CN212060865U - Substrate positioning device and nano-imprinting machine - Google Patents

Substrate positioning device and nano-imprinting machine Download PDF

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Publication number
CN212060865U
CN212060865U CN202021310377.4U CN202021310377U CN212060865U CN 212060865 U CN212060865 U CN 212060865U CN 202021310377 U CN202021310377 U CN 202021310377U CN 212060865 U CN212060865 U CN 212060865U
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vacuum
substrate
positioning
vacuum chuck
positioning device
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CN202021310377.4U
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Chinese (zh)
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冀然
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Germanlitho Co ltd
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Germanlitho Co ltd
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Abstract

The utility model provides a substrate positioning device, include, vacuum chuck, on vacuum chuck, set up a plurality of annular vacuum grooves to its center from the vacuum chuck outward flange, be provided with the vacuum hole in the vacuum groove, on vacuum chuck upper surface, set up the orientation angle that connects into through two straight lines between vacuum groove and the vacuum groove, the orientation angle is the right angle and is provided with four, the line between four orientation angles is square frame to encircle the vacuum groove of inboard in it, the substrate is placed on vacuum chuck upper surface, and cover arbitrary one or more vacuum grooves, the substrate is corresponding with square frame; and the vacuum device is communicated with the vacuum hole. A nano-imprinting machine comprises a substrate positioning device. The utility model discloses can prevent effectively that the substrate from because of can not cover the gas leakage, the flying piece phenomenon that the vacuum tank produced completely, also can prevent that the colloid that overflows from getting into the substrate and the vacuum chuck bonding phenomenon that vacuum chuck leads to and vacuum hole and tracheal blocking phenomenon to extension equipment life.

