CN119342793A - Universal material tray, patch equipment, control method and device - Google Patents
Universal material tray, patch equipment, control method and device Download PDFInfo
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- CN119342793A CN119342793A CN202411847517.4A CN202411847517A CN119342793A CN 119342793 A CN119342793 A CN 119342793A CN 202411847517 A CN202411847517 A CN 202411847517A CN 119342793 A CN119342793 A CN 119342793A
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- tray
- mounting
- wafer
- target
- universal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a universal material tray, surface mounting equipment, a control method and a device. The universal Tray comprises a Tray body and a fixing mechanism, wherein the Tray body is provided with a fixing groove which can be simultaneously matched with a Tray or a wafer Tray, the fixing mechanism is used for fixing the Tray or the wafer Tray on the fixing groove, and the shape of the Tray body can be simultaneously matched with a feed box and a mounting compression ring piece assembly of the same piece of surface mounting equipment so that the Tray body can be accommodated on the feed box or the mounting compression ring piece assembly. The universal material tray is compatible with the material supply box and the mounting compression ring sheet assembly on the mounting station, solves the compatibility problem caused by different material tray types corresponding to different materials to be mounted, and lays a hardware foundation for automatic grabbing, automatic resetting and automatic replacement of the non-manually-participated and fully-automatic mounting materials.
Description
Technical Field
The invention relates to a universal material tray, chip mounter, control method and device, and belongs to the technical field of chip mounter.
Background
When various components are mounted, the chip mounter usually fixes the same type of components in the same material tray, and in a mounting procedure, the chip mounter sucks the same material from one material tray and sequentially mounts the same material on a plurality of PCB boards, and when next material is mounted, the material tray is replaced, and the same material is sucked from the material tray again and sequentially mounts the same material on the plurality of PCB boards until the mounting of all components is completed.
Because only one Tray can be placed at a time in the mounting position of the Tray, the Tray is usually replaced manually when the material is replaced, and the type of the thimble head of the film expansion mechanism corresponding to the Tray is adjusted (film expansion is not needed if the Tray is a Tray), so that full-automatic production is not realized when the Tray is replaced, and the procedures involving manual work inevitably lead to cost rise and insufficient optimization of production efficiency.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a non-manual-participation full-automatic universal material tray, a patch device, a control method and a device.
According to the first scheme, the universal tray comprises a tray body and a fixing mechanism;
The Tray body is provided with a fixing groove which can be simultaneously matched with the Tray or the wafer Tray, and the fixing mechanism is used for fixing the Tray or the wafer Tray on the fixing groove;
The appearance of carrying disc body can adapt to the feed box and the pressure ring piece assembly of same piece of paster equipment simultaneously so that carrying disc body can be held on feed box or the pressure ring piece assembly of dress.
Further, the shape of the tray body is adapted to the multi-layer slot of the feed box so that the tray body can be inserted into or withdrawn from the feed box;
The appearance of carrying disc body and the mounting groove looks adaptation of the lower clamping ring piece of dress clamping ring piece subassembly so that carrying disc body can fall into or take out in lower clamping ring piece.
Further, the fixing mechanism comprises at least 2 groups of rotary pressing assemblies, each rotary pressing assembly comprises a driving motor and a rotary pressing sheet, and the driving motor controls the rotary pressing sheet to press the edges of the Tray disc or the wafer disc into the fixing groove of the carrier disc body.
Further, the mounting clamping ring piece comprises a lower clamping ring piece and at least 2 upper clamping ring pieces, the upper clamping ring pieces are lifted or lowered through the clamping ring control piece, the carrying disc body can be taken out of the lower clamping ring piece in a lifting state, and the carrying disc body is fixed in a mounting groove of the lower clamping ring piece by the clamping ring control piece in a lowering state.
Further, the tray body is provided with a recognizer, the recognizer is used for recognizing the type of the tray and the material information fixed in the fixed groove, the recognizer is at least provided with a recognized surface at the upper part and a recognized surface at the side, the recognized surface at the upper part of the recognizer can be recognized by an optical recognition system of the mounting equipment and can acquire the current tray type stored in the recognizer, and the recognized surface at the side of the recognizer can be recognized by the optical recognition system of the mounting equipment and can acquire the material information of the current tray stored in the recognizer.
Further, the identifier is provided with an insert structure matched with the carrier disc body, and the identifier is detachably inserted into the identification groove of the carrier disc body through the insert structure.
Further, at least 2 side identification components which can be identified by an optical identification system of the mounting equipment are arranged on the side identified surface of the identifier, and the tray type are identified by identifying the side identification components.
Further, at least 3 upper identification components which can be identified by an optical identification system of the mounting equipment are arranged on the upper identification surface of the identifier, and the type information, the quantity information and the initial azimuth information of the materials in the tray are identified by identifying the upper identification components.
