CN220065662U - Carrier plate and transfer assembly - Google Patents

Abstract

The utility model discloses a carrier plate and a transfer assembly, wherein one side of the carrier plate in the thickness direction is provided with a bearing area, the bearing area is used for placing a silicon wafer, the carrier plate is also provided with a first air inlet and a first air outlet which are communicated, and the first air outlet is arranged in the bearing area and is used for blowing air towards the silicon wafer so as to separate the silicon wafer from the carrier plate. The carrier plate provided by the embodiment of the utility model has the advantages of high adsorption safety, simplicity in adsorption and the like.

Description

Carrier plate and transfer assembly

Technical Field

The utility model relates to the technical field of photovoltaics, in particular to a carrier plate and a transfer assembly.

Background

In the manufacture of solar cells, the monocrystalline silicon wafer needs to be carried out multiple times, and as the monocrystalline silicon wafer has higher hardness and is thinner than 200 mu m, in the photovoltaic industry, the silicon wafer is usually placed on a carrier plate, then the silicon wafer is picked up by the vacuum adsorption force generated by a vacuum chuck, and the silicon wafer is placed by cutting off the vacuum adsorption force of the chuck, so that the carrying of the silicon wafer is realized.

In the related art, the suction distance between the vacuum chuck and the silicon wafer needs to be very tiny, so that the silicon wafer can be effectively sucked, but when the suction distance is smaller, the parallelism accuracy of the vacuum chuck cannot be ensured, and especially when a plurality of chucks are fixedly connected into a chuck group, the suction distance is smaller, and the vacuum chuck is easy to crush the silicon wafer; when the adsorption distance is set larger, the vacuum chuck cannot successfully absorb the silicon wafer, so that the adsorption is difficult.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, the embodiment of the utility model provides the carrier plate, so that the silicon wafer has the advantages of high adsorption safety, simplicity in adsorption and the like. The embodiment of the utility model provides a transfer assembly, which has the advantages of high silicon wafer adsorption safety, simple adsorption and the like.

The bearing area is arranged on one side of the bearing plate in the thickness direction of the bearing plate, the bearing area is used for placing a silicon wafer, the bearing plate is further provided with a first air inlet and a first air outlet which are communicated, and the first air outlet is arranged in the bearing area and is used for blowing air towards the silicon wafer so as to separate the silicon wafer from the bearing plate.

In some embodiments, the first air inlet is located on the same side of the carrier plate as the carrying region, and the first air inlet is located outside the carrying region.

In some embodiments, the carrier plate is further provided with a gas channel, and the first gas inlet and the first gas outlet are communicated through the gas channel.

In some embodiments, the carrier plate has an open slot, a portion of the open slot is disposed in the carrying area and forms the first air outlet, and another portion of the open slot is disposed outside the carrying area and forms the first air inlet.

In some embodiments, a diversion slope is disposed on the bottom wall of the open slot, and the diversion slope gradually inclines towards a direction approaching to the bottom wall of the open slot along a direction from the first air inlet to the first air outlet.

In some embodiments, the carrying areas have a plurality of carrying areas, and the plurality of carrying areas are arranged in a matrix.

In some embodiments, the carrier plate has a groove thereon, and the carrying area is disposed in the groove.

In some embodiments, a plurality of protrusions are arranged on the bottom wall of the groove at intervals, and the protrusions are used for supporting the silicon wafer.

The transfer assembly comprises a carrier plate and a sucker, wherein the carrier plate is provided with the carrier plate in any one of the embodiments; the sucking disc is provided with an adsorption part for adsorbing the silicon wafer, the sucking disc is also provided with a second air inlet and a second air outlet which are communicated, and when the adsorption part adsorbs the silicon wafer on the bearing area, the second air outlet is communicated with the first air inlet.

