CN216264095U - Special equipment for nondestructive cutting of crystalline silicon wafer - Google Patents
Special equipment for nondestructive cutting of crystalline silicon wafer Download PDFInfo
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- CN216264095U CN216264095U CN202122541901.XU CN202122541901U CN216264095U CN 216264095 U CN216264095 U CN 216264095U CN 202122541901 U CN202122541901 U CN 202122541901U CN 216264095 U CN216264095 U CN 216264095U
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Abstract
The utility model provides a special device for cutting a crystalline silicon wafer without damage, which belongs to the technical field of crystalline silicon, the special equipment for nondestructively cutting the crystal silicon wafer comprises a placing table, a laser installation seat plate is arranged at the upper end of the placing table, a conveying line supporting plate is arranged at the upper end of the laser installation seat plate, when the silicon wafer is required to be processed and cut, the silicon wafer can be placed in the material box and then is transmitted to the induction position of the material lifting cylinder and the carrying platform through the belt, at the moment, the in-place detection of the material box can start the stepping screw motor to lift the lifting plate to the material detection correlation position when sensing the existence of the silicon chip, then the silicon chip can be cut through the laser transverse moving module, the laser mounting seat plate and the laser module, the silicon chip can be cut completely and automatically through the mode, the device has fewer structures, is beneficial to subsequent maintenance, and improves the cutting precision of the silicon wafer.
Description
Technical Field
The utility model belongs to the technical field of crystalline silicon, and particularly relates to special equipment for nondestructive cutting of a crystalline silicon wafer.
Background
The crystalline silicon material is the most main photovoltaic material, and has the properties of grey black solid with metal luster, high melting point (1410), high hardness, brittleness and inactive chemical property at normal temperature. The market share is more than 90%, and the solar cell is still the mainstream material of the solar cell for a long time in the future.
In modern society, high-tech manufacturing does not leave the crystal silicon wafer, and the crystal silicon wafer needs to be cut during manufacturing, but when the crystal silicon wafer is cut by the existing cutting device, the cutting and feeding automaticity is insufficient, the cutting accuracy is insufficient, and further the cutting quality of the crystal silicon wafer is insufficient.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide special equipment for cutting a crystal silicon wafer without damage, and aims to solve the problems that when a cutting device in the prior art is used for cutting the crystal silicon wafer, the cutting and feeding automation is insufficient, the cutting accuracy is insufficient, and the cutting quality of the crystal silicon wafer is further insufficient.
In order to achieve the purpose, the utility model provides the following technical scheme:
a special equipment for nondestructively cutting a crystalline silicon wafer comprises:
the device comprises a placing table, wherein a laser installation seat plate is arranged at the upper end of the placing table, a conveying line supporting plate is arranged at the upper end of the laser installation seat plate, a material box and a belt are arranged at the upper end of the conveying line supporting plate, and a silicon wafer is arranged at the upper end of the material box;
the laser installation seat plate comprises a laser installation seat plate, a feeding lifting cylinder, a placing table and a feeding lifting cylinder, wherein the feeding lifting cylinder is arranged at the lower end of the laser installation seat plate, the lower end of the laser installation seat plate is provided with a carrying table inductor, the upper end of the placing table is provided with a lifting plate, the upper end of the lifting plate is provided with a material box in-place detection device and a stepping screw rod motor, the lower end of the placing table is provided with a conveying line transmission motor, the conveying line transmission motor is connected with a belt, and the upper end of a conveying line supporting plate is provided with a material detection correlation; and
the cylinder backup pad, the one end of laser installation bedplate is located to the cylinder backup pad, the one end of cylinder backup pad is equipped with the sideslip module, the one end of sideslip module is equipped with the material loading sucking disc, the upper end of sideslip module is equipped with the cutting microscope carrier, the one end of laser installation bedplate is equipped with laser sideslip module and laser module, the upper end of placing the platform is equipped with the cutting module.
According to a preferable scheme of the utility model, one end of the traverse module is provided with a cylinder with a guide rod, one end of the laser installation seat plate is provided with a blanking sucker, and the lower end of the traverse module is provided with a material collecting box.
As a preferable scheme of the utility model, a material pouring groove is arranged at one end of the laser installation seat plate, and a positioning blocking cylinder 1 and a positioning blocking cylinder 2 are arranged at the upper end of the lifting plate.
As a preferable scheme of the present invention, one end of the laser installation seat plate is provided with a display screen.
As a preferable scheme of the utility model, the upper end of the material box is provided with a plurality of limiting upright posts and vertical plates.
As a preferable scheme of the present invention, universal wheels are provided at four corners of the lower end of the placing table.
Compared with the prior art, the utility model has the beneficial effects that:
1. in this scheme, when needs process the cutting to the silicon chip, can place it in the magazine, then transmit it to material lift cylinder and microscope carrier response department position through the belt, at this moment the magazine targets in place and examines the existence of knowing the silicon chip and just can start step screw motor and make it with the lifter plate jacking to the material detect correlation department, then through laser sideslip module, laser installation bedplate and laser module alright cutting with the silicon chip, make the silicon chip can obtain automatic cutting completely through such mode, and the structure of this device is less, do benefit to the follow-up maintenance, and improve the cutting precision of silicon chip.