According to an embodiment of the present invention, with the universal tray in the first aspect provided by the present invention, a second aspect is provided as follows:
A patch device comprising a universal tray as any one of the above.
According to an embodiment of the present invention, with the universal tray in the first aspect provided by the present invention, a third aspect is provided as follows:
A control method of a universal tray comprises the following steps:
acquiring information of a material to be pasted;
Identifying a matched material tray body from the material box according to the material information to be mounted, moving the material tray body into a mounting groove of a lower compression ring piece of a mounting station, and controlling an upper compression ring piece to fix the material tray body;
identifying the type and the material information of the material tray body and calling a mounting program, wherein the mounting program is used for controlling a mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
Confirming whether a film expanding mechanism is called according to the material tray type and the material information of the material tray body, if the film expanding mechanism is called, calling a thimble head according to the material tray type, wherein the called thimble head is matched with a wafer tray of a UV film or a blue film corresponding to the material tray type, and controlling the thimble head to move and jack up the position of the wafer tray to be absorbed;
and executing the mounting procedure and finishing the material mounting.
Further, if the film expanding mechanism is not called, the mounting program is directly executed and the material mounting is completed.
Further, the step of controlling the moving of the ejector pin head and jacking up the position to be sucked of the wafer disk comprises the following steps of:
Acquiring a target ejector pin head according to the film type and the wafer size of the wafer tray corresponding to the type of the material tray, wherein the target ejector pin head and the non-target ejector pin head are respectively arranged in different ejector pin grooves of an ejector pin mounting seat;
And moving the thimble installation seat to enable the target thimble head to be located at a first target position, lifting the target thimble head to a second target position, wherein the target thimble head located at the second target position is higher than the non-target thimble head, and lifting the thimble installation seat to enable the target thimble head to move and jack up the position to be absorbed of the wafer disk.
According to an embodiment of the present invention, by using the control method for a universal tray in the third aspect provided by the present invention, a fourth aspect is provided as follows:
a control device for a universal tray, comprising:
The mounting target module is used for acquiring information of materials to be mounted;
The tray picking module is used for identifying a matched tray body from the inside of the material box according to the information of the material to be mounted and moving the tray body into the mounting groove of the lower compression ring piece of the mounting station, and controlling the upper compression ring piece to fix the tray body;
the program calling module is used for identifying the type and the material information of the material tray body and calling a mounting program, and the mounting program is used for controlling the mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
The thimble calling module is used for confirming whether the film expanding mechanism is called according to the material tray type and the material information of the material tray body, if the film expanding mechanism is called, the thimble head is called according to the material tray type, the called thimble head is matched with the wafer tray of the UV film or the blue film corresponding to the material tray type, and the thimble head is controlled to move and jack up the position to be absorbed of the wafer tray;
and the mounting execution module is used for executing a mounting program and completing material mounting.
A computer device comprising a memory and a processor, the memory storing a computer program which, when executed by the processor, causes the processor to perform the steps of:
acquiring information of a material to be pasted;
Identifying a matched material tray body from the material box according to the material information to be mounted, moving the material tray body into a mounting groove of a lower compression ring piece of a mounting station, and controlling an upper compression ring piece to fix the material tray body;
identifying the type and the material information of the material tray body and calling a mounting program, wherein the mounting program is used for controlling a mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
Confirming whether a film expanding mechanism is called according to the material tray type and the material information of the material tray body, if the film expanding mechanism is called, calling a thimble head according to the material tray type, wherein the called thimble head is matched with a wafer tray of a UV film or a blue film corresponding to the material tray type, and controlling the thimble head to move and jack up the position of the wafer tray to be absorbed;
and executing the mounting procedure and finishing the material mounting.
A computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to perform the steps of:
acquiring information of a material to be pasted;
Identifying a matched material tray body from the material box according to the material information to be mounted, moving the material tray body into a mounting groove of a lower compression ring piece of a mounting station, and controlling an upper compression ring piece to fix the material tray body;
identifying the type and the material information of the material tray body and calling a mounting program, wherein the mounting program is used for controlling a mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
Confirming whether a film expanding mechanism is called according to the material tray type and the material information of the material tray body, if the film expanding mechanism is called, calling a thimble head according to the material tray type, wherein the called thimble head is matched with a wafer tray of a UV film or a blue film corresponding to the material tray type, and controlling the thimble head to move and jack up the position of the wafer tray to be absorbed;
and executing the mounting procedure and finishing the material mounting.
