CN111308858A - Interface disc for preventing photoresist overflow - Google Patents
Interface disc for preventing photoresist overflow Download PDFInfo
- Publication number
- CN111308858A CN111308858A CN202010276097.4A CN202010276097A CN111308858A CN 111308858 A CN111308858 A CN 111308858A CN 202010276097 A CN202010276097 A CN 202010276097A CN 111308858 A CN111308858 A CN 111308858A
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- Prior art keywords
- overflow groove
- wafer
- glue
- overflow
- glue overflow
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an interface disc that prevents photoresist overflow, includes the smooth and flat base plate in surface, has round overflow groove along the inside processing of base plate outer lane, overflow the groove and separate the formation through overflow groove outer lane and overflow gluey groove inner circle, be equipped with a wafer and take the breach on the overflow groove, the wafer is taken to the overflow gluey inslot inner circle of breach department inwards sunken, take the wafer through the wafer, the glue that flows on the wafer is collected in the middle of the overflow groove, the regional inside processing that overflow groove encloses has a plurality of vacuum hole, when the base plate was arranged in on the photoetching machine chuck, vacuum hole and the vacuum channel on the photoetching machine chuck communicate with each other, the base plate was inhaled tightly. The invention can effectively prevent the photoresist from polluting or damaging the chuck of the photoetching machine, and has the advantages of low manufacturing cost, relatively simple manufacturing process, easy cleaning and repeated use.
Description
Technical Field
The invention belongs to the field of photoresist embossing, and particularly relates to an interface disc for preventing photoresist overflow.
Background
During imprint, photoresist often overflows from the substrate material (wafer) and flows into a chuck of a lithography machine, thereby causing technical problems: 1. the photoresist overflows from the substrate material and flows into the vacuum seal groove on the chuck, so that the seal cannot be completely blown up or completely retracted into the groove and is difficult to completely clean. 2. The photoresist overflows from the substrate material and flows into the vacuum holes or vacuum grooves on the chuck, so that the vacuum holes or vacuum grooves are blocked and the vacuum is difficult to be fully utilized.
In the case of the two conditions, the vacuum failure of the chuck or the direct scrapping of the chuck is easily caused.
Disclosure of Invention
The invention aims to solve the problem of the chuck failure of the photoetching machine caused by photoresist overflow in the prior art, and provides an interface disc for preventing the photoresist overflow, which prevents the photoresist from polluting or damaging the chuck of the photoetching machine, is simple to manufacture and can be repeatedly used.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an interface disc that prevents photoresist overflow, includes the smooth and flat base plate in surface, has round overflow groove along the inside processing of base plate outer lane, overflow the groove and separate the formation through overflow groove outer lane and overflow gluey groove inner circle, be equipped with a wafer and take the breach on the overflow groove, the wafer is taken to the overflow gluey inslot inner circle of breach department inwards sunken, take the wafer through the wafer, the glue that flows on the wafer is collected in the middle of the overflow groove, the regional inside processing that overflow groove encloses has a plurality of vacuum hole, when the base plate was arranged in on the photoetching machine chuck, vacuum hole and the vacuum channel on the photoetching machine chuck communicate with each other, the base plate was inhaled tightly.
Preferably, the substrate is a circular plate processed by a transparent rigid material or directly injection-molded.
As a further preferred scheme, the substrate is a circular plate made of glass.
As a preferable scheme, the diameter of the inner ring of the glue overflow groove is 0.5 mm-1 mm smaller than the diameter of the wafer, and the diameter of the outer ring of the glue overflow groove is 0.5 mm-1 mm larger than the diameter of the wafer but smaller than or equal to the diameter of the chuck of the photoetching machine.
As a preferred scheme, the vacuum hole comprises a central hole, and a plurality of circles of surrounding holes are concentrically arranged on the periphery of the central hole; the central hole is opposite to the through hole in the center of the chuck of the photoetching machine, and the surrounding holes are uniformly distributed along the circumference.
As a preferred scheme, the outer ring of the glue overflow groove is not higher than the inner ring of the glue overflow groove, and the outer ring of the glue overflow groove is flush with the wall surface of the inner ring of the glue overflow groove.
As a preferred scheme, the height of the outer ring of the glue overflow groove is flush with that of the outer ring of the substrate.
