CN218533573U - Chip adsorption tool - Google Patents
Chip adsorption tool Download PDFInfo
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- CN218533573U CN218533573U CN202223141555.7U CN202223141555U CN218533573U CN 218533573 U CN218533573 U CN 218533573U CN 202223141555 U CN202223141555 U CN 202223141555U CN 218533573 U CN218533573 U CN 218533573U
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- adsorption
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Abstract
The utility model discloses a chip adsorbs frock, including mount pad and adsorption apparatus structure, the mount pad can be installed on the lathe, and adsorption apparatus constructs to set up on the mount pad, is provided with a plurality of absorption holes that are used for adsorbing the chip in the adsorption apparatus structure to carry out the multiple spot to the chip and adsorb. When carrying out the attenuate to the chip, at first need install the mount pad on the lathe, adsorb the chip on adsorption apparatus constructs the back, the operation of attenuate begins again, compare with prior art, because be provided with a plurality of absorption holes that are used for adsorbing the chip on the adsorption apparatus structure that above-mentioned chip adsorbs the frock discloses, consequently, above-mentioned adsorption apparatus can form the multiple spot to adsorb the chip, so set up, the phenomenon that the suction too big leads to destroying the inner structure of chip appears when can not appear because single-point adsorbs, so set up, not only can promote the adsorbed homogeneity to the chip, still can promote the quality of turning greatly.
Description
Technical Field
The utility model relates to a frock adsorbs technical field, in particular to chip adsorbs frock.
Background
When carrying out chip substrate back attenuate, generally need adsorb the chip and fix the back, carry out the turning attenuate to it again, the absorption fixing device who is used for fixed chip at present generally adsorbs for single gas vent, it adsorbs fixedly to set up the center of a great gas vent to the chip promptly, but above-mentioned absorption fixing device adsorbs some position of chip only, so make the chip absorbed the position atress great, and other positions do not receive the power, thereby lead to the chip atress uneven, and then influence the inner structure and the turning quality of chip.
Therefore, how to provide a chip adsorption tool, the uniformity of chip adsorption can be improved, and the technical problem that the technical staff in the field need to solve is effectively improved in turning quality.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a frock is adsorbed to chip can promote the adsorbed homogeneity to the chip to effectively promote the turning quality.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a chip adsorbs frock, includes mount pad and adsorption apparatus structure, the mount pad can be installed on the lathe, adsorption apparatus structure set up in on the mount pad, be provided with a plurality of absorption holes that are used for adsorbing the chip in the adsorption apparatus structure, in order to right the chip carries out the multiple spot and adsorbs.
Preferably, the mounting seat comprises a circular base plate and a side plate arranged along the circumferential direction of the base plate, and the base plate is vertically connected with the side plate.
Preferably, the adsorption mechanism comprises a vent pipe and a sucker, the adsorption hole is formed in the sucker, one end of the vent pipe is connected with the chassis, and the other end of the vent pipe is communicated with the adsorption hole.
Preferably, the adsorption mechanism further comprises a back groove, the back groove is formed in the chassis, and the vent pipe is communicated with vacuum equipment arranged on the lower end face of the chassis through the back groove.
Preferably, the suction cup is a rectangular structure, and the suction cup includes:
a suction cup body;
the first edge and the second edge are respectively arranged on two sides of the sucker body oppositely and parallelly;
the third edge and the fourth edge are respectively oppositely and parallelly arranged on two sides of the sucker body;
the sucker body comprises a first groove and a second groove which are arranged on the upper end face of the sucker body, two ends of the first groove are intersected with the first edge and the second edge respectively, two ends of the second groove are intersected with the second edge and the fourth edge respectively, and the first groove is intersected with the second groove.
Preferably, the adsorption hole includes a central hole and an edge hole, the central hole is disposed at a first position where the first groove and the second groove intersect, and the edge through hole is respectively disposed at a second position where the first groove and the first edge intersect, and/or a third position where the first groove and the second edge intersect, and/or a fourth position where the second groove and the third edge intersect, and/or a fifth position where the second groove and the fourth edge intersect.