Compared with the prior art, the technical scheme has the advantages that the universal material Tray provided by the scheme can be compatible with the material supply box and the mounting compression ring sheet assembly on the mounting station, namely, the universal material Tray can be stored in the material supply box, can also be moved to the mounting compression ring sheet assembly on the mounting station to finish subsequent mounting, can be compatible with various Tray trays or wafer trays in pairs, and particularly can be compatible with wafer trays of different sizes, because the wafer trays can be fixed with wafer trays of 6 inches, 8 inches, 12 inches or other sizes, the universal material Tray solves the compatibility problem caused by different types of material trays corresponding to different materials to be mounted, and realizes the hardware foundation for automatic grabbing, automatic resetting and automatic replacement of the non-manually-participated and fully-automatic mounting materials. The universal material tray has the advantage of being universally adapted to various conventional material trays.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Wherein:
FIG. 1 is a schematic diagram of the first universal tray and feed bin and mounting press ring assembly according to one embodiment;
FIG. 2 is a schematic diagram of a second embodiment of a universal tray and feed bin and mounting press tab assembly;
FIG. 3 is a schematic diagram of wafer trays of different sizes corresponding to a common tray in one embodiment;
FIG. 4 is a schematic diagram of the structure of an identifier in one embodiment;
FIG. 5 is a schematic view of an embodiment of a needle head and a needle platform;
FIG. 6 is a flowchart of a method for controlling a universal tray according to an embodiment;
FIG. 7 is a block diagram of a control device for a universal tray according to an embodiment;
FIG. 8 is a block diagram of a computer device in one embodiment.
Reference numerals:
10-carrying disc body, 11-fixing groove, 12-identifying groove, 21-wafer disc, 22-Tray disc, 30-feeding box, 41-upper press ring sheet, 411-identifying window, 42-lower press ring sheet, 421-mounting groove, 50-identifier, 51-upper identified surface, 52-upper identification component, 53-plug-in component structure, 54-side identified surface, 55-side identification component, 60-ejector pin head, 61-ejector pin mounting seat and 62-ejector pin groove.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present application, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Example 1
The embodiment relates to a universal tray of a chip mounter device, which is also called a mounting machine or a surface mounting system (Surface Mount System), is the most core device in an SMT (surface mounting technology) production line, is one of key devices essential in the modern manufacturing field, and structurally comprises a frame, a PCB (printed Circuit Board) conveying mechanism, a servo positioning system, an optical identification system, a chip head, a feeder, a sensor system, an electric control system and a software control system, wherein the feeder mainly comprises a strip feeder and a disc feeder (tray feeder). The Tray-shaped feeder mainly comprises a wafer Tray 21 and a Tray 22, the structure of the wafer Tray 21 comprises a supporting iron frame and wafer chips fixed on a material film, and the structure of the Tray 22 comprises a Tray body and material grids arranged on the Tray body and used for accommodating various elements, and the Tray is usually used for mounting QFP, BGA and the like.
When various components are mounted, the chip mounter usually fixes the same type of components in the same material tray, and in a mounting procedure, the chip mounter sucks the same material from one material tray and sequentially mounts the same material on a plurality of PCB boards, and when next material is mounted, the material tray is replaced, and the same material is sucked from the material tray again and sequentially mounts the same material on the plurality of PCB boards until the mounting of all components is completed.
Because only one Tray can be placed at a time in the mounting position of the Tray, the Tray is usually replaced manually when the material is replaced, and the type of the thimble head of the film expansion mechanism corresponding to the Tray is adjusted (film expansion is not needed if the Tray 22 is used), so that full-automatic production is not realized when the Tray is replaced, and the procedures involving manual work inevitably lead to cost rise and insufficient optimization of production efficiency.
In order to solve the above technical problems, the present embodiment provides a general-purpose tray, which includes a tray body 10 and a fixing mechanism;
The Tray body 10 is provided with a fixing groove 11 capable of simultaneously adapting to the Tray 22 or the wafer Tray 21, and the fixing mechanism is used for fixing the Tray 22 or the wafer Tray 21 on the fixing groove 11;
As shown in fig. 1 and 2, the shape of the carrier disc body 10 may be adapted to the feed box 30 and the mounting press ring assembly of the same piece of surface mounting equipment at the same time, so that the carrier disc body 10 may be accommodated on the feed box 30 or the mounting press ring assembly.
The general-purpose Tray provided by the scheme can be compatible with the feeding box 30 and the mounting compression ring sheet assembly on the mounting station, namely, the general-purpose Tray can be stored in the feeding box 30 and can also be moved to the mounting compression ring sheet assembly on the mounting station to finish subsequent mounting, and the general-purpose Tray can be compatible with various Tray trays 22 or wafer trays 21, particularly can be compatible with wafer wafers with different sizes, because the wafer trays 21 can be fixed with 6 inch, 8 inch, 12 inch or wafer wafers with other sizes, as shown in fig. 3, the general-purpose Tray solves the compatibility problem caused by different Tray types corresponding to different materials to be mounted, and lays a hardware foundation for automatic grabbing, automatic resetting and automatic replacement of non-manual-participation and full-automatic mounting materials. The universal material tray has the advantage of being universally adapted to various conventional material trays.