2. In this scheme, when in actual use, can set up each part of placing the bench end into two sets ofly, and then make the machining efficiency of this device obtain enlarging to make the cost reduction of processing, and then improve the production speed of mill.
3. In this scheme to after the silicon chip cutting finishes, the silicon chip on the cutting microscope carrier can also be grabbed through the unloading sucking disc that takes the guide arm cylinder to connect to complete article, and make it place in the material collecting box, and then improve this device collect the convenience.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a perspective view of the present invention;
fig. 2 is a rear view of the present invention.
In the figure: 1. a silicon wafer; 2. a vertical plate of a limiting upright post; 3. a magazine; 4. a conveyor line support plate; 5. a belt; 6. a material receiving box; 7. a feeding lifting cylinder; 8. a feeding sucker; 9. a transverse moving module; 10. a cylinder support plate; 11. a cylinder with a guide rod; 12. cutting the carrying platform; 13. blanking sucker; 14. cutting the module; 15. a material pouring groove; 16. detecting and shooting the materials; 17. detecting the in-place of the material box; 18. positioning the blocking cylinder 1; 19. positioning the blocking cylinder 2; 20. a lifting plate; 21. a step screw motor; 22. a laser transverse moving module; 23. a laser mounting base plate; 24. a display screen; 25. a laser module; 26. carrying platform induction; 27. transfer chain transmission motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-2, the present invention provides the following technical solutions:
a special equipment for nondestructively cutting a crystalline silicon wafer comprises:
the device comprises a placing table, wherein a laser installation seat plate 23 is arranged at the upper end of the placing table, a conveying line support plate 4 is arranged at the upper end of the laser installation seat plate 23, a material box 3 and a belt 5 are arranged at the upper end of the conveying line support plate 4, and a silicon wafer 1 is arranged at the upper end of the material box 3;
the laser installation base plate comprises a laser installation base plate 23, a loading lifting cylinder 7, a loading platform induction 26, a lifting plate 20, a material box in-place detection 17 and a stepping screw motor 21, wherein the loading lifting cylinder 7 is arranged at the lower end of the laser installation base plate 23, the lower end of the laser installation base plate 23 is provided with a loading platform induction 26, the upper end of a placing platform is provided with the lifting plate 20, the upper end of the lifting plate 20 is provided with the material box in-place detection 17 and the stepping screw motor 21, the lower end of the placing platform is provided with a conveying line transmission motor 27, the conveying line transmission motor 27 is connected with a belt 5, and the upper end of a conveying line supporting plate 4 is provided with a material detection correlation 16; and
In the specific embodiment of the utility model, when the silicon wafer 1 needs to be cut, the silicon wafer 1 can be placed in the material box 3; and the material box 3 is placed on the conveying line supporting plate 4 to be fed to the position of the material lifting cylinder 7 and the carrier induction 26 through the belt 5; at this time, after the material box in-place detector 17 detects the material box 3, the material box 3 is lifted to the position of the material detection correlation 16 by starting the stepping screw motor 21 and the conveying line transmission motor 27; at this moment, the transverse moving module 9 is started to drive the cylinder supporting plate 10 and the feeding sucker 8 to adsorb the silicon wafer 1 to the upper end of the cutting carrying platform 12, then the laser transverse moving module 22 of the laser installation base plate 23 is started, the laser module 25 and the cutting module 14 can be cut for the silicon wafer 1, the cutting of the silicon wafer 1 is more automatic through the design, the cutting precision of the silicon wafer 1 can be improved through the automation, the cutting quality of the silicon wafer 1 is better, the produced product is more perfect, the parts can be arranged into two groups, and the processing yield of parts is improved.
Specifically referring to fig. 2, one end of the traverse module 9 is provided with a cylinder 11 with a guide rod, one end of the laser mounting seat plate 23 is provided with a blanking suction cup 13, and the lower end of the traverse module 9 is provided with a material receiving box 6.
In this embodiment: and after the silicon chip 1 is cut, the complete product can also grab the silicon chip 1 on the cutting carrier 12 through the blanking sucker 13 connected with the guide rod cylinder 11, and the complete product is placed in the material receiving box 6, so that the collecting convenience of the device is improved.
Specifically referring to fig. 2, a material pouring slot 15 is disposed at one end of the laser installation seat plate 23, and a positioning blocking cylinder 118 and a positioning blocking cylinder 219 are disposed at the upper end of the lifting plate 20.
In this embodiment: the waste material can be discharged through the material pouring groove 15 after the silicon wafer 1 is cut, and the position can be adjusted when the silicon wafer 1 is sucked to the cutting carrying platform 12 through the positioning blocking cylinder 118 and the positioning blocking cylinder 219.