In the using process of the carrier plate, the silicon wafer is placed on the carrying area of the carrier plate, when the silicon wafer needs to be reloaded, the sucking disc is placed above the silicon wafer, and a certain safety distance is reserved between the sucking disc and the silicon wafer, so that the silicon wafer is prevented from being crushed due to the fact that the parallelism accuracy of the sucking disc cannot be guaranteed. Then with first air inlet and compressed air intercommunication, compressed air gets into and blows to the silicon chip from first gas outlet through first air inlet, and the silicon chip separates with the carrier plate and moves to the direction that is close to the sucking disc under compressed air's the blowing force to reduce the adsorption distance between silicon chip and the sucking disc, so that the sucking disc successfully absorbs the silicon chip, thereby makes the absorption to the silicon chip simple.

Therefore, the carrier plate provided by the embodiment of the utility model has the advantages of high adsorption safety, simplicity in adsorption and the like.

Drawings

FIG. 1 is a schematic diagram of a transfer assembly according to an embodiment of the present utility model.

Fig. 2 is a schematic structural view of a suction cup according to an embodiment of the present utility model.

Fig. 3 is a schematic structural diagram of a carrier board according to an embodiment of the utility model.

Fig. 4 is an enlarged view of a portion a in fig. 3.

Fig. 5 is a schematic structural diagram of a carrier according to another embodiment of the present utility model.

Fig. 6 is an enlarged view of a portion B in fig. 5.

Fig. 7 is a cross-sectional view of a carrier plate according to an embodiment of the present utility model.

Reference numerals:

a reversed loader assembly 1000; a carrier plate 100; suction cup 200; a silicon wafer 300;

a carrying area 1;

a first air inlet 2;

a first air outlet 3;

a gas passage 4;

an open slot 5;

a diversion inclined plane 6;

a groove 7;

a protrusion 8;

a suction cup 9; an adsorption unit 901; a second air inlet 902 and a second air outlet 903.

Detailed Description

Reference will now be made in detail to embodiments of the present utility model, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

As shown in fig. 1 to 7, the transfer module 1000 according to the embodiment of the present utility model includes a carrier plate 100 and a suction cup 200, wherein the suction cup 200 has an adsorption portion 901 for adsorbing a silicon wafer 300, and a plurality of suction nozzles are disposed on the adsorption portion 901.

The carrier 100 of the embodiment of the present utility model has a carrying area 1 on one side in the thickness direction thereof, and the carrying area 1 is used for placing the silicon wafer 300. The carrier plate 100 is further provided with a first air inlet 2 and a first air outlet 3 which are communicated, and the first air outlet 3 is arranged in the bearing area 1 and is used for blowing air towards the silicon wafer 300 so as to separate the silicon wafer 300 from the carrier plate 100.

Specifically, in the use process of the carrier plate 100 according to the embodiment of the present utility model, the silicon wafer 300 is placed on the carrying area 1 of the carrier plate 100, when the silicon wafer 300 needs to be reloaded, the suction cup 200 is placed above the silicon wafer 300, and a certain safety distance is provided between the suction cup 200 and the silicon wafer 300, so that the silicon wafer 300 is prevented from being crushed due to the fact that the accuracy of parallelism of the suction cup 200 cannot be ensured. Then, the first air inlet 2 is communicated with compressed air, the compressed air enters through the first air inlet 2 and is blown to the silicon wafer 300 from the first air outlet 3, and the silicon wafer 300 is separated from the carrier plate 100 under the blowing force of the compressed air and moves towards the direction close to the suction cup 200, so that the adsorption distance between the silicon wafer 300 and the suction cup 200 is shortened, the suction cup 200 can be used for successfully sucking the silicon wafer 300, and the silicon wafer 300 is adsorbed simply.

Therefore, the carrier 100 of the embodiment of the utility model has the advantages of high adsorption safety, simple adsorption and the like for the silicon wafer 300.

