold range, if the air pressure signal detected by the air pressure sensor changes beyond the threshold range, then the separation of the substrate 4 from the air hole 3 is proved, so that the condition that a slip occurs on the substrate 4 can be timely found, and the polishing head is timely controlled to stop rotating.
The invention provides a use method of a substrate grinding device, which is applied to the substrate grinding device, and comprises the following steps:
the substrate is placed on the bottom of the chuck and in contact with the air holes. The base plate is placed at a corresponding position at the bottom of the sucker according to the operation specification and corresponds to the air hole.
Negative pressure is provided to the air hole through the first air passage. The first air passage provides negative pressure for the air hole, and the air hole firmly adsorbs the sucking disc under the effect of negative pressure, can reduce the installation time of base plate through the absorbing mode for work efficiency.
The air hole adsorbs the substrate under the action of negative pressure, and the polishing head is controlled to start rotating. In combination with the above description of the structure of the substrate polishing apparatus, after the air hole adsorbs the substrate, the substrate contacts the contact surface, so that the substrate is difficult to relatively displace with the chuck under the action of adsorption force and friction force.
It should be noted that the substrate polishing apparatus in this embodiment is identical in structure to the substrate polishing apparatus described above, and a person skilled in the art can refer to the description above to derive a specific motion relationship between the components, which is not described in detail herein.
In one embodiment of the present invention, the control method further includes:
and controlling the polishing head to stop rotating. The polishing head can be controlled to stop rotating by controlling the driving motor to stop working.
The first air passage stops supplying negative pressure to the air hole, or the first air passage supplies air pressure to the air hole. After the polishing head stops rotating completely, the unloading work of the substrate can be started. The first air passage may stop supplying the negative pressure to the air hole, or the first air passage may supply the air pressure to the air hole. In either case, the air holes will no longer adsorb the substrate, which can also expedite the separation of the substrate from the chuck by air pressure.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (10)
1. A substrate polishing apparatus, comprising:
a polishing head (1), wherein a first air passage (11) is arranged in the polishing head (1);
the polishing device comprises a sucker (2), wherein the top of the sucker (2) is connected to the bottom of the polishing head (1), and the bottom of the sucker (2) is provided with an air hole (3) communicated with the first air path channel (11) and a contact surface (31) positioned around the air hole (3).
2. The substrate polishing apparatus according to claim 1, wherein a plurality of the air holes (3) are provided at the bottom of the suction cup (2).
3. The substrate polishing apparatus according to claim 2, wherein the plurality of air holes (3) are uniformly distributed from a center position to an edge position of the bottom of the suction cup (2).
4. A substrate polishing apparatus according to claim 3, wherein a second air passage (12) communicating with the first air passage (11) and a plurality of third air passages (13) communicating with the second air passage (12) are provided in the suction cup (2), the plurality of third air passages (13) respectively extend from a central position to an edge position of a bottom of the suction cup (2), and the plurality of air holes (3) are sequentially provided at intervals and communicate with the third air passages (13).
5. The substrate polishing apparatus according to claim 4, wherein the suction cup (2) comprises a connection portion (21) and an adsorption portion (22), the connection portion (21) is located between the polishing head (1) and the adsorption portion (22), the second air passage (12) is provided in the connection portion (21), the third air passage (13) is provided in the adsorption portion (22), and a plurality of air holes (3) are provided at the bottom of the adsorption portion (22).
6. The substrate polishing apparatus according to claim 5, wherein the connecting portion (21) and the adsorbing portion (22) are integrally formed.
7. The substrate polishing apparatus according to claim 1, wherein the first air passage (11) extends to protrude from the top of the polishing head (1) and is connected to an external negative pressure device.
8. The substrate polishing apparatus according to claim 2, wherein the first air passage (11) is provided with an air pressure sensor.
9. A method of using the substrate polishing apparatus according to any one of claims 1 to 8, the method comprising:
placing the substrate at the bottom of the sucker and contacting with the air hole;
providing negative pressure to the air hole through a first air passage;
the air hole adsorbs the substrate under the action of negative pressure and controls the polishing head to start rotating.
10. The method of use of claim 9, further comprising:
controlling the polishing head to stop rotating;
the first air passage stops providing negative pressure to the air hole, or the first air passage provides air pressure to the air hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310621088.8A CN116460732A (en) | 2023-05-29 | 2023-05-29 | Substrate polishing apparatus and control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310621088.8A CN116460732A (en) | 2023-05-29 | 2023-05-29 | Substrate polishing apparatus and control method |
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| Publication Number | Publication Date |
|---|---|
| CN116460732A true CN116460732A (en) | 2023-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310621088.8A Pending CN116460732A (en) | 2023-05-29 | 2023-05-29 | Substrate polishing apparatus and control method |
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| CN (1) | CN116460732A (en) |
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|---|---|---|---|---|
| CN1561538A (en) * | 2001-09-28 | 2005-01-05 | 信越半导体株式会社 | Grinding work holding disk, work grinding device and grinding method |
| KR100826211B1 (en) * | 2006-12-25 | 2008-04-30 | 우 옵트로닉스 코포레이션 | A polishing apparatus and a polishing method for a glass panel |
| JP2010272639A (en) * | 2009-05-20 | 2010-12-02 | Disco Abrasive Syst Ltd | Grinding device |
| CN104308728A (en) * | 2014-09-27 | 2015-01-28 | 广东工业大学 | Polishing head with vacuum suction cup |
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2023
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1561538A (en) * | 2001-09-28 | 2005-01-05 | 信越半导体株式会社 | Grinding work holding disk, work grinding device and grinding method |
| KR100826211B1 (en) * | 2006-12-25 | 2008-04-30 | 우 옵트로닉스 코포레이션 | A polishing apparatus and a polishing method for a glass panel |
| JP2010272639A (en) * | 2009-05-20 | 2010-12-02 | Disco Abrasive Syst Ltd | Grinding device |
| CN104308728A (en) * | 2014-09-27 | 2015-01-28 | 广东工业大学 | Polishing head with vacuum suction cup |
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