CN219123193U - Tooling component and tooling suite - Google Patents
Tooling component and tooling suite Download PDFInfo
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- CN219123193U CN219123193U CN202320237228.7U CN202320237228U CN219123193U CN 219123193 U CN219123193 U CN 219123193U CN 202320237228 U CN202320237228 U CN 202320237228U CN 219123193 U CN219123193 U CN 219123193U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses frock component and frock external member relates to frock relevant technical field for solve current wafer and can follow the dyestripping and remove when lifting the rete on wafer surface, thereby cause wafer dyestripping operation difficulty and inefficiency's problem. The utility model provides a frock component is used for fixed work piece that waits to handle, frock component includes load-carrying platform, and load-carrying platform has and is used for bearing wait to handle the bearing surface of work piece and perpendicular to the thickness direction of bearing surface, be equipped with on the load-carrying platform and run through the operation mouth of thickness direction, be formed with the adsorption groove on the bearing surface, the adsorption groove is used for leading-in or disconnection vacuum gas. The method and the device are used for fixing the workpiece to be processed so as to prevent the workpiece to be processed from moving when the workpiece to be processed performs other operations, and ensure that the workpiece to be processed performs other operations, namely the workpiece to be processed is fixed.
Description
Technical Field
The application relates to the technical field of tools, in particular to a tool component and a tool kit for preventing difficult and low-efficiency film tearing operation before wafer bonding.
Background
For thin chips of CSP (Chip Scale Package, chip size package), i.e., chips with a thickness of less than 150um after polishing and a large deformation (e.g., a deformation of greater than 3 mm), it is not possible to directly perform the polishing and back-gold process, and thus a temporary bonding process is added to support the chips for polishing and back-gold. The temporary bonding process is to bond the chip and the glass together through a high-viscosity double-sided adhesive tape under high pressure.
Before temporarily bonding glass on a wafer (using the wafer as a base layer, then using photolithography, doping, CMP and other technologies to manufacture components such as MOSFETs or BJTs, and then using thin film and CMP technologies to manufacture a wire, so as to manufacture a chip), a film layer on the surface of the bonded wafer needs to be lifted, and the wafer is turned over to face the surface to be bonded (i.e., the surface of the wafer exposed to the outside after lifting the film layer) towards the lower glass direction, because the viscosity of the film layer and the wafer to be bonded have no fixed platform, the wafer moves along with the film when lifting the film layer on the surface of the wafer, thereby causing difficult film tearing operation and low efficiency of the wafer.
Therefore, there is a need to design a tooling member and tooling kit to solve the above technical problems.
Disclosure of Invention
The utility model provides a frock component and frock external member can solve current wafer and can follow the dyestripping and remove when lifting the rete on wafer surface to cause wafer dyestripping operation difficulty and inefficiency's problem.
To achieve the above object, in one aspect, the present application provides a tooling member for fixing a workpiece to be processed, the tooling member includes:
the bearing platform is provided with a bearing surface for bearing the workpiece to be processed and a thickness direction perpendicular to the bearing surface, an operation port penetrating through the thickness direction is formed in the bearing platform, and an adsorption groove is formed in the bearing surface and used for introducing or cutting off vacuum gas.
In some embodiments of the present application, the tooling member further comprises:
and the positioning part is arranged on the bearing platform and protrudes out of the bearing surface along the thickness direction so as to position the workpiece to be processed on the bearing surface along the reverse direction of the operation direction, and the positioning part is positioned in the bearing surface in the horizontal projection direction.
In some embodiments of the present application, the adsorption groove includes a first groove and a second groove nested in the periphery of the first groove, and the bearing platform is provided with:
a first air intake passage, one end of which communicates with the first recess;
and one end of the second air inlet channel is communicated with the second groove, or one end of the second air inlet channel is communicated with both the first groove and the second groove.
In some embodiments of the present application, the first groove has a plurality, and the first groove and the second groove are arranged in a nested manner from the center of the bearing surface to the edge of the bearing surface at equal intervals.
