CN219123204U - Substrate laminating tool - Google Patents
Substrate laminating tool Download PDFInfo
- Publication number
- CN219123204U CN219123204U CN202222567509.7U CN202222567509U CN219123204U CN 219123204 U CN219123204 U CN 219123204U CN 202222567509 U CN202222567509 U CN 202222567509U CN 219123204 U CN219123204 U CN 219123204U
- Authority
- CN
- China
- Prior art keywords
- vacuum
- boss
- carrying platform
- substrate
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of chip packaging, in particular to a substrate attaching jig. The utility model provides a base plate laminating tool, includes the microscope carrier, its characterized in that: the upper end of the front side of the carrying platform is provided with an upward protruding boss, four corners of the boss are provided with grooves, vacuum chucks are arranged in the grooves, the lower end of each groove is provided with a vacuum hole, the rear side of the carrying platform is provided with a step, and a circle of vacuum grooves are formed in the steps. Compared with the prior art, the substrate is adsorbed on the boss through 4 vacuum chucks, the offset is not easy to occur, and the height difference is formed between the substrate and the surface of the carrying platform, so that the wafer bonding film is prevented from being bonded on the carrying platform.
Description
Technical Field
The utility model relates to the technical field of chip packaging, in particular to a substrate attaching jig.
Background
At present, when a chip packaging substrate is fixed, a vacuum hole is formed in a carrier, the vacuum hole is connected with vacuum equipment through a pipeline, the substrate is adsorbed on the carrier, and finally, a wafer bonding film is attached to the substrate, so that the attachment of the substrate is completed. But this approach has the following drawbacks: 1. the surface of the substrate is uneven, the substrate is directly absorbed by vacuum adsorption, and the absorption position of the substrate is easy to deviate. 2. After the wafer bonding film is bonded to the substrate, the wafer bonding film is easily bonded to the surface of the stage.
Disclosure of Invention
The utility model provides a substrate attaching jig for overcoming the defects in the prior art.
In order to achieve the above purpose, a substrate laminating jig is designed, including the microscope carrier, its characterized in that: the upper end of the front side of the carrying platform is provided with an upward protruding boss, four corners of the boss are provided with grooves, vacuum chucks are arranged in the grooves, the lower end of each groove is provided with a vacuum hole, the rear side of the carrying platform is provided with a step, and a circle of vacuum grooves are formed in the steps.
The outside of the carrying platform is provided with a circle of edge sealing.
The step is provided with a positioning hole.
The carrying platform is provided with a plurality of screw fixing holes.
The height of the boss is 4mm.
The shape of the carrying platform is a circular plate-shaped structure.
The boss is rectangular in shape.
Compared with the prior art, the utility model has the advantages that the substrate is adsorbed on the boss through the 4 vacuum chucks, the offset is not easy to occur, the height difference is formed between the substrate and the surface of the carrier, and the wafer bonding film is prevented from being bonded on the carrier.
Drawings
Fig. 1 is a front view of the present utility model.
Fig. 2 is a rear view of the present utility model.
Referring to fig. 1 to 2, wherein 1 is a carrier, 2 is a boss, 3 is a vacuum chuck, 4 is a vacuum hole, 5 is an edge seal, 6 is a step, 7 is a vacuum groove, 8 is a positioning hole, and 9 is a screw fixing hole.
Detailed Description
The utility model is further described below with reference to the accompanying drawings.
As shown in fig. 1 to 2, the upper end of the front side of the carrying platform 1 is provided with an upward protruding boss 2, four corners of the boss 2 are provided with grooves, vacuum chucks 3 are arranged in the grooves, the lower end of each groove is provided with a vacuum hole 4, the rear side of the carrying platform 1 is provided with a step 6, and the step 6 is provided with a circle of vacuum grooves 7.
The outer side of the carrying platform 1 is provided with a circle of edge sealing 5. When the base plate is particularly used, after the base plate is placed on the boss 2, the sealing edge 5 is positioned on the outer side of the base plate, and the sealing edge 5 plays a role in limiting the position of the base plate.
The step 6 is provided with a positioning hole 8, and when the device is specifically used, the carrier 1 can be fixed at a required position through the positioning hole 8.
The carrying platform 1 is provided with a plurality of screw fixing holes 9. When the device is specifically used, the carrier 1 is fixed through the cooperation of the screw fixing holes 9 and the screws 9.