Preferably, the first groove is parallel to the first edge, the second groove is parallel to the third edge, and the first groove and the second groove are arranged perpendicularly.
Preferably, at least one groove is provided in each of the first groove and the second groove.
Preferably, the width of each of the first groove and the second groove is set to be 1mm-2mm, and the height of each of the first groove and the second groove is set to be 0.5mm-1.5mm;
the adsorption holes are round holes, and the diameter of each adsorption hole is 0.3mm-0.8mm.
Preferably, the mounting seat is made of optical aluminum, the diameter of the base plate is 90mm-110m, the thickness of the base plate is 15mm-25mm, the TTV of the base plate is less than 0.05 μm, and the RMS of the base plate is less than 0.01 μm.
According to the technical scheme, when carrying out the attenuate to the chip, at first need install the mount pad on the lathe, adsorb the chip in adsorption apparatus structure back, the attenuate operation begins again, compares with prior art, because the utility model discloses the last a plurality of absorption holes that are used for adsorbing the chip that are provided with of adsorption apparatus structure disclosed, consequently, above-mentioned absorption frock can form the multiple spot to adsorb the chip, so sets up, and the phenomenon that leads to destroying the inner structure of chip too big when suction appears when can not appearing because the single-point adsorbs, so sets up, not only can promote the absorptive homogeneity of chip, still can promote the quality of turning greatly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art are briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural view of a chip adsorption tool disclosed in an embodiment of the present invention;
fig. 2 is a schematic structural view of an adsorption mechanism disclosed in an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2;
fig. 4 is a schematic top view of the chip adsorption tool disclosed in the embodiment of the present invention;
FIG. 5 isbase:Sub>A schematic cross-sectional view taken along A-A of FIG. 4;
fig. 6 is a schematic bottom view of the chip adsorption tool according to the embodiment of the present invention.
Wherein, each part name is as follows:
100-a mounting seat; 101-a chassis; 102-a side plate; 200-an adsorption mechanism; 201-a breather pipe; 202-a sucker; 2021-sucker body; 2022-first side; 2023-second edge; 2024-third side; 2025-fourth side; 2026-first trench; 2027-a second trench; 2028-adsorption wells; 203-back groove.
Detailed Description
In view of this, the utility model discloses a core lies in providing a chip adsorbs frock, can promote the adsorbed homogeneity to the chip to effectively promote the turning quality.
For a better understanding of the present invention, reference is made to the accompanying drawings and detailed description below, which are referred to in fig. 1 to 6, for a better understanding of the present invention.
The embodiment of the utility model discloses chip adsorbs frock, including mount pad 100 and adsorption apparatus structure 200, mount pad 100 can be installed on the lathe, and adsorption apparatus structure 200 sets up on mount pad 100, is provided with a plurality of absorption holes 2028 that are used for adsorbing the chip on the adsorption apparatus structure 200 to carry out the multiple spot to the chip and adsorb.
When carrying out the attenuate to the chip, at first need install mount pad 100 on the lathe, adsorb the chip on adsorption apparatus structure 200 back, begin again to carry out the attenuate operation, compare with prior art, because the utility model discloses be provided with a plurality of absorption holes 2028 that are used for adsorbing the chip on the adsorption apparatus structure 200 disclosed, consequently, the aforesaid adsorbs the frock can form the multiple spot to the chip and adsorb, so sets up, and the phenomenon that the suction too big leads to destroying the inner structure of chip when can not appear because single-point adsorbs not appearing, so sets up, not only can promote the absorptive homogeneity of chip, still can promote the quality of turning greatly.
The embodiment of the utility model provides a structure to mount pad 100 is not injectd, as long as satisfy the utility model discloses operation requirement's structure is all within the protection scope.
As a preferred embodiment, the disclosed mounting seat 100 includes a circular bottom plate 101 and a side plate 102 disposed along the circumference of the bottom plate 101, wherein the bottom plate 101 is vertically connected to the side plate 102.