Example two
The embodiment specifically provides a preferable universal tray, which comprises a tray body 10 and a fixing mechanism;
The Tray body 10 is provided with a fixing groove 11 which can be simultaneously matched with the Tray 22 or the wafer 21, the fixing mechanism is used for fixing the Tray 22 or the wafer 21 on the fixing groove 11, and the shape of the Tray body 10 can be simultaneously matched with the feed box 30 and the mounting press ring sheet assembly of the same piece of surface mounting equipment so that the Tray body 10 can be accommodated on the feed box 30 or the mounting press ring sheet assembly.
The carrier body 10 has a larger volume than the conventional Tray 22 or wafer 21, or retains the original volume, so that the size of the Tray 22 or wafer 21 is reduced, and the size of the conventional Tray 22 or wafer 21 includes a peripheral supporting space, which is sufficient to support the reduction of the size.
By arranging the Tray body 10, the Tray 22 and the wafer Tray 21 can be uniformly loaded by a universal device, and the Tray can be simultaneously matched with a novel or existing material supply box 30 and a chip mounting device.
Specifically, the shape of the carrier body 10 is adapted to the multi-layer slot of the feed box 30 so that the carrier body 10 can be inserted into or withdrawn from the feed box 30, and the shape of the carrier body 10 is adapted to the mounting groove 421 of the lower press ring piece 42 of the press ring piece assembly so that the carrier body 10 can be dropped into or taken out from the lower press ring piece 42.
Specifically, the fixing mechanism comprises at least 2 groups of rotary pressing assemblies, each rotary pressing assembly comprises a driving motor and a rotary pressing sheet, and the driving motor controls the rotary pressing sheet to press the edges of the Tray disc 22 or the wafer disc 21 into the fixing groove 11 of the carrier disc body 10. The conventional fixing mechanism generally adopts clamping and pressing plates, and clamps and fixes the edge of the wafer tray 21 through a plurality of pressing plate spring structures.
The technical problem of the general type charging tray that this scheme provided, its core that solves is, through reforming transform traditional charging tray and charging tray discernment, removal, fixed mode, realizes the technical problem of automatic change disk feeder of chip mounter, consequently, the new structure of general type charging tray is all with solving non-manual whole flow and is the scheme thinking, consequently, the fixed establishment of carrying tray body 10 has adopted 2 at least rotatory compression assemblies of group, realizes carrying tray body 10's fixed or dismantlement through driving motor's control.
Further, since the rotary compressing assembly can control the rotation angle of the rotary compressing sheet through the driving motor, the rotary compressing assembly can adjust the compressing degree of the universal Tray, that is, along the rotation direction, the larger the rotation angle is, the higher the compressing degree is, the rotary compressing mode can be also suitable for the wafer trays 21 or Tray trays 22 with different thicknesses, that is, the thicker the Tray bodies are, and the universal type and automatic fixing or releasing of the Tray bodies with different thicknesses can be realized by adjusting the rotation angle.
Specifically, the mounting press ring piece includes a lower press ring piece 42 and at least 2 upper press ring pieces 41, the upper press ring pieces 41 are lifted or lowered by a press ring control piece, in the lifted state, the carrier disc body 10 can be taken out of the lower press ring piece 42, and in the lowered state, the press ring control piece fixes the carrier disc body 10 in the mounting groove 421 of the lower press ring piece 42.
Through the scheme, the universal fixing and unfixing of various trays with different thicknesses and different types can be realized, and meanwhile, the feeding box 30 and the mounting compression ring sheet assembly are adapted.
Example III
As shown in fig. 3, in order to adapt to the optical recognition system of the conventional chip mounter, the carrier tray body 10 is provided with the identifier 50, and since the direction of recognition by the conventional optical recognition system is mainly from top to bottom, the upper part of the tray body stacked in the feeding tray is blocked and cannot be recognized directly.
The present embodiment provides a identifier 50 of a tray body 10, where the identifier 50 is used for identifying a tray type and material information fixed in a fixed slot 11, the identifier 50 has at least an upper identified surface 51 and a lateral identified surface 54, the upper identified surface 51 of the identifier 50 can be identified by an optical identification system of a mounting device and acquire a current tray type stored in the identifier 50, and the lateral identified surface 54 of the identifier 50 can be identified by an optical identification system of the mounting device and acquire material information of a current tray stored in the identifier 50. Since the types of the existing trays are fewer and the types of the existing trays are not more than 10, the lateral identified surface 54 can be arranged on the lateral side of the identifier 50 of the tray, and a transverse identification subsystem is added on the existing optical identification system and is only used for identifying the identification task with the type not more than 10, so that the setting cost of the identification subsystem is very low, the precision can be hundred percent, the types of the trays are identified through the transverse identification subsystem, and the moving control parameter program and the thimble head 60 which are matched with the types of the trays are called in advance, so that the overall rhythm and the efficiency of material mounting are improved.
