CN213366545U

CN213366545U - Wafer conveying box

Info

Publication number: CN213366545U
Application number: CN202021833927.0U
Authority: CN
Inventors: 肖燕霞
Original assignee: Individual
Current assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2021-06-04
Anticipated expiration: 2030-08-27

Abstract

The utility model discloses a wafer conveying box, its structure includes the box, the handle, the case lid, the sealing ring, place the box, the loading board, the draw-in groove, the handle is integrated structure with the box, and the case lid loose-leaf is connected in the box, and the sealing ring inlays solid and connects in the case lid below, places box welded connection in case lid, loading board welded connection in box, draw-in groove screw fixation in box front end, handle activity block in box front end, the utility model discloses an to the improvement of wafer conveying box structure, change into vertical depositing and press from both sides tight support wafer through the apron with the storage mode of wafer, the area of contact such as maximum reduction wafer and whereabouts dust, when taking out the wafer, through the clamping device, can directly take off the wafer to place the wafer in work platform, avoid contacting the wafer surface such as finger and lead to the wafer to receive the pollution.

Description

Wafer conveying box

Technical Field

The utility model relates to a wafer photoetching development equipment field, specific be a wafer transfer box.

Background

Wafer box mainly plays the effect of placing and carrying the wafer in semiconductor production, in order to simplify the transportation and reduce contaminated risk as far as possible, and wafer box that uses on the market all is flat placing in the mode of depositing to the wafer at present, and the finger touches the wafer surface easily when the access to wafer, causes the pollution to the wafer surface easily, and because the wafer of keeping flat for area of contact greatly increased such as wafer and the dust of whereabouts, make the wafer surface remain dust easily etc. influence follow-up technology.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a wafer conveying box.

In order to achieve the above purpose, the present invention is realized by the following technical solution: a wafer conveying box structurally comprises a box body, a lifting handle, a box cover, a sealing ring, a placing box, a bearing plate, a clamping groove and a handle, wherein the lifting handle and the box body are in an integrated structure;

the anti-skid box is characterized in that a clamping device, anti-skid strips, a cover plate, a connecting device, a connecting plate, a connecting shaft and a placing groove are arranged in the placing box, the clamping device is movably matched with the connecting plate, the anti-skid strips are connected above the cover plate in an adhering mode, the connecting device is movably matched with the connecting shaft in a welding mode, the connecting plate is connected above the connecting shaft in a welding mode, and the placing groove is movably matched with the connecting plate.

Furthermore, the clamping device comprises a sliding rod, a pull ring, a rubber ball, a clamping groove and a spring, the sliding rod and the clamping device are of an integrated structure, the pull ring is connected to the rear of the clamping device in a welded mode, the rubber ball is movably matched with the clamping groove, and the spring is movably matched with the rubber ball.

Furthermore, the connecting device is composed of a clamping ring, a fixing plate and a clamping spring, the fixing plate is movably matched with the clamping spring, and the clamping spring is connected inside the clamping ring in a welding mode.

Furthermore, the sealing ring is made of rubber, and a plurality of anti-slip lines are arranged on the surface of the anti-slip strip and made of rubber.

Advantageous effects

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses an to the improvement of wafer transfer box structure, change into vertical depositing and press from both sides tight support wafer through the apron with the mode of depositing of wafer, the area of contact such as at the biggest reduction wafer and whereabouts dust, when taking out the wafer, through the clamping device, can directly take off the wafer to place the wafer in work platform, avoid contacting the wafer surface such as finger and lead to the wafer to receive the pollution.

Drawings

Fig. 1 is a schematic structural view of a wafer transfer box according to the present invention.

Fig. 2 is the schematic view of the sectional structure of the placing box of the present invention.

Fig. 3 is a front view of the clamping device of the present invention.

Fig. 4 is a schematic sectional view of the connecting device of the present invention.

In the figure: the box comprises a box body-1, a handle-2, a box cover-3, a sealing ring-4, a placing box-5, a bearing plate-6, a clamping groove-7, a handle-8, a clamping device-51, an anti-slip strip-52, a cover plate-53, a connecting device-54, a connecting plate-55, a connecting shaft-56, a placing groove-57, a sliding rod-511, a pull ring-512, a rubber ball-513, a clamping groove-514, a spring-515, a snap ring-541, a fixing plate-542 and a clamping spring-543.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some embodiments, not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Examples

