CN214193440U

CN214193440U - Silicon wafer carrier plate for coating film on solar cell

Info

Publication number: CN214193440U
Application number: CN202022778197.5U
Authority: CN
Inventors: 蔡新兴; 孙铁囤; 姚伟忠; 杨宇城
Original assignee: Changzhou EGing Photovoltaic Technology Co Ltd
Current assignee: Changzhou EGing Photovoltaic Technology Co Ltd
Priority date: 2020-11-26
Filing date: 2020-11-26
Publication date: 2021-09-14
Anticipated expiration: 2030-11-26

Abstract

The utility model discloses a silicon chip support plate for coating film on a solar cell, which comprises a graphite plate and a support plate arranged at the top of the graphite plate, wherein the top of the support plate is provided with a first groove for placing a silicon chip, and the bottom of the first groove is provided with an air hole which is communicated with the upper end surface and the lower end surface of the bottom of the groove; the second recess has been seted up at the top of graphite cake, and the radial dimension of silicon chip > the radial dimension of second recess > the radial dimension of gas pocket, the second recess only communicates with the outside through the gas pocket, through this set of device, places the support plate that takes the gas pocket at the graphite cake top that is equipped with the second recess, and the air that exists does not influence silicon chip vacuum adsorption in the second recess of graphite cake, and the dust contacts this graphite cake completely and can not pollute current support plate when ejection of compact chamber returns the gas simultaneously.

Description

Silicon wafer carrier plate for coating film on solar cell

Technical Field

The utility model belongs to the technical field of solar cell production, a anti-pollution technique of the silicon chip of coating film on the solar cell is related to, specifically be a silicon chip support plate of coating film on the solar cell.

Background

The whole film coating needs to be carried out in a vacuum state, so that a carrier plate fully loaded silicon wafer firstly enters a feeding cavity, then is pumped into a vacuum state, then enters a process cavity film coating process, and then enters a discharging cavity, and the returned gas of the discharging cavity reaches an atmospheric pressure state and then is conveyed to an automatic loading and unloading machine through the unloading machine. At present, deposited SINx (or ALOx) is placed on the silicon wafer coating surface of a flat plate type upper coating machine table in an upward mode, grooves are formed in a carrier plate and used for placing silicon wafers, air holes are formed in the bottom of each small groove correspondingly, and the purpose that the silicon wafers are easily sucked by a vacuum chuck when the silicon wafers are automatically sucked up and down is mainly achieved. The air holes dug in the support plate facilitate automatic vacuum adsorption of the silicon wafer, but when the discharge cavity of the support plate runs, dust can be blown out from the lower part of the support plate along with air return of the cavity, and the dust is adsorbed on the lower surface (non-film-coated surface) of the silicon wafer through the small holes in the support plate, so that pollution is caused, and the appearance of the silicon wafer and the efficiency and yield of the cells are influenced.

SUMMERY OF THE UTILITY MODEL

In order to improve the support plate and have the dust to follow when ejection of compact chamber moves and blow off from the support plate below, adsorb at silicon chip lower surface (non-coating film face) via aperture on the support plate, cause the pollution, influence the silicon chip outward appearance and become the condition of piece battery piece efficiency yield, the utility model provides a silicon chip support plate of coating film on solar cell.

In order to realize the purpose, the utility model discloses a technical scheme is: a silicon wafer carrier plate for coating a film on a solar cell comprises a graphite plate and a carrier plate arranged at the top of the graphite plate, wherein a first groove for placing a silicon wafer is formed in the top of the carrier plate, and an air hole penetrating through the upper end face and the lower end face of the bottom of the first groove is formed in the bottom of the first groove; the top of the graphite plate is provided with a second groove, the radial size of the silicon wafer is larger than that of the second groove and larger than that of the air hole, and the second groove is communicated with the outside only through the air hole.

Furthermore, an annular notch is formed in the inner side of the top of the second groove, and the carrier plate is located in the annular notch.

Furthermore, the carrier plate is adhered to the graphite plate through a binder.

Furthermore, the support plate is connected with the graphite plate through a buckle.

Furthermore, the support plate is connected with the graphite plate through bolts and nuts made of graphite materials.

