CN216698318U - Carrier of wafer air-floating type grid disc for copper plating - Google Patents
Carrier of wafer air-floating type grid disc for copper plating Download PDFInfo
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- CN216698318U CN216698318U CN202123101964.XU CN202123101964U CN216698318U CN 216698318 U CN216698318 U CN 216698318U CN 202123101964 U CN202123101964 U CN 202123101964U CN 216698318 U CN216698318 U CN 216698318U
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Abstract
The utility model discloses a carrier of a grid tray for wafer air-floating type copper plating, which comprises an objective table, wherein hydraulic rods are fixedly connected to four corners of the bottom of the objective table, two air floating machines are fixedly connected into a groove in the bottom of the objective table, and a first limiting plate is fixedly connected to the front end of the top of the objective table. According to the air floatation machine, the threaded ring is arranged on the outer diameter of the air inlet, the threaded ring is convenient to mount an air inlet pipeline, the air leakage phenomenon is avoided, air is conveyed into the air floatation machine through the air inlet, the machine body is enabled to be slightly suspended, goods of a ton can be suspended by the air floatation machine, the conveyed goods are large in batch, after the air floatation machine is suspended, a worker directly pushes the machine body, after the air floatation machine is suspended, the contact between the machine body and the ground can be greatly reduced, the pushing-up is more convenient, the air floatation machine is a dual-purpose machine body, the use range is wide, manual use can be greatly saved, and the air floatation machine is worthy of being widely popularized.
Description
Technical Field
The utility model relates to the technical field of carriers, in particular to a carrier of a grid plate for wafer air-floating type copper plating.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent.
Chinese patent document 202022673149.X discloses a carrier, which includes a base, a workpiece mount, and a follower. The base has a recess. The workpiece mounting seat is arranged in the groove in a sliding mode along the first direction. The follower is disposed at one side of the workpiece mount along the first direction. Through the cooperation of the follower and the positioning assembly of the assembling equipment, the position of the work mounting seat for bearing the workpiece in the first direction can be adjusted, so that the positioning accuracy in the assembling process is improved. Therefore, the quality of the product can be effectively improved. The patent does not have the air-floating type transportation function, the transportation cargo quantity is less, and the application range is smaller.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a wafer air-floating type carrier for a grid disc for copper plating.
In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides a carrier of net dish for wafer air supporting formula copper facing, includes the objective table, the equal fixedly connected with hydraulic stem in objective table bottom four corners position, two air supporting machines of fixedly connected with in the recess of objective table bottom, two air supporting machine front end intermediate position runs through and fixedly connected with air inlet, the first limiting plate of objective table top front end position fixedly connected with, first limiting plate left and right sides intermediate position all runs through and threaded connection has first bolt, objective table top rear end position fixedly connected with second limiting plate, second limiting plate left and right sides intermediate position all runs through and threaded connection has the second bolt, objective table top right side position fixedly connected with baffle, baffle right side top position fixedly connected with pushes away the handle, push away the external diameter intermediate position fixedly connected with protection pad.
As a further description of the above technical solution:
and the outer diameter of the hydraulic rod is provided with a damping spring.
As a further description of the above technical solution:
and the bottoms of the four hydraulic rods are rotatably connected with traveling wheels.
As a further description of the above technical solution:
and the outer diameter of the two air inlets is provided with a threaded ring.
As a further description of the above technical solution:
the front ends of the two first bolts are fixedly connected with a first rotating handle.
As a further description of the above technical solution:
and the rear ends of the two first bolts are fixedly connected with a first L-shaped fixer.
As a further description of the above technical solution:
and the rear ends of the two second bolts are fixedly connected with a second rotating handle.
As a further description of the above technical solution:
and the front ends of the two second bolts are fixedly connected with a second L-shaped fixer.
The utility model has the following beneficial effects:
1. according to the utility model, firstly, when the wafer carrying device is used, a wafer is placed above the carrying platform, when more wafers are available, the rotating handles on two sides can be rotated, the rotating handles and the limiting plates are in a threaded effect, the rotating handles push the L-shaped fixer at one end to fix the wafer, the phenomenon of falling in the transportation process is prevented, the wafer is prevented from being damaged, the pushing handles can be pushed to push the whole vehicle body to be transported, the damping spring is arranged on the outer diameter of the hydraulic rod, the shaking condition in the transportation process can be prevented, and the wafer above the carrying platform is effectively protected.