Description

Substrate positioning device and nano-imprinting machine
Technical Field
The utility model belongs to the technical field of the nanoimprint lithography, especially, relate to a substrate positioner and nanoimprint lithography machine.
Background
Nano Imprint Lithography (NIL), as a brand new micro-nano fabrication technology, has the characteristics of high resolution, ultra-low cost and high productivity compared with the existing projection Lithography and next-generation Lithography technology. At present, with the rapid development of the semiconductor material industry, the substrate used in the nanoimprint industry is not only a circular substrate but also a square substrate.
When nano-imprinting is carried out, the substrate is positioned at the center of the vacuum chuck to be aligned with the mold, so that the imprinted nano-structure is positioned at the center of the substrate. However, the existing vacuum chuck 1 can only position the circular substrate 2, referring to fig. 1, the existing vacuum chuck is incompatible with the square substrate 2, so that when the square substrate 2 is positioned, air leakage occurs, the vacuum adsorption force is reduced, normal demoulding cannot be performed in the separation process, once the glue overflow phenomenon occurs, the imprint glue easily enters the uncovered vacuum groove 11, so that the substrate is adhered to the vacuum chuck 1, or a vacuum hole and a vacuum air pipe are blocked, and the service life of equipment is shortened. The problem to be solved is how to provide a device and an apparatus capable of compatibly positioning a circular substrate and a square substrate.
Disclosure of Invention
The utility model discloses to foretell technical problem, provide a substrate positioner and nano-imprint press, can prevent effectively that the substrate from because of can not covering the gas leakage that the vacuum tank produced completely, the flyer phenomenon that the vacuum decline leads to accurate location substrate center makes substrate center and vacuum chuck center corresponding, also can prevent that the colloid that overflows from getting into the substrate and the vacuum chuck bonding phenomenon that vacuum chuck leads to, and vacuum hole and tracheal blocking phenomenon, with extension equipment life.
In order to achieve the above object, the utility model discloses a technical scheme be: a substrate positioning device comprises a substrate positioning device,
the vacuum chuck is provided with a plurality of annular vacuum grooves from the outer edge to the center of the vacuum chuck, vacuum holes are formed in the vacuum grooves, positioning angles formed by connecting two straight lines are arranged between the vacuum grooves and the vacuum grooves on the upper surface of the vacuum chuck, the positioning angles are right angles and four positioning angles are arranged, connecting lines among the four positioning angles are square frames so as to surround the vacuum grooves on the inner side, a substrate is placed on the upper surface of the vacuum chuck and covers any one or more vacuum grooves, and the substrate corresponds to the square frames;
and the vacuum device is communicated with the vacuum hole so as to generate negative pressure in the vacuum groove to fix the substrate.
In some embodiments of the present invention, when the substrate is square, the size of the square frame is the same as the size of the substrate, and the four corners of the substrate correspond to the four positioning angles.
In some embodiments of the present invention, when the substrate is circular or partially circular, the positioning device is placed on the upper surface of the vacuum chuck to accurately position the substrate.
In some embodiments of the present invention, the lower surface of the positioning device abuts against the upper surface of the vacuum chuck, and the positioning device is provided with a groove adapted to the arc-shaped edge of the substrate.
In some embodiments of the invention, the center of the positioning device corresponds to the center of the vacuum chuck.
In some embodiments of the present invention, the positioning device is a positioning plate, and a thickness of the positioning plate is greater than a thickness of the substrate.
In some embodiments of the invention, the upper surface of the positioning device is provided with a handle.
Another object of the present invention is to provide a nanoimprint lithography machine, including any one of the above substrate positioning devices.
Compared with the prior art, the utility model discloses an advantage lies in with positive effect: the device can be compatible with the center positioning and the adsorption fixing of round and square substrates, can effectively prevent the phenomenon of chip flying caused by air leakage and vacuum degree reduction due to the fact that the substrates cannot completely cover a vacuum groove, can accurately position the centers of the substrates, enables the centers of the substrates to correspond to the center of a vacuum chuck, can also prevent the phenomenon of bonding of the substrates and the vacuum chuck caused by the fact that overflowed colloid enters the vacuum chuck and the phenomenon of blockage of a vacuum hole and an air pipe, can prolong the service life of the device, and can be further applied to the positioning and the fixing of the substrates in a nano-imprinting machine.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a conventional substrate positioning apparatus;
fig. 2 is a top view of the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic structural view of the substrate of the present invention in a circular shape;
FIG. 5 is a schematic structural view of the substrate of the present invention in a square shape;
FIG. 6 is a schematic view of the structure of the substrate of the present invention when the substrate is circular;
FIG. 7 is a schematic view of the positioning device for positioning when the substrate is circular according to the present invention;
FIG. 8 is a side view of the structure of FIG. 7;
fig. 9 is a structural schematic of the positioning device.
In the above figures: 1. a vacuum chuck; 11. a vacuum tank; 12. a vacuum hole; 13. positioning an angle; 131. a straight line; 132. a straight line; 14. a square frame; 15. positioning a groove; 2. a substrate; 3. a positioning device; 31. a groove; 32. a handle.
Detailed Description
The present invention is specifically described below by way of exemplary embodiments. It should be understood, however, that elements, structures and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Embodiment 1, a substrate 2 positioning apparatus, referring to fig. 2 to 5, comprises,
a vacuum chuck 1 is provided with a plurality of annular vacuum grooves 11 from the outer edge of the vacuum chuck 1 to the center of the vacuum chuck 1 on the vacuum chuck 1, the vacuum grooves 11 are identical in shape and concentric in circle center, a vacuum hole 12 is arranged in each vacuum groove 11, positioning angles 13 connected through two straight lines 131 and 132 are arranged between the vacuum grooves 11 and the vacuum grooves 11 on the upper surface of the vacuum chuck 1, the depths of the straight lines 131 and 132 are less than the depth of the vacuum grooves 11, the positioning angles 13 are right-angled and four, the connecting lines between the four positioning angles 13 are square frames 14 to surround the vacuum grooves 11 on the inner side in the square frames 14, wherein the outer edge of the vacuum groove 11 can be tangent to each side of the square frames 14, the positioning angles 13 and the sizes of the vacuum grooves 11 are arranged according to the conventional size of a substrate 2, the substrate 2 is placed on the upper surface of the vacuum chuck 1, and the substrate 2 can be circular, the substrate 2 can also be square, any one or more vacuum grooves 11 are covered by the substrate 2, the substrate 2 corresponds to a square frame 14, when the substrate 2 is round, the corresponding vacuum groove 11 is selected, the outer edge of the substrate 2 is tangent to each edge of the square frame 14, so that the round substrate 2 is positioned, when the substrate 2 is square, the corresponding positioning angle 13 is selected, so that the size of the square frame 14 is the same as that of the substrate 2, and the four corners of the substrate 2 correspond to the four positioning angles 13, so that the accurate positioning of the substrate 2 is ensured;
a vacuum device, which is a vacuum pump, not shown, communicates with the vacuum hole 12 through a gas pipe to generate a negative pressure in the vacuum groove 11 to fix the substrate 2.
This 2 positioner of substrate can be compatible circular and square 2 central point of substrate simultaneously and adsorb fixedly, can prevent effectively that substrate 2 from because of can not covering the gas leakage that vacuum tank 11 produced completely, the flyer phenomenon that the vacuum degree descends and leads to, with accurate 2 centers of location substrate, make 2 centers of substrate and vacuum chuck 1 center corresponding, also can prevent that the colloid that overflows from getting into the substrate 2 and the vacuum chuck 1 adhesion phenomenon that vacuum chuck 1 leads to, and the jam phenomenon of vacuum hole 12 and trachea, in order to prolong equipment life.
Embodiment 2, referring to fig. 7 to 9, when the substrate 2 has a circular shape and the circular substrate 2 has a different size from the vacuum chamber, in order to further precisely position the circular substrate 2, a positioning device 3 is disposed on the upper surface of the vacuum chuck 1, and the center of the positioning device 3 corresponds to the center of the vacuum chuck 1, so as to precisely position the substrate 2.
Further, the lower surface of the positioning device 3 is abutted against the upper surface of the vacuum chuck 1, and a groove 31 matched with the arc-shaped edge of the substrate 2 is formed in the positioning device 3.
Further, the positioning device 3 is a positioning plate, and the thickness of the positioning plate is larger than that of the substrate 2.
In order to facilitate the taking and placing of the positioning device 3, a handle 32 is provided on the upper surface of the positioning device 3.
Embodiment 3, referring to fig. 2 and 6, for a circular substrate 2 with a notch, positioning grooves 15 identical to the substrate 2 may be disposed between the vacuum grooves 11, the depth of the positioning grooves 15 is shallower than that of the vacuum grooves 11, the number of the positioning grooves 15 may be multiple according to actual needs, and during positioning, the substrate 2 corresponds to the positioning grooves 15, or the positioning device 3 may be used for positioning or manual positioning.
In addition, the embodiment 4 of the present invention also provides a nanoimprint machine having the substrate 2 positioning apparatus of the above embodiment.
Because according to the utility model discloses 2 positioner of substrate according to above-mentioned embodiment have above-mentioned technological effect, therefore, the utility model discloses the nanoimprint lithography machine also has above-mentioned technological effect, promptly according to the utility model discloses a nanoimprint lithography machine, through 2 positioner of substrate that set up above-mentioned embodiment, orientation angle 13 and positioner are to the location of substrate 2, can prevent effectively that the nanoimprint lithography in-process, substrate 2 is because of can not cover the gas leakage that vacuum tank 11 produced completely, the flyer phenomenon that the vacuum decline leads to, with accurate location substrate 2 center, make 2 centers of substrate and vacuum chuck 1 center corresponding, also can prevent that the colloid that spills over from getting into substrate 2 and the 1 adhesion phenomenon of vacuum chuck that vacuum chuck 1 leads to, and vacuum hole 12 and tracheal choking phenomenon, in order to prolong the life of nanoimprint lithography machine.
Other configurations and operations of the nano-imprinting machine according to embodiments of the present invention are known to those skilled in the art and will not be described in detail herein.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (8)

