CN217862162U

CN217862162U - Novel dust collector

Info

Publication number: CN217862162U
Application number: CN202221098077.3U
Authority: CN
Inventors: 陆洪飞; 王春峰
Original assignee: Suzhou Zhongbocheng Electromechanical Equipment Co ltd
Current assignee: Suzhou Zhongbocheng Electromechanical Equipment Co ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-11-22
Anticipated expiration: 2032-05-09

Abstract

The utility model discloses a novel dust collector, which comprises a machine main body, wherein the machine main body is provided with a wafer fixing position, the machine main body is provided with a circle of collecting tank around the wafer fixing position, a pressing ring is arranged above the collecting tank, and the pressing ring shields a part of the collecting tank; and the blowing device and the chip sucker are positioned above the wafer fixing position. Utilize the machine main part to be equipped with the round collecting vat around the fixed position of wafer, gas blowing device can blow the material such as silicon crystal bits, dust to the collecting vat, realize the collection of silicon crystal bits, the dust, the clamping ring can realize silicon crystal bits, the dust does not spill over, better storage effect has, silicon crystal bits, the difficult scheduling problem of dust disposal have been solved, this application can not only high-efficient collection handle silicon crystal bits, the dust, simultaneously because this application can adopt split type structure installation combination, therefore this scheme can conveniently dismantle installation and cleanness.

Description

Novel dust collector

Technical Field

The utility model relates to a chip manufacturing field especially relates to a novel dust collector.

Background

In the prior art, the wafer can produce dust such as silicon crystal bits, silicon slag when the cutting is used, and the technical staff generally blows dust etc. to the wafer periphery through the gas blowing device on the machine to avoid long-term accumulation can cause product surface damage, pollute, arouse the increase scheduling problem of product defective rate, but this kind of mode can cause the dust etc. to drop to the machine in, cause damage, pollution to equipment, also difficult clearance simultaneously.

The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.

SUMMERY OF THE UTILITY MODEL

In order to meet the above requirements, an object of the present invention is to provide a novel dust collector.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a novel dust collector, comprising:

the wafer fixing position is arranged on the machine main body, a circle of collecting groove is arranged on the machine main body around the wafer fixing position, a pressing ring is arranged above the collecting groove, and the pressing ring shields a part of the collecting groove; and

and the blowing device and the chip sucker are positioned above the wafer fixing position.

In one embodiment, the machine body comprises a left ring and a right ring, and the collecting grooves are divided into left collecting grooves and right collecting grooves which are respectively arranged on the left ring and the right ring.

In an embodiment, a left pressing ring and a right pressing ring are respectively arranged above the left collecting tank and the right collecting tank.

In an embodiment, the left side ring and the right side ring are respectively provided with a left pressing plate and a right pressing plate, and the left pressing plate and the right pressing plate correspond to the wafer fixing position.

In one embodiment, the left side ring and the right side ring are located at one end of the left pressing plate and one end of the right pressing plate, and are provided with edge steps.

In one embodiment, the air blowing device has an air flow direction toward the collecting tank.

In one embodiment, the suction direction of the chip chuck faces the wafer fixing position.

Compared with the prior art, the beneficial effects of the utility model reside in that: utilize the machine main part to be equipped with the round collecting vat around the fixed position of wafer, gas blowing device can blow the material such as silicon crystal bits, dust to the collecting vat, realize the collection of silicon crystal bits, the dust, the clamping ring can realize silicon crystal bits, the dust does not spill over, better storage effect has, silicon crystal bits, the difficult scheduling problem of dust disposal have been solved, this application can not only high-efficient collection handle silicon crystal bits, the dust, simultaneously because this application can adopt split type structure installation combination, therefore this scheme can conveniently dismantle installation and cleanness.

The invention is further described with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a schematic structural view of an embodiment of a novel dust collector of the present invention;

fig. 2 is a schematic view of the structure of the left and right side rings of another embodiment of the novel dust collector of the present invention;

fig. 3 is a schematic view of the back side of the structure of fig. 2.