2. According to the air floatation device, the two air floatation machines are arranged in the groove in the bottom of the object stage, the air inlet is formed in the middle of the front end of each air floatation machine, the threaded ring is arranged on the outer diameter of the air inlet, the threaded ring is convenient to mount an air inlet pipeline, the air leakage phenomenon is avoided, air is conveyed into the air floatation machines through the air inlets, then the vehicle body is slightly suspended, the air floatation machines can suspend goods of the top ton, the transported goods are large in batch, after the goods are suspended, workers can directly push the vehicle body, after the goods are suspended, the contact between the vehicle body and the ground can be greatly reduced, the vehicle body is more portable when the goods are pushed up, the air floatation device is a dual-purpose vehicle body, the application range is wide, the manual use can be greatly saved, and the air floatation device is worthy of being widely popularized.
Drawings
FIG. 1 is a perspective view of a wafer carrier for an air-floating copper-plating grid tray according to the present invention;
FIG. 2 is a bottom perspective view of a wafer air-floating grid tray for copper plating in accordance with the present invention;
FIG. 3 is a front view of a wafer carrier with air-floating grid plates for copper plating according to the present invention.
Illustration of the drawings:
1. an object stage; 2. a first limit plate; 3. a first bolt; 4. a first rotating handle; 5. a first L-shaped retainer; 6. a traveling wheel; 7. a hydraulic lever; 8. a damping spring; 9. a second limiting plate; 10. a second bolt; 11. a second rotating handle; 12. a second L-shaped retainer; 13. a baffle plate; 14. a push handle; 15. a pad; 16. an air inlet; 17. an air flotation machine; 18. and (4) a thread ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, one embodiment of the present invention is provided: a carrier of a grid plate for wafer air-floating type copper plating comprises an object stage 1, hydraulic rods 7 are fixedly connected to four corners of the bottom of the object stage 1, two air floating machines 17 are fixedly connected to a groove in the bottom of the object stage 1, air inlets 16 are fixedly connected to the middle positions of the front ends of the two air floating machines 17 in a penetrating manner, a first limiting plate 2 is fixedly connected to the front position of the top of the object stage 1, first bolts 3 are respectively connected to the middle positions of the left side and the right side of the first limiting plate 2 in a penetrating manner and in a threaded manner, a second limiting plate 9 is fixedly connected to the rear position of the top of the object stage 1, second bolts 10 are respectively connected to the middle positions of the left side and the right side of the second limiting plate 9 in a penetrating manner and in a threaded manner, a baffle 13 is fixedly connected to the right side of the top of the object stage 1, a pushing handle 14 is fixedly connected to the middle position of the outer diameter of the pushing handle 15, a wafer is placed above the object stage 1, when the wafer is more, can be through the rotation handle that rotates both sides, it is screw thread effect with the limiting plate to rotate the handle, it fixes the wafer to rotate the L type fixer that the handle promoted one end, prevent the phenomenon that drops from appearing in the transportation on the way, avoid the wafer to damage, can promote to push away 14, promote the transportation with whole automobile body, the hydraulic stem external diameter is provided with damping spring, can prevent the condition that rocks from appearing in the transportation on the way, the effectual wafer of having protected objective table 1 top.
The outer diameter of a hydraulic rod 7 is provided with a damping spring 8, the bottoms of four hydraulic rods 7 are rotatably connected with travelling wheels 6, the outer diameters of two air inlets 16 are provided with threaded rings 18, the front ends of two first bolts 3 are fixedly connected with a first rotating handle 4, the rear ends of the two first bolts 3 are fixedly connected with a first L-shaped fixer 5, the rear ends of two second bolts 10 are fixedly connected with a second rotating handle 11, the front ends of the two second bolts 10 are fixedly connected with a second L-shaped fixer 12, two air floaters 17 are arranged in a groove at the bottom of an objective table 1, the middle position at the front end of each air floater17 is provided with an air inlet 16, the outer diameter of each air inlet 16 is provided with a threaded ring 18, the threaded rings 18 are convenient to install an air inlet pipeline, the phenomenon of air leakage is avoided, air is conveyed into the air floaters 17 through the air inlets 16, and then a vehicle body is slightly suspended, the air supporting machine can suspend the goods of the upper ton, the transported goods are large in batch, after the goods are suspended, workers directly push the vehicle body, after the goods are suspended, the contact between the vehicle body and the ground can be greatly reduced, the goods are more portable after being pushed, the air supporting machine is a dual-purpose vehicle body, the application range is wide, and the manual use can be greatly saved.