Of course, the chassis 101 may be a rectangular structure or other structures, and those skilled in the art can select the structure according to the actual situation.
The embodiment of the utility model provides a concrete structure to adsorption mechanism 200 does not prescribe a limit to, as long as satisfy the utility model discloses operation requirement's structure is all within the protection scope of the utility model.
As a preferred embodiment, the adsorption mechanism 200 disclosed in the embodiment of the present invention includes a vent pipe 201 and a suction cup 202, wherein the adsorption hole 2028 is disposed on the suction cup 202, one end of the vent pipe 201 is connected to the chassis 101, and the other end of the vent pipe 201 is connected to the adsorption hole 2028.
It should be noted that the adsorption mechanism 200 further includes a back groove 203, wherein the back groove 203 is disposed on the chassis 101, and the vent pipe 201 is communicated with a vacuum device disposed on the lower end surface of the chassis 101 through the back groove 203.
When the vacuum device is turned on, the vacuum device sucks the chip onto the suction cup 202 through the snorkel 201 and the suction hole 2028.
The embodiment of the utility model provides a concrete structure to suction disc 202 does not prescribe a limit to, as long as satisfy the utility model discloses operation requirement's structure is all within the protection scope of the utility model.
As a preferred embodiment, the suction cup 202 disclosed in the embodiment of the present invention has a rectangular structure, wherein the suction cup 202 specifically includes a suction cup body 2021; a first side 2022 and a second side 2023 which are respectively arranged on two sides of the sucker body 2021 oppositely and parallelly; a third edge 2024 and a fourth edge 2025 which are respectively arranged on two sides of the suction cup body 2021 oppositely and parallelly; the first groove 2026 and the second groove 2027 are disposed on the upper end surface of the chuck body 2021, two ends of the first groove 2026 intersect with the first edge 2022 and the second edge 2023, two ends of the second groove 2027 intersect with the second edge 2023 and the fourth edge 2025, and the first groove 2026 intersects with the second groove 2027.
The adsorption hole 2028 includes a central hole and an edge hole, the central hole is disposed at a first position where the first groove 2026 and the second groove 2027 intersect, and the edge through holes are respectively disposed at a second position where the first groove 2026 and the first edge 2022 intersect, and/or a third position where the first groove 2026 and the second edge 2023 intersect, and/or a fourth position where the second groove 2027 and the third edge 2024 intersect, and/or a fifth position where the second groove 2027 and the fourth edge 2025 intersect.
So set up, can set up a plurality of absorption holes 2028 in the different positions of sucking disc body 2021, a plurality of absorption holes 2028's setting can form the multiple spot to the chip and adsorb, and then further promoted the absorptive homogeneity of chip.
It should be noted that the first groove 2026 may be parallel to the first side 2022 of the suction cup body 2021, or may not be parallel to the first side 2022 of the suction cup 202, and the second groove 2027 may be parallel to the third side 2024 of the suction cup body 2021, or may not be parallel to the third side 2024 of the suction cup body 2021.
As a preferred embodiment, the first groove 2026 disclosed in the embodiment of the present invention is parallel to the first edge 2022 of the suction cup body 2021, the second groove 2027 is parallel to the third edge 2024 of the suction cup body 2021, and the first groove 2026 and the second groove 2027 are disposed perpendicularly. With this arrangement, the suction holes 2028 can be uniformly arranged on the upper end surface of the chip.
Of course, the embodiment of the present invention does not limit the number of the first groove 2026 and the second groove 2027, and the structure that meets the requirement of the present invention is within the protection scope of the present invention.
As a preferred embodiment, at least one of the first groove 2026 and the second groove 2027 is provided.
When one groove is formed in each of the first groove 2026 and the second groove 2027, the upper end surface of the entire suction cup 202 forms a "tian" -shaped structure.
The embodiment of the present invention does not limit the specific setting parameters of the first groove 2026 and the second groove 2027, as long as it satisfies the utility model discloses the structure that uses requirement is all within the protection scope of the present invention.