The height of the boss 2 is 4mm. After the wafer bonding film is stuck, the wafer bonding film is leveled, the deformation of the whole sticking cloth is less than 2mm, and the wafer bonding film can be effectively isolated, so that the wafer bonding film cannot be stuck on the carrying platform 1.
The carrier 1 has a circular plate-like structure.
The boss 2 has a rectangular structure.
When the jig is used, a substrate is placed on the boss 2, and the substrate is adsorbed on the boss 2 under the action of the vacuum chuck 3. Then, the wafer bonding film is bonded to the surface of the substrate 1, and the bonding of the substrate 1 is completed.
When the vacuum sucker is particularly used, a vacuum pipeline is inserted into the vacuum hole 4, and the vacuum pipeline connects the vacuum sucker with vacuum equipment, so that the vacuumizing function is completed. The vacuum line may be placed in a vacuum tank 7.
When the device is specifically used, the size of the boss 2 is determined according to the size of the substrate, so that the substrate can be completely attached to the boss 2.
Claims (7)
1. The utility model provides a base plate laminating tool, includes the microscope carrier, its characterized in that: the novel vacuum table is characterized in that an upward protruding boss (2) is arranged at the upper end of the front side of the carrying table (1), grooves are formed in four corners of the boss (2), vacuum chucks (3) are arranged in the grooves, vacuum holes (4) are formed in the lower ends of the grooves, steps (6) are arranged on the rear side of the carrying table (1), and a circle of vacuum grooves (7) are formed in the steps (6).
2. The substrate bonding jig according to claim 1, wherein: the outside of the carrying platform (1) is provided with a circle of edge sealing (5).
3. The substrate bonding jig according to claim 1, wherein: the step (6) is provided with a positioning hole (8).
4. The substrate bonding jig according to claim 1, wherein: the carrying platform (1) is provided with a plurality of screw fixing holes (9).
5. The substrate bonding jig according to claim 1, wherein: the height of the boss (2) is 4mm.
6. The substrate bonding jig according to claim 1 or 4, wherein: the shape of the carrying platform (1) is a circular plate-shaped structure.
7. The substrate bonding jig according to claim 1 or 5, wherein: the boss (2) is rectangular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222567509.7U CN219123204U (en) | 2022-09-27 | 2022-09-27 | Substrate laminating tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222567509.7U CN219123204U (en) | 2022-09-27 | 2022-09-27 | Substrate laminating tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219123204U true CN219123204U (en) | 2023-06-02 |
Family
ID=86535658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222567509.7U Active CN219123204U (en) | 2022-09-27 | 2022-09-27 | Substrate laminating tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219123204U (en) |
-
2022
- 2022-09-27 CN CN202222567509.7U patent/CN219123204U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9039867B2 (en) | Method for detaching a semiconductor chip from a foil | |
| KR101970884B1 (en) | Apparatus for manufacturing semiconductor and method of manufacturing semiconductor device | |
| KR20050053008A (en) | Attaching apparatus and method | |
| TW202114868A (en) | Attaching apparatus, intermediary mechansim thereof, and attaching method | |
| CN219123204U (en) | Substrate laminating tool | |
| KR100718017B1 (en) | Vacuum Chuck | |
| CN106654065A (en) | Stripping device used for substrate of flexible screen and manufacturing method of flexible screen | |
| JP4863350B2 (en) | Adhesive sheet and holding jig | |
| CN212060865U (en) | Substrate positioning device and nano-imprinting machine | |
| CN219123193U (en) | Tooling component and tooling suite | |
| CN218388138U (en) | Repair device | |
| CN218274552U (en) | Mesa of wafer laser dissociation bonding | |
| JPH02130103A (en) | Dicing jig | |
| CN216980531U (en) | Wafer sucking disc device adaptable to wafers of different types and various outer diameter sizes | |
| CN210402007U (en) | Sucker jig of gluing and developing machine | |
| CN210835582U (en) | Anti-overflow glue is even device | |
| JP4899357B2 (en) | Substrate adsorption device | |
| KR20120087462A (en) | Substrate bonding apparatus and substrate bonding method | |
| CN217317563U (en) | Vacuum pumping disc for semiconductor wafer scribing machine | |
| CN207542225U (en) | A kind of jacking system for bonder | |
| CN220752453U (en) | Clamp for reducing solid OCA bubbles | |
| CN214444846U (en) | Chip vacuum unloading tool | |
| CN212725250U (en) | Chip mounting auxiliary device | |
| KR20130054307A (en) | Substrate bonding apparatus and substrate bonding method | |
| CN217655890U (en) | Film centering device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |