JP4529029B2 - Two-layer adhesive cleaning roller - Google Patents

Description

  The present invention is a cleaning roller having a two-layer structure that removes dust and dirt using adhesiveness, and corresponds to the height of unevenness of the substrate of the object to be soiled, the thinness of the film, etc. The present invention relates to an adhesive cleaning roller having a two-layer structure.

  A conventional cleaning roller using adhesiveness generally removes dust and dirt from an object by the adhesive force of the roller surface, and many are commercially available.

  In addition, the main roller and the sub roller, which are cleaning rollers, contact and rotate to transfer the dirt to the sub-roller in order to prevent redeposition of the dirt that has been removed from the object due to the adhesive force on the surface of the cleaning roller There is a dust removal roller. (For example, see Patent Document 1)

  Further, there is a continuous water supply rubber roller for offset printing as a two-layer rubber roller formed so as not to require adjustment work of the nipple width between the rubber roller and the object for a predetermined period. (For example, see Patent Document 2)

  In addition, there is a dust-removing roller with an adhesive sheet wrapped around the roller surface, which is an adhesive roller that removes dust and dirt attached to clothes. (For example, see Patent Document 3)

  JP 2002-112944 A   JP-A-2005-007812   Utility Model Registration No. 3018407

  The adhesive cleaning roller used in the past removes dust and dirt by adhering to the roller and removes dust and dirt attached to a flat surface such as a film for industrial use. There are many adhesive cleaning rollers with a predetermined hardness that can be removed, but they could not be used for those with various irregularities such as semiconductor substrates.

  It is necessary to make the adhesive cleaning roller flexible so as to correspond to the irregularities of various sizes, and if a thermoplastic elastomer with a low hardness below a predetermined level is selected, it will deform during molding because it is soft. As a result, it is difficult to mold due to shape deformation, and the yield and molding efficiency are poor, and it is not realistic in terms of the production cost of the roller. In general, extrusion molding is a mold compared to injection molding, etc. Although it is said that the cost is extremely low including the above, a soft roller that can cope with unevenness due to the molding method as mentioned above, the shape is not stable due to the collapse of the shape, it can be generally manufactured at low cost It was not produced by molding.

  In addition to dealing with the unevenness of the object, in the case of a thin film, if the adhesive force is not adjusted, it sticks to the object more than removing dust and dirt, etc. Therefore, it was necessary to appropriately change the adhesive strength in accordance with the thickness of the film, but this was not practical due to the manufacturing cost of the roller.

  Further, one of the main requirements of the above-described conventional dust removal roller of Patent Document 1 is that the dust on the exposure mask of the use example is adhered to and removed from the main roller 3, and the dust on the main roller 3 is removed from the sub roller 4. The rubber hardness specified in “JISK 6253-1997” is Hm> Hs + # in relation to the respective hardnesses for efficiently transferring the dust adhering to the main roller 3 to the sub-roller 4. 15 "is desirable.

  For this reason, the main roller 3 is always refreshed by the sub-roller 4, and the hardness of the main roller 3 is to increase the transfer efficiency on the plane between the sub-roller 4 and the surface, thereby removing dust. Therefore, in the configuration of the main roller 3, if the object has unevenness, dust cannot be removed by the unevenness.

  Further, the continuous water supply rubber roller for offset printing of Patent Document 2 has a two-layer structure, the surface layer is hard and the inner layer is flexible, and the plasticizer is extracted from the water supply rubber roller in use with ink or dampening water. It is supposed to respond to changes in linear pressure and nipple width based on shrinkage of the water supply rubber roller.

  From this, the shrinkage of the water supply rubber roller due to extraction from the upper rubber layer 12 as the surface layer is reduced to reduce the adjustment period in response to the change in the nipple width, and the water supply is made using the hardness of the surface layer. It is a two-layer rubber roller that seeks the reverse effect of the present invention because it prevents foreign matter from adhering to the surface of the rubber roller, and from this, it can be flexibly used by using a two-layer structure formed integrally. An adhesive cleaning roller that removes dust has not yet been provided.

  In addition, one of the requirements for the dust removal roller of Patent Document 3 is to use a plastic sheet or an adhesive sheet coated on paper or cloth wrapped around the roller 1 in order to remove dust and dust adhering to clothes. Therefore, it is assumed that the object to be used is soft or is used on a flat surface of a carpet such as a floor.

  For this reason, dirt such as dust and dirt cannot be removed from a hard flat object having various irregularities, and a plastic sheet or an adhesive sheet coated on paper or cloth is wound around the roller 1 for use. Therefore, for those frequently used in the industry, the trouble of replacing the pressure-sensitive adhesive sheet is complicated, and it is not practical in terms of cost.