As shown in fig. 1-4, the utility model provides a wafer conveying box, its structure includes box 1, handle 2, case lid 3, sealing ring 4, placing box 5, loading board 6, draw-in groove 7, handle 8, handle 2 and box 1 are integrated structure, case lid 3 loose-leaf connection is in box 1, sealing ring 4 is embedded and connected below case lid 3, placing box 5 is welded and connected in case lid 3, loading board 6 is welded and connected in box 1, draw-in groove 7 is fixed in the front end of box 1 with screw, handle 8 activity block is in the front end of box 1; the placing box 5 is internally provided with a clamping device 51, an anti-slip strip 52, a cover plate 53, a connecting device 54, a connecting plate 55, a connecting shaft 56 and a placing groove 57, the clamping device 51 is movably matched with the connecting plate 55, the anti-slip strip 52 is connected above the cover plate 53 in an adhesion manner, the connecting device 54 is movably matched with the connecting shaft 56, the connecting plate 55 is connected above the connecting shaft 56 in a welding manner, the placing groove 57 is movably matched with the connecting plate 55, the clamping device 51 comprises a sliding rod 511, a pull ring 512, a rubber ball 513, a clamping groove 514 and a spring 515, the sliding rod 511 and the clamping device 51 are of an integrated structure, the pull ring 512 is connected behind the clamping device 51 in a welding manner, the rubber ball 513 is movably matched with the clamping groove 514, the spring 515 and the rubber ball 513 are movably matched, the connecting device 54 comprises a snap ring 541, a, fixed plate 542 and chucking spring 543 have a clearance fit, chucking spring 543 welded connection is inside snap ring 541, sealing ring 4 is the rubber material, antislip strip 52 surface is equipped with many anti-skidding lines, and its material is the rubber material.

The working principle of the present invention is explained as follows:

the utility model discloses a place the box 5 in the inside of case lid 3, place the slot 57 in placing the box 5 and make the wafer can directly put into the slot 57 for vertical depositing, can clamp the wafer in the supporting operation through the apron 53, avoid the problem that the wafer can't be fixed when placing vertically, through the contact of antislip strip 52 on the apron 53 to the wafer, can completely limit the activity of wafer, make the wafer can't be displaced when transporting, and because antislip strip 52 is the rubber material, when avoiding the wafer to place, fish tail the wafer surface, when placing a plurality of wafers, can open the apron 53 and make the space grow, and through the cooperation of connecting device 54 and connecting axle 56, can limit the connecting axle 56 through chucking spring 543 and fixed plate 542, avoid the apron 53 to slide and thus can't clamp the wafer, when the wafer is assembled in place the slot 57, can be assembled in clamping device 51 simultaneously, the spring 515 arranged in the clamping device 51 can push the rubber ball 513 to clamp the wafer, when the wafer is taken out, the clamping device 51 is driven by pulling the pull ring 512, so that the wafer is driven, and therefore the wafer is taken out.

In the embodiments, the technical features may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a wafer conveying box, its structure includes box (1), handle (2), case lid (3), sealing ring (4), places box (5), loading board (6), draw-in groove (7), handle (8), its characterized in that: the lifting handle (2) and the box body (1) are of an integrated structure, the box cover (3) is connected to the box body (1) in a loose-leaf mode, the sealing ring (4) is fixedly embedded below the box cover (3), the placing box (5) is connected to the box cover (3) in a welded mode, the bearing plate (6) is connected to the box body (1) in a welded mode, the clamping groove (7) is fixed to the front end of the box body (1) through screws, and the handle (8) is movably clamped to the front end of the box body (1);

the anti-skidding device is characterized in that a clamping device (51), anti-skidding strips (52), a cover plate (53), a connecting device (54), a connecting plate (55), a connecting shaft (56) and a placing groove (57) are arranged inside the placing box (5), the clamping device (51) is movably matched with the connecting plate (55), the anti-skidding strips (52) are connected above the cover plate (53) in an adhering mode, the connecting device (54) is movably matched with the connecting shaft (56), the connecting plate (55) is connected above the connecting shaft (56) in a welding mode, and the placing groove (57) is movably matched with the connecting plate (55).

2. A wafer pod as claimed in claim 1, wherein: clamping device (51) comprises slide bar (511), pull ring (512), rubber ball (513), clamping groove (514), spring (515), slide bar (511) and clamping device (51) are integrated structure, pull ring (512) welded connection is in clamping device (51) rear, rubber ball (513) clearance fit in clamping groove (514), spring (515) and rubber ball (513) have clearance fit.

3. A wafer pod as claimed in claim 1, wherein: the connecting device (54) comprises a clamping ring (541), a fixing plate (542) and a clamping spring (543), the fixing plate (542) and the clamping spring (543) are movably matched, and the clamping spring (543) is connected inside the clamping ring (541) in a welding mode.

4. A wafer pod as claimed in claim 1, wherein: the sealing ring (4) is made of rubber, and a plurality of anti-slip lines are arranged on the surface of the anti-slip strip (52) and made of rubber.