CN206733378U

CN206733378U - Wafer adsorption carrying disc

Info

Publication number: CN206733378U
Application number: CN201720396061.3U
Authority: CN
Inventors: 马英腾; 谢启祥; 施英汝
Original assignee: GlobalWafers Co Ltd
Current assignee: GlobalWafers Co Ltd
Priority date: 2016-08-25
Filing date: 2017-04-14
Publication date: 2017-12-12
Anticipated expiration: 2027-04-14
Also published as: TWM535874U

Abstract

The utility model provides a wafer adsorbs and carries dish for adsorb the wafer, the wafer adsorbs and carries the dish and contains: the tray body comprises a bottom surface and a top surface which are opposite, a surrounding surface which extends from the periphery of the bottom surface to the periphery of the top surface, and a groove which is formed on one side of the surrounding surface and extends to the top surface so as to form a notch on the top surface; and a plurality of suction holes penetrating through the bottom surface and the top surface of the tray body. The utility model discloses at least, have following advantage: the grooves of the tray body can be used for overflowing viscose to flow in, so that the viscose is prevented from leaking between the wafer and the tray body and blocking the suction holes of the tray body to cause the reduction of the adsorption force, and the wafer is prevented from shaking and cracking due to insufficient adsorption force.

Description

Wafer adsorption load plate

Technical field

The utility model relates to a kind of device for manufacture of semiconductor, particularly relates to a kind of for adsorbing wafer Wafer adsorption load plate.

Background technology

The electronic installation such as intelligent mobile phone designs towards compact direction now, above-mentioned in order to adapt to this trend Chip also the more is made the more thin used in electronic installation.Wafer obtained by after crystal bar is cut is carried out accurate cutting again The thinner wafer of two panels can be obtained, to meet thinness demanding criteria of the current industry for wafer.

Wafer must be firmly secured to when carrying out accurate cutting to wafer on a platform, in order to avoid during cutting Wafer causes to rupture because of rocking.During wafer cutting is carried out, in order to avoid unadsorbed another on sucker Wafer drops rupture, so wafer can be typically fixed on a support member with viscose in wafer side.However, wafer side Viscose often leaks out between wafer and platform and causes platform can not firmly fix wafer, and then causes wafer because shaking Move and rupture.

Utility model content

Therefore, the purpose of this utility model is, there is provided one kind is avoided that by viscose during wafer accurate cutting Influence the wafer adsorption load plate of absorption affinity.

Therefore, the utility model wafer adsorption load plate in certain embodiments, sticks suitable for adsorbing a wafer, and with unification The support member use in the part-skirt of the wafer, the wafer adsorption load plate includes a disk body and multiple suckers.Institute Stating disk body includes an opposite bottom surface and a top surface, a periphery from the bottom surface and extends to the periphery of the top surface surrounding Face, and a depression are formed in the groove around face side.The groove extends to the top surface to be formed in the top surface One breach, the top surface is placed for the wafer, and the breach of the groove is covered by the wafer and makes the portion of wafer Divide lateral margin adjacent to the groove.The sucker is through the bottom surface of disk body and the top surface.

In certain embodiments, the section of the groove of the disk body is semicircle.

In certain embodiments, also comprising one radially protruded out from the bottom surface of the disk body chassis, one through described Disk body and first locking hole on the chassis, and multiple the second locking holes through the chassis, the sucker run through the disk The groove of body and the chassis and the disk body is to extend to the chassis from the top surface.

In certain embodiments, the disk body and the chassis roughly circular.

In certain embodiments, the disk body is also formed at described around face and respectively from the both sides of the groove including two The oppositely extending flat mouth portion of edge, the part-skirt of wafer protrude the flat mouth portion.

In certain embodiments, the sectional area of the groove accounts for the 4% to 6% of the disk body gross area.

In certain embodiments, the which part sucker in the sucker adjacent to the groove and using the ditch groove center as Benchmark is into annular arrangement at equal intervals.

The utility model at least has advantages below：The viscose that the groove of the disk body is available for overflowing flows into, to avoid sticking Glue leaks out between wafer and the disk body and blocks the sucker of disk body and cause absorption affinity to decline, with prevent wafer because Absorption affinity deficiency causes to rock and rupture.

Brief description of the drawings

The utility model others feature and advantage, will clearly it be presented in the embodiment with reference to schema, wherein：

Fig. 1 is a top view of an embodiment of the utility model wafer adsorption load plate；

Fig. 2 is the side view diagram of the embodiment；

Fig. 3 is top view, illustrates the state when embodiment adsorbs a wafer.

Symbol description

1st, disk body；

11st, bottom surface；

12nd, top surface；

13rd, around face；

14th, groove；

141st, breach；

15th, flat mouth portion；

2nd, chassis；

3rd, sucker；

4th, the first locking hole；

5th, the second locking hole；

8th, wafer；

9th, support member；

91st, cambered surface.