In order to effectively achieve the above-mentioned problems, the present invention provides a thin layer adhesive by adding an adhesive to the base polymer of an olefin-based thermoplastic elastomer having a hardness of JIS-A 55 ° as the hardness of the outer layer of the cleaning roller. Soft elasticity of a thick-walled layer formed with a hardness (JIS-A) in the range of 20 ° to 60 ° with a soft thermoplastic elastomer made of a material that can flexibly cope with the unevenness of an object such as a substrate. It is supposed to be integrally molded as a layer.
This makes it possible to simplify the manufacturing process without causing deformation of the flexible adhesive layer in extrusion molding, remove dust and dirt even on uneven surfaces, and improve the abrasion resistance of the adhesive layer. The oil content contained in the adhesive layer is reduced to prevent secondary contamination.

The present invention is configured so that an effective effect can be obtained by each of the above-described means. In particular, in a cleaning roller having a two-layer structure having an outer layer and an inner layer, the hardness of the outer layer of the cleaning roller is set to a hardness JIS-A55 °. Adhesive material is added to the base polymer of olefinic thermoplastic elastomer to form an adhesive layer, and the inner layer is a soft thermoplastic elastomer made of a material that can flexibly cope with the height of the unevenness of the object such as a substrate (JIS-A ) By a first solving means that integrally forms a soft elastic layer formed in the range of 20 ° to 60 °, the outer adhesive layer as a thin layer and the inner soft elastic layer as a thick layer,
In response to demands for cleanliness such as prevention of secondary adhesion to cleaning objects such as films, the adhesive layer has a high hardness, so that the oil content in the adhesive layer is small, and therefore the film to be cleaned can be used. The oil content of the oil is little transferred, and the secondary contamination of the other side, such as film, is extremely low.

In addition, the adhesive cleaning roller with a two-layer structure is integrally molded, so that even if the adhesive layer has a lower hardness than the specified level and is made more flexible, the adhesive layer will not be deformed during extrusion molding. In addition, efficient molding and simplification of the manufacturing process thereby reduce the productivity and cost of the adhesive cleaning roller.

And, since the soft elastic layer is formed by changing the hardness appropriately so that it can correspond to the size of the unevenness of the object, the contact surface of the roller is deformed so as to adapt to various unevenness such as a semiconductor substrate. adhere to the semiconductor substrate and the fitting by, dust adhering thereto, is adhered dust or the like to the rollers, can be removed dust between the irregularities, even dust.

  Therefore, the pressure-sensitive adhesive layer and the soft elastic layer of the roller can flexibly deform to the size of the unevenness of the semiconductor substrate, etc. The adhesive cleaning roller can be used even on a semiconductor substrate having large and small irregularities.

  In addition, the outer layer has a thin and relatively high-adhesion pressure-sensitive adhesive layer, and the inner layer is a soft elastic layer, so that it can flexibly handle the object to be soiled. Thus, the wear resistance of the adhesive layer is improved, and the ability to remove dust and dirt can be maintained for a long time.

  In addition, the adhesive layer can be formed by appropriately changing the adhesive force in proportion to the film thickness of the object, too much sticking to the film of the object thin film, etc. The film is not torn and the winding phenomenon does not occur, and the productivity of the thin film can be improved and the cost can be reduced. Also, the difference between the adhesive strength and flexibility of the adhesive cleaning roller with a two-layer structure By combining them and molding them together, it is possible to reduce the manufacturing cost by changing the mold cost and material of the molding machine, etc., because it makes it possible to produce a variety of small lot lots of adhesive cleaning rollers in terms of cost The present invention has a remarkable effect in practical use.

  An embodiment of the present invention will be described with reference to the drawings. In FIG. 1, reference numeral 1 denotes an adhesive cleaning roller. The adhesive cleaning roller 1 has a substantially cylindrical shape with an outer layer as an adhesive layer 2 and an inner layer as a soft elastic layer 3. It is integrally molded by extrusion molding.

  The outer pressure-sensitive adhesive layer 2 is formed as a thin layer. Specifically, for example, the outer pressure-sensitive adhesive layer 2 has a thickness of about 0.2 to 1 mm, and is made of an adhesive thermoplastic elastomer.

  The adhesive strength of the adhesive layer 2 is selected from a strength adhesive strength, a medium adhesive strength, and a low adhesive strength, which are appropriately changed according to the state of the film 4 of the thin film of the object to be described later. It is.

Further, when the oil content of the adhesive layer 2 is observed in consideration of secondary contamination of the thin film of the object to the film 4, the adhesive layer 2 having a relatively high hardness is used by changing as appropriate. (For example, as an example, a JIS-A 55 ° olefin thermoplastic elastomer is used as a base polymer, and an adhesive is added thereto.)

  This is for the purpose of reducing the amount of oil contained in the low-hardness elastomer, and this reduces the amount of oil that is transferred to the object to be cleaned.

  The inner soft elastic layer 3 is formed in a thick cylindrical shape and is made of a soft thermoplastic elastomer (for example, a completely hydrogenated styrenic thermoplastic elastomer) (JIS-A). In the range of 20 ° to 60 °, the hardness of the deformation rate of the soft elastic layer 3 which is the softness of the soft elastic layer 3 is changed corresponding to the height of various irregularities such as the semiconductor substrate of the object. By doing so, it is selected by appropriately changing the uneven height of the object.