Specifically, the tray body 10 is provided with a identifier 50, the identifier 50 is used for identifying the type of the tray and the material information fixed in the fixed slot 11, the identifier 50 at least has an upper identified surface 51 and a lateral identified surface 54, the upper identified surface 51 of the identifier 50 can be identified by an optical identification system of the mounting device and acquire the current type of the tray stored in the identifier 50, and the lateral identified surface 54 of the identifier 50 can be identified by the optical identification system of the mounting device and acquire the material information of the current tray stored in the identifier 50.
Specifically, the identifier 50 has an insert structure 53 adapted to the tray body 10, and the identifier 50 is detachably inserted into the identifying groove 12 of the tray body through the insert structure 53. At least 2 side identification components 55 which can be identified by an optical identification system of the mounting device are arranged on the side identified surface 54 of the identifier 50, and the tray type are identified by identifying the side identification components 55. At least 3 upper identification components 52 which can be identified by an optical identification system of the mounting device are arranged on the upper identification surface of the identifier 50, and the type information, the quantity information and the initial azimuth information of the materials in the tray are identified by identifying the upper identification components 52.
When the material is replaced, the identifier 50 can identify the type of the material tray, call the movement control parameter program matched with the type of the material tray in advance to move, fix and prepare the thimble head 60 matched with the material tray on the material tray body 10 in advance, so that the call time of the thimble head 60 can be reduced, and the integral rhythm and efficiency of the material mounting can be improved.
Example IV
In order to adapt to the optical recognition system of the existing chip mounter, the identifier 50 is provided on the carrier tray body 10, and since the direction of recognition by the existing optical recognition system is mainly from top to bottom, and the upper part of the tray body stacked in the feeding tray is blocked and cannot be recognized directly, the retractable identifier 50 can be provided on the carrier tray body 10, and the identifier 50 comprises a retractable structure and is detachably mounted in the recognition slot 12 of the tray body. The identifier 50 is provided on an upper recognition surface thereof with a recognition function by an optical recognition system of the mounting apparatus. The identifier 50 protrudes from the tray body through the telescopic structure when being placed on the tray to facilitate the identification of the optical identification system, but the identifier 50 protruding from the tray body interferes when being placed on the mounting press ring piece assembly to prevent the mounting of the tray body, so that the tray moving device provided by the embodiment is provided with the material taking mechanism which is adaptive to the identifier 50 of the tray body in order to solve the technical problem, and the material taking mechanism applies a force from the side of the identifier 50 when the tray body 10 is taken out from the material box 30, so that the identifier 50 is pressed back to the tray body 10 and is fixed in the mounting groove 421 of the lower press ring piece 42 of the mounting press ring piece assembly.
An identification window 411 is provided on the upper pressure disc to match the identifier 50, to avoid interference effects of the upper pressure disc on the identifier 50 or to provide an optical path for viewing of the identifier 50 in some special cases.
The present embodiment further provides an identifier 50 of the tray body 10, where the identifier 50 further includes a third active identification surface, an image recognition camera and a wireless transceiver are disposed on the third active identification surface, the image recognition camera is used to recognize the material information on the tray body 10, and the material information is used to push the tray type and the material information back to the storage module of the identifier 50, where the tray type in the storage module is expressed by a lateral identification component 55 on a lateral identified surface 54, and the material information in the storage module is expressed by an upper identification component 52 on an upper identified surface 51.
Example five
The embodiment provides a chip mounter, the chip mounter includes the general charging tray of arbitrary one of the above-mentioned. The technical problem that this charging Tray solved is because only can place a charging Tray each time in the dress position of charging Tray, consequently usually by artifical change charging Tray when changing the material, adjusts the thimble head type (need not to expand the membrane if Tray 22) of the membrane mechanism that the charging Tray corresponds, consequently, does not realize full automated production in the charging Tray change fashion, and these artifical processes of participating in must lead to cost rise and production efficiency's optimization inadequately.
The chip mounter with the universal material Tray can be compatible with the material feed box 30 and the mounting compression ring sheet assembly on the mounting station, namely, the universal material Tray can be stored in the material feed box 30 and can also be moved to the mounting compression ring sheet assembly on the mounting station to finish subsequent mounting, the universal material Tray can be compatible with various Tray trays 22 or wafer trays 21, particularly, wafers with different sizes can be compatible, because the wafer trays 21 can be fixed with 6 inch, 8 inch, 12 inch or wafers with other sizes, as shown in fig. 3, the universal material Tray solves the compatibility problem caused by different material Tray types corresponding to different materials to be mounted, and realizes the hardware foundation for automatic grabbing, automatic resetting and automatic replacement of the non-manually participated and fully-automatic mounting materials. The universal material tray has the advantage of being universally adapted to various conventional material trays.