In addition, the silicon wafer 300 is blown up to the bottom of the sucker 200 by compressed air, on one hand, the suction distance between the silicon wafer 300 and the sucker 200 can be effectively increased, so that the requirement on the parallelism precision of the sucker 200 is reduced, and the production and the installation of parts of the sucker 200 are simpler and more convenient; on the other hand, it is also meant that a plurality of suction cups 200 may be formed into a suction cup group, so that the number of sheets taken by the suction cups 200 is effectively increased.

In some embodiments, the chuck 200 further has a second air inlet 902 and a second air outlet 903, which are connected, and when the adsorption portion 901 adsorbs the silicon wafer 300 on the carrier region 1, the second air outlet 903 is connected to the first air inlet 2.

For example, as shown in fig. 2, the second air inlet 902 is configured to communicate with compressed air, and the compressed air enters the second air inlet 902 and is discharged through the second air outlet 903. When the adsorption portion 901 corresponds to the bearing area 1 on the carrier plate 100 from top to bottom, the second air outlet 903 is correspondingly communicated with the first air inlet 2, and the compressed air discharged from the second air outlet 903 enters the first air inlet 2 and then is discharged through the first air outlet 3. Therefore, the second air outlet 903 is arranged on the sucker 200 to supply air to the first air inlet 2, so that the sucker 200 is convenient to be matched with the carrier plate 100.

In some embodiments, the first air inlet 2 and the carrying area 1 are located on the same side of the carrier 100, and the first air inlet 2 is located outside the carrying area 1.

For example, as shown in fig. 3 to 7, by locating the first air inlet 2 and the carrying area 1 on the same side of the carrier plate 100, that is, the suction portion 901 and the second air outlet 903 on the suction cup 200 are also disposed on the same side of the suction cup 200. When the sucking disc 200 adsorbs the silicon wafer 300, the position of the sucking disc 200 in the up-down direction is convenient to adjust, and the second air outlet 903 is convenient to communicate with the first air outlet 3 in an opposite way, so that the position of the sucking disc 200 is convenient to adjust.

Of course, in other embodiments, the first air inlet 2 may also be provided at a side of the carrier plate 100.

In some embodiments, the carrier plate 100 further has a gas channel 4 thereon, and the first gas inlet 2 and the first gas outlet 3 are communicated through the gas channel 4.

For example, as shown in fig. 5 to 7, the number of the first air outlets 3 may be plural, the plural first air outlets 3 are disposed in the bearing area 1 at intervals, and the plural first air outlets 3 are communicated with the first air inlet 2 through the air channel 4. The first air inlet 2 and the first air outlet 3 are communicated through the air channel 4, so that the communication tightness between the first air inlet 2 and the second air inlet 902 is improved, the compressed air is prevented from leaking outwards to influence the blowing force of the compressed air on the silicon wafer 300, and the working reliability is improved.

In other embodiments, the carrier 100 has an open slot 5, a portion of the open slot 5 is disposed in the carrying area 1 and forms the first air outlet 3, and another portion of the open slot 5 is disposed outside the carrying area 1 and forms the first air inlet 2.

For example, as shown in fig. 3 and 4, it can be understood that, because the processing of the open slot 5 is simple, by forming a part of the open slot 5 into the first air inlet 2 and forming another part of the open slot 5 into the first air outlet 3, the processing of the carrier plate 100 is facilitated while the communication between the first air inlet 2 and the first air outlet 3 is realized, which is beneficial to saving the manufacturing cost.

Optionally, a diversion slope 6 is arranged on the bottom wall of the open slot 5, and the diversion slope 6 gradually inclines towards the direction close to the bottom wall of the open slot 5 along the direction from the first air inlet 2 to the first air outlet 3.

As shown in fig. 4, by arranging the backflow inclined plane in the open slot 5, the compressed air entering through the first air outlet 3 is conveniently drained, so that the compressed air is quickly discharged through the first air outlet 3, and the working efficiency is improved.