Specifically referring to fig. 1, one end of the laser installation seat plate 23 is provided with a display screen 24, the upper end of the material box 3 is provided with a plurality of limiting upright posts and vertical plates 2, and four corners of the lower end of the placing table are provided with universal wheels.
In this embodiment: can carry out real-time supervision to the cutting route through display screen 24, can be so that putting of silicon chip 1 more stable through spacing stand riser 2 to can carry out swift propelling movement with this device through the universal wheel.
The working principle and the using process of the utility model are as follows: when the silicon wafer 1 needs to be cut, the silicon wafer 1 can be placed in the material box 3; and the material box 3 is placed on the conveying line supporting plate 4 to be fed to the position of the material lifting cylinder 7 and the carrier induction 26 through the belt 5; at this time, after the material box in-place detector 17 detects the material box 3, the material box 3 is lifted to the position of the material detection correlation 16 by starting the stepping screw motor 21 and the conveying line transmission motor 27; at this time, the transverse moving module 9 is started to drive the cylinder supporting plate 10 and the feeding sucker 8 to adsorb the silicon wafer 1 to the upper end of the cutting carrying platform 12, and then the laser mounting base plate 23, the laser transverse moving module 22, the laser module 25 and the cutting module 14 are started to cut the silicon wafer 1.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A special device for nondestructively cutting a crystalline silicon wafer is characterized by comprising:
the device comprises a placing table, wherein a laser installation seat plate (23) is arranged at the upper end of the placing table, a conveying line supporting plate (4) is arranged at the upper end of the laser installation seat plate (23), a material box (3) and a belt (5) are arranged at the upper end of the conveying line supporting plate (4), and a silicon wafer (1) is arranged at the upper end of the material box (3);
the automatic feeding device comprises a feeding lifting cylinder (7), wherein the feeding lifting cylinder (7) is arranged at the lower end of a laser installation seat plate (23), a carrying platform induction (26) is arranged at the lower end of the laser installation seat plate (23), a lifting plate (20) is arranged at the upper end of a placing platform, a magazine in-place detection device (17) and a stepping screw motor (21) are arranged at the upper end of the lifting plate (20), a conveying line transmission motor (27) is arranged at the lower end of the placing platform, the conveying line transmission motor (27) is connected with a belt (5), and a material detection correlation (16) is arranged at the upper end of a conveying line supporting plate (4); and
the cylinder supporting plate (10), the one end of laser installation bedplate (23) is located in cylinder supporting plate (10), the one end of cylinder supporting plate (10) is equipped with sideslip module (9), the one end of sideslip module (9) is equipped with material loading sucking disc (8), the upper end of sideslip module (9) is equipped with cutting microscope carrier (12), the one end of laser installation bedplate (23) is equipped with laser sideslip module (22) and laser module (25), the upper end of placing the platform is equipped with cutting module (14).
2. The special equipment for nondestructive cutting of crystalline silicon wafers as claimed in claim 1 wherein one end of the traverse module (9) is provided with a cylinder (11) with a guide rod, one end of the laser mounting seat plate (23) is provided with a blanking suction cup (13), and the lower end of the traverse module (9) is provided with a material receiving box (6).
3. The special equipment for nondestructive cutting of crystalline silicon wafers as claimed in claim 2 wherein said laser mounting base plate (23) is provided at one end with a material pouring chute (15), and said elevating plate (20) is provided at its upper end with a positioning block cylinder 1 (18) and a positioning block cylinder 2 (19).
4. The special equipment for the nondestructive cutting of the crystalline silicon wafer as claimed in claim 3, wherein one end of the laser mounting seat plate (23) is provided with a display screen (24).
5. The special equipment for the nondestructive cutting of the crystalline silicon wafer as claimed in claim 4, wherein the upper end of the magazine (3) is provided with a plurality of limiting upright risers (2).
6. The special equipment for nondestructive cutting of crystalline silicon wafers as claimed in claim 5, wherein universal wheels are provided at four corners of the lower end of the placing table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122541901.XU CN216264095U (en) | 2021-10-21 | 2021-10-21 | Special equipment for nondestructive cutting of crystalline silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122541901.XU CN216264095U (en) | 2021-10-21 | 2021-10-21 | Special equipment for nondestructive cutting of crystalline silicon wafer |
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| Publication Number | Publication Date |
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| CN216264095U true CN216264095U (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122541901.XU Active CN216264095U (en) | 2021-10-21 | 2021-10-21 | Special equipment for nondestructive cutting of crystalline silicon wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114769891A (en) * | 2022-04-28 | 2022-07-22 | 深圳泰德半导体装备有限公司 | Wafer marking apparatus |
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2021
- 2021-10-21 CN CN202122541901.XU patent/CN216264095U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114769891A (en) * | 2022-04-28 | 2022-07-22 | 深圳泰德半导体装备有限公司 | Wafer marking apparatus |
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