Example six
The technical problem that this embodiment solved is that, current chip mounter can only place a charging Tray each time on the mounting position of charging Tray, consequently usually by artifical change charging Tray when changing the material, adjusts the thimble head type (need not to expand the membrane if Tray 22) of the membrane mechanism that the charging Tray corresponds, consequently, does not realize full automated production in the charging Tray change fashion, and these artifical participating in the process must lead to cost rise and production efficiency's inadequately optimization.
In order to solve the technical problem, the present embodiment provides a control method of a general-purpose tray, as shown in fig. 6, including the following steps:
s101, acquiring information of materials to be pasted;
S102, identifying a matched material tray body from the material box 30 according to the material information to be mounted and moving the material tray body into the mounting groove 421 of the lower press ring piece 42 of the mounting station, and controlling the upper press ring piece 41 to fix the material tray body;
S103, identifying the tray type and the material information of the tray body and calling a mounting program, wherein the mounting program is used for controlling a mounting head to absorb and mount the material on the tray body to a target position of a target PCB;
S104, confirming whether a film expansion mechanism is called according to the identified material tray type and the material information of the obtained material tray body, if the film expansion mechanism is called, calling a thimble head 60 according to the material tray type, wherein the called thimble head 60 is matched with the UV film or blue film wafer 21 corresponding to the material tray type, and controlling the thimble head 60 to move and jack up the position to be absorbed of the wafer 21;
S105, executing the mounting procedure and finishing the material mounting.
S106, if the film expanding mechanism is not called, the mounting program is directly executed, and the material mounting is completed.
The chip mounter with the universal material Tray can be compatible with the material feed box 30 and the mounting compression ring sheet assembly on the mounting station, namely, the universal material Tray can be stored in the material feed box 30 and can also be moved to the mounting compression ring sheet assembly on the mounting station to finish subsequent mounting, the universal material Tray can be compatible with various Tray trays 22 or wafer trays 21, particularly, wafers with different sizes can be compatible, because the wafer trays 21 can be fixed with 6 inch, 8 inch, 12 inch or wafers with other sizes, as shown in fig. 3, the universal material Tray solves the compatibility problem caused by different material Tray types corresponding to different materials to be mounted, and realizes the hardware foundation for automatic grabbing, automatic resetting and automatic replacement of the non-manually participated and fully-automatic mounting materials. The universal material tray has the advantage of being universally adapted to various conventional material trays.
Example seven
The embodiment provides a preferred control method for a universal tray, which further includes:
the step of controlling the ejector pin 60 to move and jack up the position to be sucked of the wafer tray 21 includes:
The method comprises the steps of obtaining a target ejector pin according to the film type and the wafer size of the wafer tray 21 corresponding to the type of the material tray, respectively installing the target ejector pin and a non-target ejector pin in different ejector pin grooves 62 of an ejector pin installation seat 61, moving the ejector pin installation seat 61 to enable the target ejector pin to be located at a first target position, lifting the target ejector pin to be located at a second target position, enabling the target ejector pin located at the second target position to be higher than the non-target ejector pin, lifting the ejector pin installation seat 61 to enable the target ejector pin to move and jack the position to be absorbed of the wafer tray 21.
As shown in fig. 5, 3 thimble grooves 62 are formed in the thimble mounting seat 61 and used for mounting 3 kinds of commonly used thimble heads 60, a thimble lifting mechanism is arranged at the bottom of each thimble head 60 and used for controlling the height position of each thimble in the thimble groove 62, the thimble mounting seat 61 is integrally connected with the thimble transverse control mechanism and used for controlling the target thimble head of the thimble mounting seat 61 to be positioned at the concentric position of the bottom of the wafer 21, and the thimble lifting mechanism lifts the target thimble head and avoids other thimble heads from affecting the film structure.
Example eight
The embodiment provides a control device for a universal tray, as shown in fig. 7, including:
the mounting target module 100 is configured to obtain information of a material to be mounted;
The tray pickup module 200 is configured to identify a matched tray body from the material box 30 according to the material information to be mounted and move the tray body into the mounting groove 421 of the lower press ring piece 42 of the mounting station, and control the upper press ring piece 41 to fix the tray body;
The program calling module 300 is used for identifying the tray type and the material information of the tray body and calling a mounting program, and the mounting program is used for controlling a mounting head to suck and mount the material on the tray body to a target position of a target PCB;
The thimble calling module 400 is configured to determine whether to call the film expansion mechanism according to the tray type and the material information of the tray body obtained by recognition, if the film expansion mechanism is called, call the thimble head 60 according to the tray type, wherein the called thimble head 60 is adapted to the wafer 21 of the UV film or the blue film corresponding to the tray type, and control the thimble head 60 to move and jack up the position to be sucked of the wafer 21;
the mounting execution module 500 is used for executing a mounting program and completing material mounting.