In some embodiments, the carrying area 1 has a plurality of carrying areas 1, and the plurality of carrying areas 1 are arranged in a matrix.

For example, as shown in fig. 1, 3 and 5, the number of the carrying areas 1 is four, and the four carrying areas 1 are arranged at intervals along the length direction and the width direction of the carrier plate 100, however, the number of the carrying areas 1 can also be reasonably arranged according to specific use requirements.

In some embodiments, the carrier 100 has a groove 7 thereon, and the carrying area 1 is disposed in the groove 7.

For example, as shown in fig. 3, 5 and 7, the process reaction to the silicon wafer 300 is facilitated by disposing the carrier region 1 in the recess 7, that is, the silicon wafer 300 is also placed in the recess 7.

Optionally, a plurality of protrusions 8 are arranged at intervals on the bottom wall of the groove 7, and the protrusions 8 are used for supporting the silicon wafer 300.

As shown in fig. 7, the silicon wafer 300 is supported by the plurality of protrusions 8 arranged at intervals in the groove 7, so that the contact surface between the silicon wafer 300 and the bottom wall of the groove 7 can be effectively reduced, and the silicon wafer 300 and the bottom wall of the groove 7 are prevented from being adsorbed on the bottom wall of the groove due to overlarge contact area, thereby being beneficial to the sucker 200 to smoothly adsorb the silicon wafer 300 and further being beneficial to improving the working reliability.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

For purposes of this disclosure, the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While the above embodiments have been shown and described, it should be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives, and variations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the utility model.

Claims (9)

1. The carrier plate is characterized in that one side of the carrier plate (100) in the thickness direction is provided with a bearing area (1), the bearing area (1) is used for placing a silicon wafer (300), the carrier plate (100) is further provided with a first air inlet (2) and a first air outlet (3) which are communicated, and the first air outlet (3) is arranged in the bearing area (1) and is used for blowing air towards the silicon wafer (300) so that the silicon wafer (300) is separated from the carrier plate (100).

2. The carrier plate according to claim 1, characterized in that the first air inlet (2) is located on the same side of the carrier plate (100) as the carrying area (1), and that the first air inlet (2) is located outside the carrying area (1).

3. The carrier plate according to claim 2, wherein the carrier plate (100) is further provided with a gas channel (4), and the first gas inlet (2) and the first gas outlet (3) are communicated through the gas channel (4).

4. The carrier plate according to claim 2, characterized in that the carrier plate is provided with an open slot (5), a part of the open slot (5) is arranged in the carrying area (1) and forms the first air outlet (3), and another part of the open slot (5) is arranged outside the carrying area (1) and forms the first air inlet (2).

5. The carrier plate according to claim 4, wherein a diversion slope (6) is provided on the bottom wall of the open slot (5), and the diversion slope (6) is gradually inclined toward a direction approaching the bottom wall of the open slot (5) along a direction from the first air inlet (2) to the first air outlet (3).

6. Carrier plate according to claim 1, characterized in that the carrying area (1) has a plurality of carrying areas (1) arranged in a matrix.

7. Carrier plate according to any of claims 1-6, characterized in that the carrier plate (100) has a recess (7) thereon, the carrier region (1) being arranged in the recess (7).

8. Carrier plate according to claim 7, characterized in that a plurality of protrusions (8) are arranged at intervals on the bottom wall of the recess (7), the protrusions (8) being used for supporting the silicon wafer (300).

9. A transfer assembly, comprising:

a carrier plate (100), the carrier plate (100) being a carrier plate (100) according to any one of claims 1-8; and

sucking disc (9), sucking disc (9) are last have be used for adsorbing sucking disc (901) of silicon chip (300), sucking disc (9) are last still to have second air inlet (902) and second gas outlet (903) of intercommunication, when sucking disc (901) adsorb silicon chip (300) on the loading area (1), second gas outlet (903) with first air inlet (2) intercommunication.