Reference numerals

101. Wafer holding station of machine body 102

103. Collecting groove 104 clamping ring

105. Blowing device 106 chip suction cup

107. Left press plate 108 right press plate

109. Edge step 1011 left side ring

1012. Right side ring 1031 left collecting groove

1032. Right collection tank 1041 left clamping ring

1042. Right pressing ring

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "secured" are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

As shown in fig. 1, the present application provides a novel dust collector, which includes a machine main body 101, wherein the machine main body 101 is provided with a wafer fixing position 102, the machine main body 101 is provided with a circle of collecting groove 103 around the wafer fixing position 102, a pressing ring 104 is arranged above the collecting groove 103, and the pressing ring 104 covers a part of the collecting groove 103; and a gas blowing device 105 and a chip suction cup 106 located above the wafer holding position 102. The air flow direction of the air blowing device 105 faces the collecting groove 103, the adsorption direction of the chip sucker 106 faces the wafer fixing position 102, wherein the air blowing device 105 can blow substances such as silicon crystal chips and dust to the collecting groove 103 from the surface of the wafer located at the wafer fixing position 102, collection of the silicon crystal chips and the dust is achieved, the pressing ring 104 can achieve that the silicon crystal chips and the dust do not overflow, a good storage effect is achieved, and the problems that silicon crystal chips and dust are difficult to treat are solved.

In one embodiment, as shown in fig. 2 and 3, the machine body includes a left ring 1011 and a right ring 1012, the collecting tank 103 is divided into a left collecting tank 1031 and a right collecting tank 1032 respectively disposed on the left ring 1011 and the right ring 1012, and a left pressing ring 1041 and a right pressing ring 1042 are respectively disposed above the left collecting tank 1031 and the right collecting tank 1032. The left side ring 1011, the right side ring 1012 are equipped with left clamp plate 107, right clamp plate 108 respectively, and left clamp plate 107, right clamp plate 108 correspond with wafer fixed position 102, and specifically, left side ring 1011, right side ring 1012 are located the one end of left clamp plate 107, right clamp plate 108, all are equipped with marginal step 109, and wherein, marginal step 109 mutually supports with left clamp plate 107, right clamp plate 108, pins the wafer, do not take place position shift in the realization course of working, keep the accuracy of processing.

To sum up, utilize the machine main part to be equipped with the round collecting vat around the fixed position of wafer, gas blowing device can blow material such as silicon crystal bits, dust to the collecting vat, realize the collection of silicon crystal bits, dust, the clamping ring can realize that silicon crystal bits, dust do not spill over, better storage effect has, silicon crystal bits, dust disposal difficulty scheduling problem have been solved, this application can not only high-efficient collection handle silicon crystal bits, dust, simultaneously because this application can adopt split type structure installation combination, therefore this scheme can convenient dismantlement installation and cleanness.

Various other modifications and changes may occur to those skilled in the art from the foregoing description and the accompanying drawings, and all such modifications and changes are intended to fall within the scope of the appended claims.

Claims

1. A novel dust collector, comprising:

the wafer fixing position is arranged on the machine main body, a circle of collecting groove is arranged around the wafer fixing position on the machine main body, a pressing ring is arranged above the collecting groove, and part of the collecting groove is shielded by the pressing ring; and

the blowing device and the chip sucker are positioned above the wafer fixing position;

the machine main body comprises a left side ring and a right side ring, the collecting grooves are divided into a left collecting groove and a right collecting groove which are respectively arranged on the left side ring and the right side ring, a left pressing ring and a right pressing ring are respectively arranged above the left collecting groove and the right collecting groove, a left pressing plate and a right pressing plate are respectively arranged on the left side ring and the right side ring, the left pressing plate and the right pressing plate correspond to the fixed positions of the wafers, and the left side ring and the right side ring are located at one ends of the left pressing plate and the right pressing plate and are respectively provided with an edge step.

2. The dust collector of claim 1, wherein the air blowing means has an air flow direction toward the collecting tank.

3. The dust collector of claim 1, wherein the suction direction of the chip suction cup is oriented toward the wafer holding position.