Compared with the prior art, the utility model discloses the technological effect who gains does: the support plate with the air holes is placed at the top of the graphite plate with the second groove, air in the second groove of the graphite plate does not influence vacuum adsorption of the silicon wafer, and dust completely contacts the graphite plate when air returns from the discharge cavity to avoid polluting the existing support plate.

Drawings

Fig. 1 is a schematic structural diagram of a carrier in the prior art.

Fig. 2 is a schematic diagram of a carrier plate according to the prior art, in which a first groove and an air hole are formed.

Fig. 3 is a schematic structural diagram of a silicon wafer carrier plate for coating a film on a solar cell according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a graphite plate of a silicon wafer carrier plate for coating a film on a solar cell according to an embodiment of the present invention.

The reference numbers in the figures are: 1. the graphite plate comprises a support plate, 2, a graphite plate, 3, a first groove, 4, an air hole, 5, a second groove and 6, an annular gap.

Detailed Description

The utility model discloses not confine the following embodiment to, general technical personnel in this field can adopt other multiple embodiment to implement according to the utility model discloses a, perhaps all adopt the utility model discloses a design structure and thinking do simple change or change, all fall into the utility model discloses a protection scope. It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The specific embodiment of the utility model is shown in fig. 3 and 4, a silicon wafer carrier plate 1 for coating film on a solar cell comprises a graphite plate 2 and a carrier plate 1 arranged on the top of the graphite plate 2, a first groove 3 for placing a silicon wafer is arranged on the top of the carrier plate 1, and an air hole 4 penetrating through the upper end surface and the lower end surface of the bottom of the first groove 3 is arranged on the bottom of the first groove 3; the top of the graphite plate 2 is provided with a second groove 5, the radial size of the silicon wafer is larger than the radial size of the second groove 5 and larger than the radial size of the air hole 4, and the second groove 5 is communicated with the outside only through the air hole 4.

Specifically, an annular gap 6 is arranged on the inner side of the top of the second groove 5, and the carrier plate 1 is located in the annular gap 6. The support plate 1 and the graphite plate 2 are fixedly connected relatively, and the selected connection mode can be that the support plate 1 is adhered to the graphite plate 2 through a binder, or the support plate 1 is connected to the graphite plate 2 through a buckle, or the support plate 1 is connected to the graphite plate 2 through bolts and nuts made of graphite materials.

The support plate 1 with the air holes 4 is placed on the top of the graphite plate 2 with the second grooves 5, air in the second grooves 5 of the graphite plate 2 does not affect vacuum adsorption of silicon wafers, and dust completely contacts the graphite plate 2 when returning air in the discharging cavity to avoid polluting the existing support plate 1.

The above description is only the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the concept of the present invention within the technical scope disclosed in the present invention.

Claims

1. A silicon chip carrier plate for coating a film on a solar cell is characterized in that: the silicon wafer loading device comprises a graphite plate (2) and a carrier plate (1) arranged at the top of the graphite plate (2), wherein a first groove (3) for placing a silicon wafer is formed in the top of the carrier plate (1), and an air hole (4) penetrating through the upper end face and the lower end face of the bottom of the groove is formed in the bottom of the first groove (3); the top of the graphite plate (2) is provided with a second groove (5), the radial size of the silicon wafer is larger than that of the second groove (5) and larger than that of the air hole (4), and the second groove (5) is communicated with the outside only through the air hole (4).

2. The silicon wafer carrier plate coated on the solar cell according to claim 1, wherein: the inner side of the top of the second groove (5) is provided with an annular gap (6), and the carrier plate (1) is located in the annular gap (6).

3. The silicon wafer carrier plate coated on the solar cell according to claim 1, wherein: the carrier plate (1) is adhered to the graphite plate (2) through a bonding agent.

4. The silicon wafer carrier plate coated on the solar cell according to claim 1, wherein: the support plate (1) is connected with the graphite plate (2) through a buckle.

5. The silicon wafer carrier plate coated on the solar cell according to claim 1, wherein: the support plate (1) is connected with the graphite plate (2) through bolts and nuts made of graphite materials.