1. A substrate positioning apparatus, characterized by: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the vacuum chuck is provided with a plurality of annular vacuum grooves from the outer edge to the center of the vacuum chuck, vacuum holes are formed in the vacuum grooves, positioning angles formed by connecting two straight lines are arranged between the vacuum grooves and the vacuum grooves on the upper surface of the vacuum chuck, the positioning angles are right angles and four positioning angles are arranged, connecting lines among the four positioning angles are square frames so as to surround the vacuum grooves on the inner side, a substrate is placed on the upper surface of the vacuum chuck and covers any one or more vacuum grooves, and the substrate corresponds to the square frames;
and the vacuum device is communicated with the vacuum hole so as to generate negative pressure in the vacuum groove to fix the substrate.
2. The substrate positioning apparatus of claim 1, wherein: when the substrate is square, the size of the square frame is the same as that of the substrate, and four corners of the substrate correspond to four positioning angles.
3. The substrate positioning apparatus of claim 1, wherein: when the substrate is circular or partially circular, a positioning device is placed on the upper surface of the vacuum chuck to accurately position the substrate.
4. The substrate positioning apparatus according to claim 3, wherein: the lower surface of the positioning device is abutted to the upper surface of the vacuum chuck, and a groove matched with the arc-shaped edge of the substrate is formed in the positioning device.
5. The substrate positioning apparatus according to claim 3, wherein: the center of the positioning device corresponds to the center of the vacuum chuck.
6. The substrate positioning apparatus according to claim 3, wherein: the positioning device is a positioning plate, and the thickness of the positioning plate is greater than that of the substrate.
7. The substrate positioning apparatus according to claim 3, wherein: the upper surface of the positioning device is provided with a handle.
8. A nanoimprint machine characterized by: comprising a substrate positioning device according to any of claims 1-7.
CN202021310377.4U 2020-07-07 2020-07-07 Substrate positioning device and nano-imprinting machine Active CN212060865U (en)

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Application Number Priority Date Filing Date Title
CN202021310377.4U CN212060865U (en) 2020-07-07 2020-07-07 Substrate positioning device and nano-imprinting machine

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113075859A (en) * 2021-04-01 2021-07-06 青岛天仁微纳科技有限责任公司 Negative pressure type nano-imprinting equipment and imprinting method thereof
CN114624957A (en) * 2022-03-24 2022-06-14 青岛天仁微纳科技有限责任公司 Nano-imprinting auxiliary device suitable for templates with various shapes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113075859A (en) * 2021-04-01 2021-07-06 青岛天仁微纳科技有限责任公司 Negative pressure type nano-imprinting equipment and imprinting method thereof
CN113075859B (en) * 2021-04-01 2024-01-26 青岛天仁微纳科技有限责任公司 Negative pressure type nano imprinting equipment and imprinting method thereof
CN114624957A (en) * 2022-03-24 2022-06-14 青岛天仁微纳科技有限责任公司 Nano-imprinting auxiliary device suitable for templates with various shapes
CN114624957B (en) * 2022-03-24 2023-08-18 青岛天仁微纳科技有限责任公司 Nanometer impression auxiliary device suitable for multiple shape templates

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