The control device of the universal charging Tray provided by the scheme can be compatible with the charging box 30 and the mounting compression ring sheet assembly on the mounting station to the outside, namely, the universal charging Tray can be stored in the charging box 30, can also be moved to the mounting compression ring sheet assembly on the mounting station to finish subsequent mounting, and can be compatible with various Tray trays 22 or wafer trays 21 in the universal charging Tray pair, particularly can be compatible with wafers with different sizes, because the wafer trays 21 can be fixed with wafers with 6 inches, 8 inches, 12 inches or other sizes, the universal charging Tray solves the compatibility problem caused by different types of the charging trays corresponding to different materials to be mounted, and lays a hardware foundation for automatic grabbing, automatic resetting and automatic replacement of the non-manually-participated and fully-automatic mounting materials. The universal material tray has the advantage of being universally adapted to various conventional material trays.
Example nine
FIG. 8 illustrates an internal block diagram of a computer device in one embodiment. The computer device may specifically be a terminal or a server. As shown in fig. 8, the computer device includes a processor, a memory, and a network interface connected by a system bus. The memory includes a nonvolatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system, and may also store a computer program that, when executed by the processor, causes the processor to implement a method for controlling a universal tray. The memory may also have stored therein a computer program which, when executed by the processor, causes the processor to perform the age identification method. It will be appreciated by those skilled in the art that the structure shown in FIG. 8 is merely a block diagram of some of the structures associated with the present inventive arrangements and is not limiting of the computer device to which the present inventive arrangements may be applied, and that a particular computer device may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.
In one embodiment, a computer device is presented comprising a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of:
acquiring information of a material to be pasted;
Identifying a matched tray body from the material box 30 according to the material information to be mounted and moving the tray body into the mounting groove 421 of the lower compression ring piece 42 of the mounting station, and controlling the upper compression ring piece 41 to fix the tray body;
identifying the type and the material information of the material tray body and calling a mounting program, wherein the mounting program is used for controlling a mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
Confirming whether a film expansion mechanism is called according to the material tray type and the material information of the material tray body, if the film expansion mechanism is called, calling a top needle 60 according to the material tray type, wherein the called top needle 60 is matched with a wafer tray 21 of a UV film or a blue film corresponding to the material tray type, and controlling the top needle 60 to move and jack up the position to be absorbed of the wafer tray 21;
and executing the mounting procedure and finishing the material mounting.
In one embodiment, a computer-readable storage medium is provided, storing a computer program which, when executed by a processor, causes the processor to perform the steps of:
acquiring information of a material to be pasted;
Identifying a matched tray body from the material box 30 according to the material information to be mounted and moving the tray body into the mounting groove 421 of the lower compression ring piece 42 of the mounting station, and controlling the upper compression ring piece 41 to fix the tray body;
identifying the type and the material information of the material tray body and calling a mounting program, wherein the mounting program is used for controlling a mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
Confirming whether a film expansion mechanism is called according to the material tray type and the material information of the material tray body, if the film expansion mechanism is called, calling a top needle 60 according to the material tray type, wherein the called top needle 60 is matched with a wafer tray 21 of a UV film or a blue film corresponding to the material tray type, and controlling the top needle 60 to move and jack up the position to be absorbed of the wafer tray 21;
and executing the mounting procedure and finishing the material mounting.
Those skilled in the art will appreciate that all or part of the processes in the methods of the above embodiments may be implemented by a computer program for instructing relevant hardware, where the program may be stored in a non-volatile computer readable storage medium, and where the program, when executed, may include processes in the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in embodiments of the application may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (SYNCHLINK) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description. The foregoing examples illustrate only a few embodiments of the application and are described in detail herein without thereby limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element, or be directly connected or indirectly connected to the other element when the element is referred to as being "connected" to the other element. It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or components referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" or "a number" means two or more, unless specifically defined otherwise.
It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for the purpose of understanding and reading the disclosure, and are not intended to limit the scope of the application, which is defined by the claims, but rather by the claims, unless otherwise indicated, and that any structural modifications, proportional changes, or dimensional adjustments, which would otherwise be apparent to those skilled in the art, would be made without departing from the spirit and scope of the application.
Claims (10)
1. The universal tray is characterized by comprising a tray body and a fixing mechanism;
The Tray body is provided with a fixing groove which can be simultaneously matched with the Tray or the wafer Tray, and the fixing mechanism is used for fixing the Tray or the wafer Tray on the fixing groove;
The appearance of carrying disc body can adapt to the feed box and the pressure ring piece assembly of same piece of paster equipment simultaneously so that carrying disc body can be held on feed box or the pressure ring piece assembly of dress.