In some embodiments of the present application, the positioning portion is at least two flexible positioning columns protruding from the bearing surface along the thickness direction, and in a horizontal projection direction, the flexible positioning columns are all located at the periphery of the second groove.
In some embodiments of the present application, the bearing platform is disc-shaped, the adsorption groove is circular or arc-shaped, and the adsorption groove is not communicated with the operation port.
In some embodiments of the present application, the operation opening penetrates through the thickness direction of the carrying platform and the side wall of the carrying platform.
The utility model provides a frock component includes the loading platform, the loading platform has and is used for bearing the loading surface of pending work piece and perpendicular to the thickness direction of loading surface, be equipped with on the loading platform and run through the operation mouth of thickness direction, be formed with the adsorption groove on the loading surface, the adsorption groove is used for leading-in or disconnection vacuum gas. Therefore, when the vacuum suction nozzle is specifically used, an operator can firstly place a workpiece to be treated on the bearing surface, then vacuum gas is introduced into the suction groove to suck the workpiece to be treated so as to fix the workpiece to be treated on the bearing surface, the vacuum suction nozzle stretches into the operation port to synchronously suck the workpiece to be treated, and then other operations are carried out on the workpiece to be treated, and at the moment, the workpiece to be treated is in a fixed state, so that the workpiece to be treated can be prevented from moving during the other operations. For example, in some embodiments, the workpiece to be processed is a wafer, and the wafer can be adsorbed and fixed by the carrying platform, so that an operator can not move when tearing off the film layer on the surface of the wafer, thereby simplifying the wafer film tearing operation and improving the film tearing efficiency of the wafer.
On the other hand, the frock external member that this application provided includes:
the tool component;
the bearing platform in the tool component is fixedly arranged on the chuck platform, and the bearing surface faces away from the chuck platform;
and the chuck platform is arranged on the base.
In some embodiments of the present application, the adsorption groove includes a first groove and a second groove nested in the periphery of the first groove, the bearing platform is provided with a first air inlet channel and a second air inlet channel, one end of the first air inlet channel is communicated with the first groove, one end of the second air inlet channel is communicated with the second groove or both the first groove and the second groove further includes:
the first valve group is connected with the first air inlet channel and can selectively introduce or disconnect vacuum air into the first air inlet channel;
and the second valve group is connected with the second air inlet channel and can selectively introduce or disconnect vacuum gas into the second air inlet channel.
In some embodiments of the present application, the tooling kit further comprises:
the adsorption piece stretches into the operation opening to adsorb the workpiece to be treated.
Similarly, as the tool components in the tool kit and the tool components adopt the same structure, the tool components and the tool components can solve the same technical problem and achieve the same expected effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a bearing platform in a tooling member according to an embodiment of the present application;
FIG. 2 is a cross-sectional view at A-A in FIG. 1;
FIG. 3 is a cross-sectional view at B-B in FIG. 1;
fig. 4 is a schematic structural diagram of a tooling set according to an embodiment of the present application.
The main reference numerals in the drawings of the present specification are explained as follows:
1-a bearing platform; 11-a bearing surface; 12-an operation port; 13-adsorption grooves; 131-a first groove; 132-a second groove; 14-a first air intake passage; 15-a second intake passage;
2-positioning part;
3-a chuck platform;
4-a base.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, based on the embodiments herein, which are within the scope of the protection of the present application, will be within the skill of the art without inventive effort.
In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the two components can be mechanically connected, can be directly connected or can be indirectly connected through an intermediate medium, and can be communicated with each other. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
The application provides a tool component and a tool kit, and the detailed description is given below. It should be noted that the following description order of the embodiments is not intended to limit the preferred order of the embodiments of the present application. In the following embodiments, the descriptions of the embodiments are focused on, and for the part that is not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.