Embodiment

Refering to Fig. 1 and Fig. 2, for an embodiment of the utility model wafer adsorption load plate, the wafer adsorption load plate is applicable A wafer 8 is adsorbed in a manner of by vacuum suction in connecting an air extractor (not shown) (see Fig. 3).The wafer adsorption load plate The chassis 2 of the disk body 1 is connected comprising a disk body 1, one, multiple is run through through the disk body 1 and the sucker 3, one on the chassis 2 The disk body 1 and first locking hole 4 on the chassis 2, and three the second locking holes 5 for running through the chassis 2.The disk body 1 roughly circular and extend to the top surface from the periphery of the bottom surface 11 including an opposite bottom surface 11 and a top surface 12, one 12 periphery is formed in the groove 14 around the side in face 13 around the depression of face 13, one, and two be formed at described in The flat mouth portion 15 oppositely extending from the both side edges of the groove 14 around face 13 and respectively.The cross sectional shape of the groove 14 is half It is circular and extend to the top surface 12 to form a breach 141 in the top surface 12.The chassis 2 connects the bottom of the disk body 1 Face 11 and radially protruded out from the bottom surface 11, and the groove 14 of the disk body 1 be extended to from the top surface 12 it is described Chassis 2, the sucker 3 is through the disk body 1 and the chassis 2.

Refering to Fig. 3, the wafer adsorption load plate can be locked by first locking hole 4 and second locking hole 5 In the air extractor, the air extractor can pass through side of the sucker 3 from the top surface 12 of disk body 1 to the bottom surface 11 To being evacuated, the wafer 8 is adsorbed in the top surface 12 of the disk body 1.When 8 thickness to be carried out of wafer cuts open half essence Closely when cutting, part-skirt in the wafer 8 need to be sticked together by a support member 9 in order to avoid the unadsorbed top surface in the disk body 1 12 wafer 8 drops rupture.The support member 9 of the present embodiment is a graphite bar with cambered surface 91, and by the support The mode of painting viscose sticks the support member 9 part-skirt in the wafer 8 in the cambered surface 91 of part 9.The wafer 8 is adsorbed in During the top surface 12 of the disk body 1, the breach 141 of the groove 14 of the disk body 1 is covered by the wafer 8 and the wafer 8 is glutinous has The part-skirt of the support member 9 is adjacent to the groove 14.Can be from shape when the viscose in the cambered surface 91 of the support member 9 overflows The groove 14 of the disk body 1 is flowed into the breach 141 in the top surface 12 of disk body 1, can without leaking out on the disk body 1 Viscose is avoided to block the sucker 3 and influence the absorption affinity of the air extractor.In the present embodiment, the groove of the disk body 1 14 sectional area is preferably the 4% to 6% of the gross area of top surface 12 for occupying the disk body 1, has been easier to less than this number range Viscose leaks out to the situation (that is, producing excessive glue phenomenon) of the disk body 1；More than this number range then the wafer 8 contact it is described The area of disk body 1 is smaller and the wafer 8 can not be adsorbed in well on the wafer adsorption load plate.In addition, disk body 1 is flat Oral area 15 can coordinate the wafer 8 by lateral margin grinding to use, and wherein three suckers of multiple suckers 3 of the present embodiment are neighbouring The groove 14 of the disk body 1 and with the center of the groove 14 as benchmark into annular arrangement at equal intervals, to strengthen the disk Absorption affinity of the body 1 at the groove 14.

In summary, the utility model wafer adsorption load plate, the viscose that the groove 14 of disk body 1 is available for overflowing are flowed into avoid Viscose leaks out to disk body 1 and blocks the sucker 3 of disk body 1 and cause absorption affinity to decline, and can prevent wafer 8 because absorption affinity deficiency Cause to rock and rupture, therefore the purpose of this utility model can be reached really.

Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art Art personnel, on the premise of the utility model principle is not departed from, some improvements and modifications can also be made, these improvements and modifications Also it should be regarded as the scope of protection of the utility model.

Claims

1. a kind of wafer adsorption load plate, it is characterised in that include：

One disk body, including an opposite bottom surface and a top surface, a periphery from the bottom surface extend to the periphery of the top surface Formed around face, and a depression and extend to the top surface in the groove around face side, the groove with the top surface Form a breach；And

Multiple suckers, through the bottom surface of disk body and the top surface.

2. wafer adsorption load plate according to claim 1, it is characterised in that the wafer adsorption load plate adsorbs a wafer When, the breach of the groove of the disk body is covered by the wafer and makes the part-skirt of the wafer adjacent to the groove.

3. wafer adsorption load plate according to claim 1, it is characterised in that the section of the groove of the disk body is semicircle Shape.

4. wafer adsorption load plate according to claim 1, it is characterised in that also comprising one from the bottom surface of the disk body radially The chassis that protrudes out outwardly, one are and multiple through the second of the chassis through the disk body and first locking hole on the chassis Locking hole, the sucker are to extend to the bottom from the top surface through the groove of the disk body and the chassis and the disk body Disk.

5. the wafer adsorption load plate according to Claims 1 to 4 any one, it is characterised in that the disk body and the bottom Disk is rounded.

6. wafer adsorption load plate according to claim 5, it is characterised in that the disk body is also formed at described enclose including two The flat mouth portion oppositely extending from the both side edges of the groove around face and respectively, the part-skirt of wafer protrude the flat mouth Portion.

7. wafer adsorption load plate according to claim 6, it is characterised in that it is total that the sectional area of the groove accounts for the disk body The 4% to 6% of area.

8. wafer adsorption load plate according to claim 7, it is characterised in that the which part sucker in the sucker is neighbouring The groove and on the basis of the ditch groove center into annular arrangement at equal intervals.