The working principle is as follows: when the air floatation type wafer transportation device is used, a wafer is placed above the objective table 1, when more wafers are available, the rotation handles on two sides can be rotated, the rotation handles and the limiting plates are in threaded action, the rotation handles push the L-shaped fixer at one end to fix the wafer, the phenomenon of falling in the transportation process is prevented, the wafer is prevented from being damaged, the push handle 14 can be pushed to push the whole vehicle body to be transported, the damping spring is arranged on the outer diameter of the hydraulic rod, the shaking condition in the transportation process can be prevented, the wafer above the objective table 1 is effectively protected, two air floatation machines 17 are arranged in a groove at the bottom of the objective table 1, an air inlet 16 is arranged in the middle position of the front end of each air floatation machine 17, a threaded ring 18 is arranged on the outer diameter of each air inlet 16, the threaded rings 18 are convenient to install an air inlet pipeline, the phenomenon of air leakage is also avoided, and air is conveyed into the air floatation machines 17 through the air inlets 16, then the vehicle body is slightly suspended, the air floatation machine can suspend goods of the upper ton, the transported goods are large in batch, after the goods are suspended, workers directly push the vehicle body, after the goods are suspended, the contact between the vehicle body and the ground can be greatly reduced, the goods are more convenient to push, the equipment is a dual-purpose vehicle body, the application range is wider, and the manual use can be greatly saved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still make modifications to the technical solutions described in the foregoing embodiments, or make equivalent substitutions and improvements to part of the technical features of the foregoing embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a wafer air supporting formula carrier of grid dish for copper facing, includes objective table (1), its characterized in that: the hydraulic rod (7) is fixedly connected to the positions of four corners at the bottom of the objective table (1), two air floating machines (17) are fixedly connected to the inner side of a groove at the bottom of the objective table (1), the middle positions of the front ends of the air floating machines (17) penetrate through and are fixedly connected with an air inlet (16), a first limiting plate (2) is fixedly connected to the front position of the top of the objective table (1), first bolts (3) are respectively penetrated through and are in threaded connection with the middle positions of the left side and the right side of the first limiting plate (2), a second limiting plate (9) is fixedly connected to the rear position of the top of the objective table (1), second bolts (10) are respectively penetrated through and are in threaded connection with the middle positions of the left side and the right side of the second limiting plate (9), a baffle (13) is fixedly connected to the right side of the top of the objective table (1), a pushing handle (14) is fixedly connected to the top position of the right side of the baffle (13), a protection pad (15) is fixedly connected to the middle position of the outer diameter of the push handle (14).
2. The carrier of wafer air-floating grid tray for copper plating according to claim 1, wherein: and a damping spring (8) is arranged on the outer diameter of the hydraulic rod (7).
3. The carrier of wafer air-floating grid tray for copper plating according to claim 1, wherein: the bottom of the four hydraulic rods (7) is rotatably connected with a traveling wheel (6).
4. The carrier of wafer air-floating grid tray for copper plating according to claim 1, wherein: the outer diameter of the two air inlets (16) is provided with a thread ring (18).
5. The carrier of wafer air-floating grid tray for copper plating according to claim 1, wherein: the front ends of the two first bolts (3) are fixedly connected with a first rotating handle (4).
6. The carrier of wafer air-floating grid tray for copper plating according to claim 1, wherein: the rear ends of the two first bolts (3) are fixedly connected with a first L-shaped fixer (5).
7. The carrier of wafer air-floating grid tray for copper plating according to claim 1, wherein: and the rear end positions of the two second bolts (10) are fixedly connected with a second rotating handle (11).
8. The carrier of wafer air-floating grid tray for copper plating according to claim 1, wherein: and the front ends of the two second bolts (10) are fixedly connected with a second L-shaped fixer (12).
Priority Applications (1)
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CN202123101964.XU CN216698318U (en) | 2021-12-06 | 2021-12-06 | Carrier of wafer air-floating type grid disc for copper plating |
Applications Claiming Priority (1)
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CN202123101964.XU CN216698318U (en) | 2021-12-06 | 2021-12-06 | Carrier of wafer air-floating type grid disc for copper plating |
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CN216698318U true CN216698318U (en) | 2022-06-07 |
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CN202123101964.XU Active CN216698318U (en) | 2021-12-06 | 2021-12-06 | Carrier of wafer air-floating type grid disc for copper plating |
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2021
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