Fig. 1 is a schematic structural diagram of a load-bearing platform in a tooling member according to an embodiment of the present application. Referring to fig. 1, the tool component provided by the application is used for fixing a workpiece to be processed, the tool component comprises a bearing platform 1, the bearing platform 1 is provided with a bearing surface 11 for bearing the workpiece to be processed and a thickness direction perpendicular to the bearing surface 11, an operation port 12 penetrating through the thickness direction is formed in the bearing platform 1, an adsorption groove 13 is formed in the bearing surface 11, and the adsorption groove 13 is used for introducing or cutting off vacuum gas.
The utility model provides a frock component includes load-bearing platform 1, load-bearing platform 1 has and is used for bearing bear the weight of the bearing surface 11 of pending work piece and perpendicular to bear the thickness direction of surface 11, be equipped with on the load-bearing platform 1 and run through the operation mouth 12 of thickness direction, be formed with adsorption groove 13 on the bearing surface 11, adsorption groove 13 is used for leading-in or disconnection vacuum gas. Therefore, when the workpiece to be processed is specifically used, an operator can firstly place the workpiece to be processed on the bearing surface 11, then vacuum gas is introduced into the adsorption groove 13 to adsorb the workpiece to be processed, so that the workpiece to be processed is fixed on the bearing surface 11, the adsorption piece stretches into the operation port 12 to synchronously adsorb the workpiece to be processed, then other operations are carried out on the workpiece to be processed, and at the moment, the workpiece to be processed is in a fixed state, and the workpiece to be processed can be prevented from moving during the other operations. For example, in some embodiments, the workpiece to be processed is a wafer, and the wafer can be adsorbed and fixed by the carrying platform 1, so that an operator can not move when tearing off a film layer on the surface of the wafer, and therefore, the wafer film tearing operation is simplified and the efficiency of wafer film tearing is improved.
The tool component further comprises a positioning part 2, wherein the positioning part 2 is arranged on the bearing surface of the bearing platform 1 and protrudes out of the bearing surface 11 along the thickness direction, so that the workpiece to be processed is positioned on the bearing surface 11 along the reverse direction of the operation direction, and the positioning part 2 is positioned in the bearing surface 11 in the horizontal projection direction. Therefore, when the wafer is adsorbed on the carrying surface 11, the user tears the film layer on the surface of the wafer along a certain direction, and the positioning portion 2 can further fix the wafer on the carrying surface 11 along the direction reverse direction, so as to better avoid the wafer from moving relative to the carrying surface 11 during the film tearing process.
It can be understood that the contact surface of the workpiece to be processed, which is in contact with the bearing surface 11, is contoured with the bearing surface 11, that is, the contact surface and the bearing surface 11 are consistent in shape and are attached to each other, so that the contact area of the contact surface and the bearing surface is ensured to be relatively large, which is beneficial to the placement and the adsorption of the workpiece to be processed. For example, the wafer is a circular sheet structure, the contact surface of the wafer is a plane, and the bearing surface 11 is a bearing plane.
Fig. 2 is a sectional view at A-A in fig. 1, and fig. 3 is a sectional view at B-B in fig. 1. Referring to fig. 1 to 3, the adsorption groove 13 includes a first groove 131 and a second groove 132 nested in the outer periphery of the first groove 131, and the carrying platform 1 is provided with a first air inlet channel 14 and a second air inlet channel 15. One end of the first air intake passage 14 communicates with the first recess 131. One end of the second air intake passage 15 communicates with the second recess 132, or one end of the second air intake passage 15 communicates with both the first recess 131 and the second recess 132. That is, the first groove 131 is closer to the center of the bearing surface 11 than the second groove 132.
Typically, the wafer has a size of 6 inches or 8 inches, and in order to ensure that the tool member can be adapted to wafers of different sizes, the suction groove 13 includes a first groove 131 and a second groove 132 nested in an outer periphery of the first groove 131. For example, a 6 inch wafer can cover at least a portion of the first recess 131 when placed on the load bearing surface 11. An 8 inch wafer can cover both the first recess 131 and the second recess 132 when placed on the load bearing surface 11.