2. The universal tray of claim 1, wherein:
the shape of the tray body is matched with the multi-layer slot of the feed box so that the tray body can be inserted into or withdrawn from the feed box;
The appearance of carrying disc body and the mounting groove looks adaptation of the lower clamping ring piece of dress clamping ring piece subassembly so that carrying disc body can fall into or take out in lower clamping ring piece.
3. The universal tray of claim 1, wherein:
the fixing mechanism comprises at least 2 groups of rotary pressing assemblies, each rotary pressing assembly comprises a driving motor and a rotary pressing sheet, and the driving motor controls the rotary pressing sheet to press the edge of the Tray or the wafer Tray into the fixing groove of the Tray body.
4. The universal tray of claim 1, wherein:
The mounting clamping ring piece comprises a lower clamping ring piece and at least 2 upper clamping ring pieces, the upper clamping ring pieces are lifted or lowered through a clamping ring control piece, the carrying disc body can be taken out of the lower clamping ring piece in a lifting state, and the carrying disc body is fixed in a mounting groove of the lower clamping ring piece by the clamping ring control piece in a lowering state.
5. The universal tray of claim 1, wherein:
The tray body is provided with a recognizer, the recognizer is used for recognizing the type of the tray and the material information fixed in the fixed groove, the recognizer is at least provided with a recognized surface at the upper part and a recognized surface at the side, the recognized surface at the upper part of the recognizer can be recognized by an optical recognition system of the mounting equipment and acquire the current type of the tray stored in the recognizer, and the recognized surface at the side of the recognizer can be recognized by the optical recognition system of the mounting equipment and acquire the material information of the current tray stored in the recognizer.
6. A patch device comprising a universal tray as claimed in any one of claims 1-5.
7. The control method of the universal material tray is characterized by comprising the following steps:
acquiring information of a material to be pasted;
Identifying a matched material tray body from the material box according to the material information to be mounted, moving the material tray body into a mounting groove of a lower compression ring piece of a mounting station, and controlling an upper compression ring piece to fix the material tray body;
identifying the type and the material information of the material tray body and calling a mounting program, wherein the mounting program is used for controlling a mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
Confirming whether a film expanding mechanism is called according to the material tray type and the material information of the material tray body, if the film expanding mechanism is called, calling a thimble head according to the material tray type, wherein the called thimble head is matched with a wafer tray of a UV film or a blue film corresponding to the material tray type, and controlling the thimble head to move and jack up the position of the wafer tray to be absorbed;
and executing the mounting procedure and finishing the material mounting.
8. The method of claim 7, wherein the mounting process is directly performed and the material mounting is completed without invoking the film expanding mechanism.
9. The method for controlling a universal tray according to claim 7, wherein the step of controlling the ejector pin to move and jack up the position to be sucked of the wafer tray comprises the steps of:
Acquiring a target ejector pin head according to the film type and the wafer size of the wafer tray corresponding to the type of the material tray, wherein the target ejector pin head and the non-target ejector pin head are respectively arranged in different ejector pin grooves of an ejector pin mounting seat;
And moving the thimble installation seat to enable the target thimble head to be located at a first target position, lifting the target thimble head to a second target position, wherein the target thimble head located at the second target position is higher than the non-target thimble head, and lifting the thimble installation seat to enable the target thimble head to move and jack up the position to be absorbed of the wafer disk.
10. A control device for a universal tray, comprising:
The mounting target module is used for acquiring information of materials to be mounted;
The tray picking module is used for identifying a matched tray body from the inside of the material box according to the information of the material to be mounted and moving the tray body into the mounting groove of the lower compression ring piece of the mounting station, and controlling the upper compression ring piece to fix the tray body;
the program calling module is used for identifying the type and the material information of the material tray body and calling a mounting program, and the mounting program is used for controlling the mounting head to absorb and mount the material on the material tray body to a target position of a target PCB (printed circuit board);
The thimble calling module is used for confirming whether the film expanding mechanism is called according to the material tray type and the material information of the material tray body, if the film expanding mechanism is called, the thimble head is called according to the material tray type, the called thimble head is matched with the wafer tray of the UV film or the blue film corresponding to the material tray type, and the thimble head is controlled to move and jack up the position to be absorbed of the wafer tray;
and the mounting execution module is used for executing a mounting program and completing material mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202411847517.4A CN119342793B (en) | 2024-12-16 | 2024-12-16 | Universal material tray, patch equipment, control method and device |
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| CN202411847517.4A CN119342793B (en) | 2024-12-16 | 2024-12-16 | Universal material tray, patch equipment, control method and device |
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| CN119342793B CN119342793B (en) | 2025-05-20 |
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| CN119342793B (en) | 2025-05-20 |
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