As a preferable scheme, the bottom of the inner ring of the glue overflow groove is provided with a rubber ring with a right-angled triangle or right-angled trapezoid cross section for sealing and guiding glue.
As a preferable scheme, the height of the upper surface of the rubber ring does not exceed the inner ring surface of the inner ring of the glue overflow groove.
Compared with the prior art, the invention has the following beneficial effects:
1. after the photoresist is used, the photoresist can be effectively prevented from polluting or damaging the chuck of the photoetching machine.
When a main chuck (hereinafter referred to as a main chuck) attached to the photoetching machine is used for directly photoetching/imprinting, the main chuck is easily polluted by photoresist or imprinting glue, so that an inner vacuum hole on the main chuck of the photoetching machine is blocked and a rubber air bag forming a vacuum cavity is polluted.
The interface disc is arranged on the main chuck, so that the inner vacuum hole of the main chuck is communicated with the vacuum hole of the interface disc, a wafer substrate needing photoetching (imprinting) is arranged on the interface disc, and the vacuum of the main chuck is started to indirectly adsorb the wafer substrate. A photoresist or imprint resist (or any other material that can be used for lithography or imprint) is applied to the top surface of the wafer substrate. The main chuck, the interface disk, and the wafer substrate for lithographic imprinting are intimately bonded by vacuum adjacent surfaces. When the glue amount is excessive, the glue flows into or drips into the glue overflow groove on the interface disc through the outer boundary of the wafer subjected to photoetching and stamping, so that the aim of preventing glue overflow pollution is fulfilled.
2. The manufacturing cost is low, the manufacturing process is relatively simple, the cleaning is easy, and the device can be repeatedly used.
Compared with the defects of high manufacturing cost, complex process and difficult cleaning of a main chuck attached to a photoetching machine, the interface disk provided by the invention has the advantages of relatively low manufacturing cost, relatively simple manufacturing process and easy cleaning. The interface disc can be used for processing punching, slotting and the like on the basis of a glass wafer with a thicker thickness; the one-step molding can be carried out by injection molding or hot press molding.
If the thicker glass wafer is used for subsequent processing, subsequent processing on surface smoothness, flatness and the like is not needed; if the processing is carried out by injection molding or hot press molding, only the surface treatment of the mold is required. Both methods are easy to process in batches, so that the cost of a single interface disc is reduced, and the process is relatively simple.
In the aspect of cleaning: when the surface of the overflowing interface disc is polluted, the interface disc is taken down and cleaned or washed by any solution capable of dissolving the photoresist (stamping glue) (if the glue in the groove is small, the glue can be cleaned after being used for multiple times).
Furthermore, the invention adopts the transparent rigid material to process or directly injection-molded the substrate, which has the following advantages:
a. the corresponding conditions of the main chuck and the air holes (channels) of the interface disc can be seen more intuitively; b. the wafer glass with higher surface flatness is adopted as the interface disc substrate, so that the firmness of vacuum adsorption and the stability of the process can be ensured; c. the material with better rigidity has better pressure resistance and high thickness stability, thereby ensuring the stability of process compensation.
Drawings
FIG. 1 is a schematic front view of an interface disk of the present invention;
FIG. 2 is a schematic view of the back side of the interface disc and the chuck of the lithography machine according to the present invention;
in the drawings: 1-a substrate; 2-glue overflow groove; 2-1, an outer ring of the glue overflow groove; 2-2, an inner ring of the glue overflow groove; 3-vacuum channel; 4-outer ring of substrate; 5-taking a notch of the wafer; 6-central through hole of chuck of photoetching machine; 7-vacuum hole.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1-2, the interface disk of the present invention is a substrate 1 made of round glass or other transparent rigid material with a certain thickness, excellent flatness, no warpage, and good smoothness. A circle of glue overflow grooves 2 are processed along the inner part of a substrate outer ring 4, the glue overflow grooves 2 are formed by separating glue overflow groove outer rings 2-1 and glue overflow groove inner rings 2-2, a wafer taking gap 5 is arranged on the glue overflow grooves 2, the glue overflow groove inner rings 2-2 at the wafer taking gap 5 are inwards sunken, the diameter of the glue overflow groove inner rings 2-2 is smaller than the diameter of a wafer by 0.5 mm-1 mm, and the diameter of the glue overflow groove outer rings 2-1 is larger than the diameter of the wafer by 0.5 mm-1 mm but smaller than or equal to the diameter of a photoetching machine chuck. The wafer is convenient to take through the wafer taking notch 5, glue flowing out of the wafer is collected in the glue overflowing groove 2, a plurality of vacuum holes 7 are machined in the area surrounded by the glue overflowing groove 2, each vacuum hole 7 comprises a central hole, and a plurality of rings of surrounding holes are concentrically arranged on the periphery of the central hole. The central hole is opposite to the central through hole 6 of the chuck of the photoetching machine and is uniformly distributed around the hole along the circumference. When the substrate 1 is arranged on the chuck of the photoetching machine, the vacuum holes 7 are communicated with the vacuum channels 3 on the chuck of the photoetching machine, and the substrate 1 is tightly sucked by vacuumizing through the vacuum holes 7.