Alternatively, when the wafer has a size of 10 inches, the suction groove 13 may further include a third groove nested around the second groove 132, and when an 8-inch wafer is placed on the carrying surface 11, it can cover the first groove 131, the second groove 132, and the third groove at the same time. Wherein, the bearing platform 1 is further provided with a third air inlet channel, one end of the second air inlet channel 15 is communicated with the third groove, or one end of the third air inlet channel is communicated with the first groove 131, the second groove 132 and the third groove.
With continued reference to fig. 1, the first grooves 131 have a plurality of first grooves 131 and the second grooves 132 are arranged in a nested manner at equal intervals from the center of the bearing surface 11 to the edge of the bearing surface 11. That is, the distances between the adjacent suction grooves 13 (the first grooves 131 and the second grooves 132) are equal everywhere, so that the suction force of the suction grooves 13 to the workpiece to be processed is ensured to be uniform, and the suction is stable and reliable.
The wafer is in a disc shape, the carrying platform 1 is in a disc shape, the adsorption groove 13 is in a circular ring shape or an arc shape, and the adsorption groove 13 (all the first grooves 131 and all the second grooves 132) and the operation port 12 are not communicated with each other. It will be appreciated that the arc-shaped suction groove 13 is intended to avoid the operation port 12, and is not communicated with the operation port 12, so that only one side of the suction groove 13 facing the workpiece to be processed is an open side, and the other sides are closed sides, so that when the workpiece to be processed is placed on the carrying surface 11, the workpiece to be processed can block the open side under the action of vacuum air, so as to improve the suction force of the suction groove 13.
In some embodiments of the present application, the positioning portion 2 is at least two flexible positioning posts protruding from the bearing surface 11 along the thickness direction, and in the horizontal projection direction, the flexible positioning posts are all located at the periphery of the second groove 132. Therefore, when the film layer of the wafer is torn off, the wafer and the positioning column collide and are prevented from being damaged. Meanwhile, the flexible positioning column is arranged at the periphery of the second groove 132, namely, the flexible positioning column is arranged at the periphery of the adsorption groove 13 at the outermost side in the adsorption groove 13, so that the flexible positioning column is ensured to be matched with wafers with various sizes, and the universality of the tool component is improved.
With continued reference to fig. 1, the operation opening 12 penetrates through the thickness direction of the carrying platform 1 and the side wall of the carrying platform 1, and in specific use, the adsorbing member may be extended from the lower side or the side surface of the carrying platform 1, so that there is no excessive requirement for the use situation of the carrying platform 1, and then the adsorbing member is contacted with the contact surface of the workpiece to be treated placed on the carrying surface 11 facing the carrying surface 11, so as to adsorb the contact surface. It should be noted that, after the isolating film on the surface of the wafer is torn off, the high-viscosity adhesive (or the high-viscosity adhesive layer) is exposed on the surface and the outer circle of the wafer for one circle, other foreign matters are easy to adhere, the wafer is manually contacted to cause pollution, and the wafer is difficult to turn over and transfer, so that mass production cannot be realized. The above arrangement of the present application realizes the adsorption, turnover and transportation of the workpiece (such as a wafer) to be processed through the operation port 12 and the adsorption piece, so as to avoid the operator from manually contacting the wafer.
Fig. 4 is a schematic structural diagram of a tooling kit according to an embodiment of the present application, and referring to fig. 4, the tooling kit provided herein includes the tooling member, the chuck platform 3, and the base 4. Wherein, the bearing platform 1 in the tool component is fixedly installed on the chuck platform 3, and the bearing surface 11 faces away from or faces away from the chuck platform 3, and the chuck platform 3 is installed on the base 4. Because the tool component in the tool kit and the tool component adopt the same structure, the tool component and the tool component can solve the same technical problem and achieve the same expected effect. Wherein, the bearing platform 1 in the tool component is fixed on the chuck platform 3 through a thread structure. It will be appreciated that when the fastening screw is screwed from the chuck table 3 into the carrier table 1, the threaded end of the fastening screw is flush with the carrier surface 11 of the carrier table 1 or below the carrier surface 11. When the fastening screw is screwed from the load-bearing platform 1 into the chuck platform 3, the head end of the fastening screw is flush with the load-bearing surface 11 of the load-bearing platform 1 or is submerged below the load-bearing surface 11. That is, the workpiece to be processed is placed on the carrying surface 11 without contacting the screw structure, and the workpiece to be processed is prevented from being damaged by contact with the screw structure.