  The pressure-sensitive adhesive layer 2 and the soft elastic layer 3 are composed of the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer 2, medium pressure-sensitive adhesive force, low-level pressure-sensitive adhesive strength and soft elastic layer 3 hardness (JIS-A) of 20 ° to 60 °. Within a range, the respective differences in adhesive strength and hardness are combined and molded integrally by a so-called two-color extrusion method that has been conventionally performed.

  In each combination of the adhesive layer 2 and the soft elastic layer 3, from the three types of strength adhesive force, medium adhesive force, low adhesive force of the adhesive layer 2 and the hardness (JIS-A) 20 ° of the soft elastic layer 3 In the range of 60 °, for example, if the hardness (JIS-A) is 5 ° in units of 10 ° from 20 ° to 60 °, a combination with the three types of the adhesive layer 2 can be formed by 15 types.

  For example, an object to remove dust, dust, etc., is an adhesive layer 2 having a low adhesive strength and a soft elastic layer 3 having a hardness of about 60 °, particularly a thin thin film 4, and has various uneven heights. For the semiconductor substrate 7 or the like, an adhesive layer 2 having a strong adhesive force and a soft elastic layer 3 having a hardness of about 20 ° are selected.

  Therefore, as shown in FIG. 2, when using the thin film 4 as an object to remove dirt such as dust and dirt, the adhesive cleaning roller 1 is brought into contact with the thin film 4 and supported in the arrow direction. By rolling through the shaft 5, dust 6 on the thin film 4 is adhered to the surface of the adhesive layer 2 and removed.

  At that time, in the case of a particularly thin thin film 4, if the adhesive cleaning roller 1 has a strong adhesive force, the adhesive cleaning roller 1 may be wound or cut by the adhesive force. By selecting, it becomes possible to prevent such entrainment due to adhesive force from occurring.

  As shown in FIG. 3, when the object to remove dirt such as dust and dirt is a semiconductor substrate 7 having various sizes of unevenness, the adhesive cleaning roller 1 is placed on the plane of the semiconductor substrate 7. The surface of the pressure-sensitive adhesive layer 2 of the pressure-sensitive cleaning roller 1 is rolled on the component 8 provided in the concave-convex shape along the concave-convex shape via the support shaft 5 in the direction indicated by the arrow in the figure. The dust 6 or the like adheres to the semiconductor substrate 7 and the dirt such as the dust 6 on the component 8 is removed.

  The state of the adhesive layer 2 of the adhesive cleaning roller 1 at that time follows the unevenness when the adhesive layer 2 comes into contact with the semiconductor substrate 7 and the component 8 provided in the uneven state, as shown in FIG. The soft elastic layer 3 is similarly deformed and stuck so as to fill the gap, and dirt such as dust 6 on the semiconductor substrate 7 and the component 8 is removed while adhering to the surface of the adhesive layer 2.

  Further, the material hardness of the adhesive layer 2 of the adhesive cleaning roller 1 used for the semiconductor substrate 7 having irregularities is selected to be thin and relatively high in predetermined hardness, so The ability to remove dust and dirt is maintained for a long period of time by preventing wear and improving the ability to remove dust and dirt.

  This is because the adhesive layer 2 is thin and has a relatively high predetermined hardness and the flexibility of the soft elastic layer 3 so that it can flexibly correspond to the object to be soiled, and a large load is applied to the object and the adhesive layer 2 by repeated adhesive peeling. By not giving it, the abrasion resistance of the adhesive layer 2 itself is also improved, and the ability to remove dust, dirt, etc. is maintained for a long time.

  An example of a combination of the differences in hardness and adhesive strength of the above-described embodiments is an object to remove dust, dust, etc., such as a thin film 4 or a semiconductor substrate 7 having various uneven heights, and the object Depending on the degree of cleanliness, an optimal combination is selected as appropriate, but detailed specific illustrations are omitted.

  It is a perspective view of the Example of this invention.   It is a side view of the principal part which shows the state currently used for the film 4 of an example thin film.   It is a side view of the principal part which shows the state currently used for the semiconductor substrate 7 of an example.   It is a partial side view of the principal part which shows the state currently used for the semiconductor substrate 7 of an example.

DESCRIPTION OF SYMBOLS 1 Adhesive cleaning roller 2 Adhesive layer 3 Soft elastic layer 4 Thin film 7 Semiconductor substrate 8 Components

Claims (1)

In a cleaning roller having a two-layer structure having an outer layer and an inner layer, the hardness of the outer layer of the cleaning roller is set to an adhesive layer by adding an adhesive to a base polymer of an olefin-based thermoplastic elastomer having a hardness of JIS-A 55 °, and the inner layer is a substrate. It is a soft elastic layer made of a soft thermoplastic elastomer that can flexibly cope with the height of the unevenness of the object such as a soft elastic layer having a hardness (JIS-A) in the range of 20 ° to 60 °, and the outer adhesive layer is a thin layer And an adhesive cleaning roller having a two-layer structure, in which the inner soft elastic layer is integrally molded as a thick layer.

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