In the using process, the interface disc is placed on a chuck equipped or customized by a photoetching machine (hereinafter referred to as a 'photoetching machine chuck'), the vacuum hole 7 is aligned with the central through hole 6 of the photoetching machine chuck and the vacuum channel 3 of the photoetching machine chuck, the wafer is placed on the interface disc, and the wafer and the interface disc are tightly sucked through the through hole on the interface disc and the vacuum channel on the photoetching machine chuck, so that other operations are facilitated.
The interface disc provided by the invention is used for preventing photoresist from flowing into a chuck equipped or customized by a photoetching machine, and the principle of preventing the interface disc from overflowing and polluting the photoresist is as follows: the interface disc is arranged on the main chuck, so that the inner vacuum hole of the main chuck is communicated with the vacuum hole of the interface disc, a wafer substrate needing photoetching (imprinting) is arranged on the interface disc, and the vacuum of the main chuck is started to indirectly adsorb the wafer substrate. A photoresist or imprint resist (or any other material that can be used for lithography or imprint) is applied to the top surface of the wafer substrate. The outer diameter of the wafer substrate for photoetching and impressing is larger than the outer diameter of the inner ring 2-2 of the flash groove, and the outer diameter of the wafer substrate for photoetching and impressing is smaller than the outer diameter of the outer ring 2-1 of the flash groove. The main chuck, the interface disk, and the wafer substrate for lithographic imprinting are intimately bonded by vacuum adjacent surfaces. When the glue amount is excessive, the glue flows into or drips into the interface disc glue overflow groove through the outer boundary of the wafer subjected to photoetching and stamping, so that the aim of preventing glue overflow pollution is fulfilled. And a soft rubber ring with a right-angled triangle-shaped (right-angled trapezoid-shaped) cross section can be added at the bottom of the inner ring of the glue overflow groove for sealing and guiding glue. The upper surface of the rubber ring is flush with or slightly lower than the surface of the inner ring 2-2 of the glue overflow groove.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be understood by those skilled in the art that the present invention can be easily modified and replaced without departing from the spirit and principle of the present invention, and the obvious modifications and replacements also belong to the protection scope covered by the claims.
Claims (9)
1. An interface disk for preventing photoresist overflow, comprising: the substrate comprises a substrate (1) with a smooth and flat surface, wherein a circle of glue overflow groove (2) is processed along the inner side of a substrate outer ring (4), the glue overflow groove (2) is formed by separating a glue overflow groove outer ring (2-1) and a glue overflow groove inner ring (2-2), a wafer taking notch (5) is arranged on the glue overflow groove (2), the glue overflow groove inner ring (2-2) at the wafer taking notch (5) is inwards sunken, a wafer is taken through the wafer taking notch (5), glue flowing out of the wafer is collected into the glue overflow groove (2), a plurality of vacuum holes (7) are processed in an area surrounded by the glue overflow groove (2), when the substrate (1) is placed on a photo-etching machine chuck, the vacuum holes (7) are communicated with a vacuum channel (3) on the photo-etching machine chuck, and the substrate (1) is sucked tightly.
2. The interface disk for preventing photoresist overflow of claim 1, wherein:
the substrate (1) is a circular plate which is processed by adopting a transparent rigid material or is directly formed by injection molding.
3. The interface disk for preventing photoresist overflow of claim 2, wherein:
the substrate (1) is a circular plate made of glass.