In some embodiments of the present application, the adsorption groove 13 includes a first groove 131 and a second groove 132 nested in the periphery of the first groove 131, the load platform 1 is provided with a first air inlet channel 14 and a second air inlet channel 15, one end of the first air inlet channel 14 is communicated with the first groove 131, one end of the second air inlet channel 15 is communicated with the second groove 132 or is communicated with both the first groove 131 and the second groove 132, the tooling kit further includes a first valve group and a second valve group, the first valve group is connected with the first air inlet channel 14, and vacuum gas can be selectively introduced into or disconnected from the first air inlet channel 14. The second valve group is connected to the second air intake passage 15, and can selectively introduce or cut off vacuum air into the second air intake passage 15. In a specific use process, the workpiece to be processed can be placed on the bearing surface 11 first, and the first valve group or the second valve group is selectively opened according to the superposition area between the workpiece to be processed and the bearing surface 11. When the first valve group is opened, vacuum gas is introduced into the first air intake passage 14 and the first groove 131, and the workpiece to be treated is adsorbed on the adsorption groove 13. Next, the adsorbing member may be inserted into the operation opening 12 or other operations (e.g. wafer film tearing operation) may be performed on the workpiece to be processed, the two steps may be interchanged, the first valve group may be closed after the two steps are completed, at this time, the adsorbing groove 13 has no adsorbing effect on the workpiece to be processed, and the workpiece to be processed may be carried or turned by moving or turning the adsorbing member.
Similarly, when the second valve group is opened, vacuum gas is introduced into the second air inlet passage 15 and the second groove 132 or vacuum gas is introduced into the second air inlet passage 15, the second groove 132 and the first groove 131 (may be part of the first groove 131 or all of the first groove 131), and the workpiece to be processed is adsorbed on the carrying surface 11. Alternatively, the first valve group and the second valve group are opened simultaneously, and vacuum gas is introduced into the first air inlet channel 14, the second air inlet channel 15, the first groove 131 and the second groove 132, and the workpiece to be processed is adsorbed on the adsorption groove 13. The adsorbing member may be inserted into the operation port 12 or other operations (e.g. wafer film tearing operation) may be performed on the workpiece to be processed, the two steps may be interchanged, and after the two steps are completed, the second valve group may be closed or the first valve group and the second valve group may be closed at the same time, at this time, the adsorbing groove 13 has no adsorbing effect on the workpiece to be processed, and the workpiece to be processed may be carried or turned by moving or turning the adsorbing member.
It will be appreciated that the first and second valve groups are connected to an external vacuum source for supplying vacuum gas into the adsorption groove 13 through connecting pipes, respectively, and are used for connecting or disconnecting the gas passages (the first and second gas inlet passages 14, 15).
In some embodiments of the present application, the tool kit further includes an adsorbing member that extends into the operation port 12 to adsorb the workpiece to be processed. For example, the suction members are a first suction member and a second suction member which are disposed in pairs in the thickness direction of the carrying platform 1 and are respectively located on the contact surface or the surface to be handled (for example, the surface from which the film layer is to be torn off) of the workpiece to be handled. Or the suction piece is a contact surface of the workpiece to be treated, and the suction piece is a vacuum suction nozzle, a vacuum sucker or a magnetic suction piece.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims. Furthermore, the foregoing description of the principles and embodiments of the present application has been provided for the purpose of illustrating the principles and embodiments of the present application and for the purpose of providing a simplified understanding of the principles and embodiments of the present application, and is not intended to limit the scope of the present application.