The width of the first groove 2026 and the width of the second groove 2027 are both set to be 1mm-2mm, and the height thereof is set to be 0.5mm-1.5mm.
The adsorption holes 2028 are circular holes, and the diameter of the adsorption holes 2028 is preferably 0.3mm to 0.8mm.
It should be further noted that the mounting seat 100 is made of optical aluminum, the diameter of the bottom plate 101 is preferably 90mm-110mm, the thickness of the bottom plate 101 is 15mm-25mm, the TTV of the bottom plate 101 is less than 0.05 μm, and the RMS of the bottom plate 101 is less than 0.01 μm.
It should be explained that TTV is the difference between the maximum and minimum thickness in the thickness measurements and RMS is the surface finish.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a chip adsorbs frock, its characterized in that includes mount pad and adsorption apparatus structure, the mount pad can be installed on the lathe, adsorption apparatus constructs set up in on the mount pad, adsorption apparatus constructs and is provided with a plurality of absorption holes that are used for adsorbing the chip, in order to right the chip carries out the multiple spot and adsorbs.
2. The chip adsorption tool according to claim 1, wherein the mounting seat comprises a circular base plate and a side plate arranged along the circumferential direction of the base plate, and the base plate is vertically connected with the side plate.
3. The chip adsorption tool according to claim 2, wherein the adsorption mechanism comprises a vent pipe and a suction cup, the adsorption hole is formed in the suction cup, one end of the vent pipe is connected with the base plate, and the other end of the vent pipe is communicated with the adsorption hole.
4. The chip adsorption tooling of claim 3, wherein the adsorption mechanism further comprises a back groove, the back groove is arranged on the base plate, and the vent pipe is communicated with a vacuum device arranged on the lower end surface of the base plate through the back groove.
5. The chip adsorbs frock of claim 3, wherein the sucking disc is the rectangle column structure, the sucking disc includes:
a suction cup body;
the first edge and the second edge are respectively arranged on two sides of the sucker body oppositely and parallelly;
the third edge and the fourth edge are respectively oppositely and parallelly arranged on two sides of the sucker body;
the sucker body comprises a first groove and a second groove which are arranged on the upper end face of the sucker body, two ends of the first groove are intersected with the first edge and the second edge respectively, two ends of the second groove are intersected with the second edge and the fourth edge respectively, and the first groove is intersected with the second groove.
6. The chip adsorption tool according to claim 5, wherein the adsorption hole comprises a central hole and edge holes, the central hole is arranged at a first position where the first groove and the second groove intersect, and the edge through holes are respectively arranged at a second position where the first groove and the first edge intersect, and/or a third position where the first groove and the second edge intersect, and/or a fourth position where the second groove and the third edge intersect, and/or a fifth position where the second groove and the fourth edge intersect.
7. The chip adsorption tooling of claim 5, wherein the first groove is parallel to the first edge, the second groove is parallel to the third edge, and the first groove is perpendicular to the second groove.
8. The chip adsorption tool of claim 5, wherein at least one of the first groove and the second groove is provided.
9. The chip adsorption tool according to claim 5, wherein the first groove and the second groove are both 1mm-2mm wide and 0.5mm-1.5mm high;
the adsorption holes are round holes, and the diameter of each adsorption hole is 0.3mm-0.8mm.
10. The chip adsorption tool according to claim 2, wherein the mounting seat is made of optical aluminum, the diameter of the base plate is 90mm-110m, the thickness of the base plate is 15mm-25mm, the TTV of the base plate is less than 0.05 μm, and the RMS of the base plate is less than 0.01 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223141555.7U CN218533573U (en) | 2022-11-25 | 2022-11-25 | Chip adsorption tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223141555.7U CN218533573U (en) | 2022-11-25 | 2022-11-25 | Chip adsorption tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218533573U true CN218533573U (en) | 2023-02-28 |
Family
ID=85265761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223141555.7U Active CN218533573U (en) | 2022-11-25 | 2022-11-25 | Chip adsorption tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218533573U (en) |
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2022
- 2022-11-25 CN CN202223141555.7U patent/CN218533573U/en active Active
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