4. The interface disk for preventing photoresist overflow of claim 1, wherein:
the diameter of the inner ring (2-2) of the glue overflow groove is 0.5 mm-1 mm smaller than that of the wafer, and the diameter of the outer ring (2-1) of the glue overflow groove is 0.5 mm-1 mm larger than that of the wafer but smaller than or equal to that of the chuck of the photoetching machine.
5. The interface disk for preventing photoresist overflow of claim 1, wherein:
the vacuum hole (7) comprises a central hole, and a plurality of circles of surrounding holes are concentrically arranged on the periphery of the central hole;
the central hole is opposite to the central through hole (6) of the chuck of the photoetching machine and is uniformly distributed around the hole along the circumference.
6. The interface disk for preventing photoresist overflow of claim 1, wherein: the glue overflow groove outer ring (2-1) is not higher than the glue overflow groove inner ring (2-2), and the glue overflow groove outer ring (2-1) is flush with the wall surface of the glue overflow groove inner ring (2-2).
7. The interface disk for preventing photoresist overflow of claim 1, wherein:
the outer ring (2-1) of the glue overflow groove is flush with the outer ring (4) of the substrate in height.
8. The interface disk for preventing photoresist overflow of claim 1, wherein: the bottom of the inner ring (2-2) of the glue overflow groove is provided with a rubber ring with a right-angled triangle or right-angled trapezoid cross section for sealing and guiding glue.
9. The interface disk for preventing photoresist overflow of claim 8, wherein:
the height of the upper surface of the rubber ring is not more than the inner ring surface of the inner ring (2-2) of the glue overflow groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010276097.4A CN111308858A (en) | 2020-04-09 | 2020-04-09 | Interface disc for preventing photoresist overflow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010276097.4A CN111308858A (en) | 2020-04-09 | 2020-04-09 | Interface disc for preventing photoresist overflow |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111308858A true CN111308858A (en) | 2020-06-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010276097.4A Pending CN111308858A (en) | 2020-04-09 | 2020-04-09 | Interface disc for preventing photoresist overflow |
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| Country | Link |
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| CN (1) | CN111308858A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075859A (en) * | 2021-04-01 | 2021-07-06 | 青岛天仁微纳科技有限责任公司 | Negative pressure type nano-imprinting equipment and imprinting method thereof |
| CN113471111A (en) * | 2021-07-10 | 2021-10-01 | 江苏晟驰微电子有限公司 | Tool for realizing wafer glass passivation process by using orifice plate steel screen printing |
| CN114002915A (en) * | 2021-11-18 | 2022-02-01 | 北京驭光科技发展有限公司 | Imprint substrate and imprint method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN206733378U (en) * | 2016-08-25 | 2017-12-12 | 环球晶圆股份有限公司 | Wafer adsorption carrying disc |
| CN207042768U (en) * | 2017-07-10 | 2018-02-27 | 深圳市中兴新地技术股份有限公司 | Anti-splash and protection vacuum suction piece hole spin coating pallet |
| CN110052370A (en) * | 2019-05-15 | 2019-07-26 | 苏州美图半导体技术有限公司 | Sol evenning machine vacuum spin coating device |
-
2020
- 2020-04-09 CN CN202010276097.4A patent/CN111308858A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206733378U (en) * | 2016-08-25 | 2017-12-12 | 环球晶圆股份有限公司 | Wafer adsorption carrying disc |
| CN207042768U (en) * | 2017-07-10 | 2018-02-27 | 深圳市中兴新地技术股份有限公司 | Anti-splash and protection vacuum suction piece hole spin coating pallet |
| CN110052370A (en) * | 2019-05-15 | 2019-07-26 | 苏州美图半导体技术有限公司 | Sol evenning machine vacuum spin coating device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075859A (en) * | 2021-04-01 | 2021-07-06 | 青岛天仁微纳科技有限责任公司 | Negative pressure type nano-imprinting equipment and imprinting method thereof |
| CN113075859B (en) * | 2021-04-01 | 2024-01-26 | 青岛天仁微纳科技有限责任公司 | Negative pressure type nano imprinting equipment and imprinting method thereof |
| CN113471111A (en) * | 2021-07-10 | 2021-10-01 | 江苏晟驰微电子有限公司 | Tool for realizing wafer glass passivation process by using orifice plate steel screen printing |
| CN114002915A (en) * | 2021-11-18 | 2022-02-01 | 北京驭光科技发展有限公司 | Imprint substrate and imprint method |
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