Claims (10)
1. A tooling member for securing a workpiece to be treated, the tooling member comprising:
the bearing platform is provided with a bearing surface for bearing the workpiece to be processed and a thickness direction perpendicular to the bearing surface, an operation port penetrating through the thickness direction is formed in the bearing platform, and an adsorption groove is formed in the bearing surface and used for introducing or cutting off vacuum gas.
2. The tooling member of claim 1, further comprising:
and the positioning part is arranged on the bearing platform and protrudes out of the bearing surface along the thickness direction so as to position the workpiece to be processed on the bearing surface along the reverse direction of the operation direction, and the positioning part is positioned in the bearing surface in the horizontal projection direction.
3. The tooling member of claim 2, wherein the suction groove comprises a first groove and a second groove nested in the periphery of the first groove, and the bearing platform is provided with:
a first air intake passage, one end of which communicates with the first recess;
and one end of the second air inlet channel is communicated with the second groove, or one end of the second air inlet channel is communicated with both the first groove and the second groove.
4. A tooling member according to claim 3, wherein the first recess has a plurality of recesses, the first recess and the second recess being nested at equal intervals from the centre of the bearing surface to the edge of the bearing surface.
5. A tooling member according to claim 3, wherein the locating portion is at least two flexible locating posts protruding from the bearing surface in the thickness direction, the flexible locating posts being located at the periphery of the second recess in the horizontal projection direction.
6. The tooling member according to any one of claims 1 to 5, wherein the carrying platform is disc-shaped, the suction groove is annular or circular arc-shaped, and the suction groove and the operation port are not in communication with each other.
7. The tooling member of claim 1, wherein the operating port extends through the thickness direction of the load carrying platform and a sidewall of the load carrying platform.
8. A tooling set, comprising:
a tooling member according to any one of claims 1 to 7;
the bearing platform in the tool component is fixedly arranged on the chuck platform, and the bearing surface faces away from the chuck platform;
and the chuck platform is arranged on the base.
9. The tooling set of claim 8, wherein the adsorption groove comprises a first groove and a second groove nested in the periphery of the first groove, the bearing platform is provided with a first air inlet channel and a second air inlet channel, one end of the first air inlet channel is communicated with the first groove, and one end of the second air inlet channel is communicated with the second groove or both the first groove and the second groove, and the tooling set further comprises:
the first valve group is connected with the first air inlet channel and can selectively introduce or disconnect vacuum air into the first air inlet channel;
and the second valve group is connected with the second air inlet channel and can selectively introduce or disconnect vacuum gas into the second air inlet channel.
10. The tooling kit of claim 8, further comprising:
the adsorption piece stretches into the operation opening to adsorb the workpiece to be treated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320237228.7U CN219123193U (en) | 2023-02-16 | 2023-02-16 | Tooling component and tooling suite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320237228.7U CN219123193U (en) | 2023-02-16 | 2023-02-16 | Tooling component and tooling suite |
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| Publication Number | Publication Date |
|---|---|
| CN219123193U true CN219123193U (en) | 2023-06-02 |
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| CN202320237228.7U Active CN219123193U (en) | 2023-02-16 | 2023-02-16 | Tooling component and tooling suite |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117373966A (en) * | 2023-12-08 | 2024-01-09 | 快克智能装备股份有限公司 | Chip frock dyestripping device and chip packaging system |
-
2023
- 2023-02-16 CN CN202320237228.7U patent/CN219123193U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117373966A (en) * | 2023-12-08 | 2024-01-09 | 快克智能装备股份有限公司 | Chip frock dyestripping device and chip packaging system |
| CN117373966B (en) * | 2023-12-08 | 2024-02-06 | 快克智能装备股份有限公司 | Chip frock dyestripping device and chip packaging system |
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